IP Library Granted Patent US 11,318,685
Granted Patent B2
US 11,318,685 · App. 16/035,972 · Granted May 3, 2022

Systems and methods for manufacturing structural materials

Inventors: Nicholas D. Abbatiello (Round Rock, TX); Chuan Beng Sim (Shanghai, CN); Xin Hua Tian (Shanghai, CN)
Assignee: Dell Products L.P.
B29C65/70B29C43/18B29C43/184B29C37/0025B29C2037/0042B29K2101/10B29L2009/00B29L2031/3481
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Quick Facts
Patent No.
US 11,318,685
App. No.
16/035,972
Granted
May 3, 2022
Kind
B2
Abstract

In accordance with embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and compression molding an in-mold decoration film to a side of the sheet of structural material. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and adhesively bonding a chassis attachment frame to the sheet of structural material, the chassis attachment frame having one or more attachment features for mechanically coupling the structural member to other one or more other components. In accordance with these and other embodiments of the present disclosure, a method for forming a structural member may include providing a sheet of structural material and molding a chassis attachment frame comprising sheet molding compound to the structural material.

Claims (25)

1. A structural member for an information handling system chassis, wherein the structural member comprises:

a sheet of structural material, wherein the sheet of structural material includes a first side, a second side, and one or more protruding sidewalls;

a molded decoration film, including an adhesive on one side, molded to the second side of the sheet of structural material; and

a sheet molding compound (SMC) frame, wherein a first side of the SMC frame is attached to the first side of the sheet of structural material.

2. The structural member of claim 1 , further comprising:

attachment features formed in the SMC frame.

3. The structural member of claim 2 , wherein the attachment features include attachment features formed using computer numerical control.

4. The structural member of claim 1 , wherein the sheet of structural material comprises a fiber-reinforced polymer.

5. The structural member of claim 1 , wherein the sheet of structural material comprises a thermoset polymer.

6. The structural member of claim 1 , wherein the sheet of structural material comprises a layered composite structural material.

7. The structural member of claim 1 , further comprising:

an adhesive on a side of the molded decoration film wherein the adhesive bonds the molded decoration film to the sheet of structural material.

8. The structural member of claim 7 , wherein the SMC frame is adhesively bonded to the sheet of structural material.

9. The structural member of claim 7 , wherein the SMC frame is molded to the sheet of structural material.

10. The structural member of claim 1 , wherein the one or more protruding sidewalls includes two pairs of opposing protruding sidewalls and wherein the in-mold decoration film covers one, but not both, of the two pairs of protruding sidewalls.

11. The structural member of claim 10 , wherein the one or more protruding sidewalls includes two pairs of opposing protruding sidewalls and wherein the in-mold decoration film covers one, but not both, of the two pairs of protruding sidewalls.

12. An information handling system chassis for enclosing one or more information handling resources, wherein the information handling system chassis includes:

a plurality of chassis structural members, wherein the plurality of structural members include:

an attached-frame structural member, wherein the attached-frame structural member includes:

a sheet of structural material, wherein the sheet of structural material includes a first side, a second side, and one or more protruding sidewalls, wherein the sheet of structural material is comprised of a structural material selected from: fiber-reinforced polymer, a thermoset polymer, and a layered composite structural material;

a sheet molding compound (SMC) frame, wherein a first side of the SMC frame is attached to the first side of the sheet of structural material and wherein the SMC frame includes one or more attachment features formed in the SMC frame; and

an in-mold decoration film including an adhesive on one side, wherein the in-mold decoration film is molded to the second side of the sheet of structural material and covers at least one of the one or more protruding sidewalls of the sheet of structural material.

13. The information handling system chassis of claim 12 , wherein the first side of the SMC frame is either molded to or adhesively bonded to the first side of the sheet of structural material.

14. The information handling system of claim 12 , wherein the one or more protruding sidewalls includes two pairs of opposing protruding sidewalls and wherein the in-mold decoration film covers one, but not both, of the two pairs of protruding sidewalls.

15. The information handling system of claim 14 , wherein the in-mold decoration film includes a decorative pattern.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (047648/0422) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060160/0862 →
RELEASE OF SECURITY INTEREST AT REEL 047648 FRAME 0346 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0510 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Oct 12, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 047648/0346 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 12, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 047648/0422 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2018
From: ABBATIELLO, NICHOLAS D.; SIM, CHUAN BENG; TIAN, XIN HUA
To: DELL PRODUCTS L.P.
Reel/Frame 046358/0119 →