Thermally robust nozzle for 3-dimensional printing and methods of using same
For conditioning build material for fused filament fabrication, thermal power is both added to and removed from a nozzle in a manner that can reduce sensitivity of the nozzle temperature to fluctuations in build material feed rate. The amount of thermal power added is at least as large as the sum of the amount removed, the amount to condition the material, and losses to the environment. The amount removed may be at least as large as half the thermal power required to condition the material to extrusion temperature, and may be comparable to, or much larger than the conditioning amount. The larger the ratio of the amount removed to the conditioning amount, the less sensitive the nozzle temperature will be to fluctuations in build material feed rate. Fine temperature control arises, enabling building with metal-containing multi-phase materials or other materials that have a narrow working temperature range.
1. A method for conditioning a metal-containing multi-phase (MCMP) build material within a bore of a nozzle, the nozzle defining an inlet and an outlet and the bore therebetween, through which the build material passes from the inlet to the outlet, the build material having a working temperature range that includes a first temperature for mechanically driving the build material into the inlet and a second, greater temperature, for extruding the build material out from the outlet, there being an amount of thermal power required to condition build material passing through the nozzle to the second temperature, this amount being a conditioning amount of thermal power, the method comprising:
a. providing a quantity of build material within the nozzle;
b. removing a first amount of thermal power from the nozzle near the inlet, the first amount of thermal power being at least half of the conditioning amount of thermal power; and
c. adding a second amount of thermal power to the nozzle near the outlet, which second amount of thermal power is greater than sum of the first amount of thermal power and the conditioning amount of thermal power.
2. The method of claim 1 , the step of removing a first amount of thermal power comprising removing a first amount of thermal power, the first amount of thermal power being at least as large as the conditioning amount of thermal power.
3. The method of claim 1 , the step of removing a first amount of thermal power comprising removing a first amount of thermal power, the first amount of thermal power being at least twice as large as the conditioning amount of thermal power.
4. The method of claim 1 , further comprising a step of measuring the temperature of the nozzle at the outlet, the step of adding a second amount of thermal power comprising, adding a second amount of thermal power, the second amount of thermal power determined in part based on the measured outlet temperature such that the temperature of the nozzle at the outlet is at least as large as the second temperature.
5. The method of claim 4 , further comprising a step of measuring the temperature of the inlet of the nozzle, the step of removing an amount of thermal power comprising, removing an amount of thermal power, the amount determined in part based on the measured inlet temperature such that the temperature of the nozzle at the inlet is less than or equal to the first temperature.
6. The method of claim 1 , the step of removing an amount of thermal power comprising thermally coupling a flowing coolant fluid near the inlet.
7. The method of claim 1 , the build material comprising a metal alloy that exhibits a multi-phase equilibrium between a solid phase and a liquid phase and which is characterizeable by a phase diagram having a solidus temperature and a liquidus temperature, the step of providing build material comprising providing build material having a composition that assumes a multi-phase condition at temperatures between the solidus temperature and the liquidus temperature.
8. The method of claim 1 , the MCMP material comprising an alloy that is characterized by a phase diagram that exhibits a eutectic phase.
9. The method of claim 1 , the MCMP material comprising an alloy that is characterized by a phase diagram that exhibits a peritectic phase.