Granted Patent B2

US 10,403,465 · App. 16/027,200 · Granted Sep 3, 2019

Abstract

Claims (51)

1. A vacuum device, comprising:

an enclosure configured to enclose a vacuum, comprising an external base forming at least a portion of the enclosure;

an internal base within the enclosure; and

at least one thermal dissipative strap assembly, comprising:

an internal base thermal conductive base in contact with the internal base;

an external base thermal conductive base in contact with the external base; and

a flexible thermal dissipative strap disposed such that the flexible thermal dissipative strap is disposed in the vacuum when the vacuum is formed and coupling the internal base thermal conductive base to the external base thermal conductive base.

2. The vacuum device of claim 1 , wherein the internal base includes at least one recess configured to receive the internal base thermal conductive base or the external base includes at least one recess configured to receive the external base thermal conductive base.

3. The vacuum device of claim 1 , wherein the flexible thermal dissipative strap includes a bent flat, round, cylindrical, or ellipsoid shaped metal structure.

4. The vacuum device of claim 1 , wherein a thermal conductivity of the internal base thermal conductive base is greater than a thermal conductivity of the internal base, or the thermal conductivity of the external base thermal conductive base is greater than a thermal conductivity of the external base, or the flexible thermal dissipative strap thermal conductivity is greater than the thermal conductivity of the support structure.

5. The vacuum device of claim 1 , wherein the at least one thermal dissipative strap assembly includes vacuum compatible materials with a maximum total mass loss (TML) of less than 1% and a collected volatile condensable materials (CVCM) from outgassing of less than 0.1% of starting materials at 398 K (125° C.) for at least 24 hours.

6. The vacuum device of claim 1 , wherein the at least one thermal dissipative strap assembly includes oxygen-free copper (OFC), oxygen-free electronic (OFE) copper, or oxygen-free high thermal conductivity (OFHC) copper.

7. The vacuum device of claim 1 , further comprising:

a thermal conductive base fastener coupling the internal base thermal conductive base to the internal base or coupling the external base thermal conductive base to the external base.

8. The vacuum device of claim 1 , further comprising:

at least one cathode assembly component supported by the internal base.

9. The vacuum device of claim 8 , wherein the at least one cathode assembly component includes a focus electrode or cathode.

10. The vacuum device of claim 1 , wherein the external base includes a heat sink on an opposite surface to a surface where the external base thermal conductive base makes contact with the external base.

11. The vacuum device of claim 1 , wherein the vacuum device includes an electron gun, a sheet beam klystron, a round beam klystron, a multi-beam klystron, a relativistic klystron, a traveling wave tube, a gyrotron, a free electron laser, an electron microscope, an inductive output tube, or a linear accelerator.

12. The vacuum device of claim 1 , further comprising an adjustable support assembly adjustably coupling the internal base to the external base and extending through an opening in the external base, the adjustable support assembly comprising:

a threaded shaft extending along a longitudinal axis and coupled to the internal base;

a threaded hole component threadedly engaged with the threaded shaft and coupled to the external base such that the threaded hole component is axially constrained in a direction along the longitudinal axis relative to the external base independent of the threaded shaft; and

a flexible component coupled to the external base and the threaded shaft and sealing the opening.

13. A vacuum device, comprising:

an enclosure configured to enclose a vacuum;

an internal base within the enclosure;

a plurality of support assemblies penetrating the enclosure and contacting the internal base; and

a plurality of thermal dissipative strap assemblies, each thermal dissipative strap assembly comprising:

an internal base thermal conductive base in contact with the internal base;

an enclosure thermal conductive base in contact with the enclosure; and

a flexible thermal dissipative strap coupling the internal base thermal conductive base to the enclosure thermal conductive base;

wherein the internal base thermal conductive bases of the thermal dissipative strap assemblies are disposed on the internal base among contact locations of the support assemblies to the internal base.

14. The vacuum device of claim 13 , each of the contact locations of the support assemblies to the internal base is adjacent to a corresponding one of the internal base thermal conductive bases.

15. The vacuum device of claim 13 , each of the contact locations of the support assemblies to the internal base is adjacent to a corresponding two of the internal base thermal conductive bases.

16. The vacuum device of claim 13 , wherein:

the support assemblies comprise three support assemblies configured to provide a three-point column structure for the internal base; and

the thermal dissipative strap assemblies comprise three thermal dissipative strap assemblies.

17. The vacuum device of claim 13 , wherein:

the support assemblies comprise three support assemblies configured to provide a three-point column structure for the internal base;

the thermal dissipative strap assemblies comprise six thermal dissipative strap assemblies; and

two of the thermal dissipative strap assemblies are disposed between each pair of the three support assemblies.

18. The vacuum device of claim 13 , wherein:

the enclosure comprises an external base forming at least a portion of the enclosure; and

the enclosure thermal conductive base is an external base thermal conductive base disposed on the external base.

19. A vacuum device, comprising:

means for enclosing a vacuum;

means for generating heat disposed within the means for enclosing the vacuum;

means for supporting the means for generating heat; and

means for reducing the heat conducted to the means for enclosing the vacuum through the means for supporting the means for generating heat.

20. The vacuum device of claim 19 , further comprising:

means for dissipating heat disposed on a surface of the means for enclosing the vacuum opposite to a surface of the means for enclosing the vacuum contacting the means for reducing the heat conducted to the means for enclosing the vacuum.

Assignments (8)