IP Library Granted Patent US 10,551,561
Granted Patent B2
US 10,551,561 · App. 16/036,151 · Granted Feb 4, 2020

Optical dielectric waveguide structures

Inventors: William Ring (High Bridge, NJ); Miroslaw Florjanczyk (Kanata, CA)
Assignee: POET Technologies, Inc.
G02B6/12028G02B6/12019G02B6/13G02B6/4272G02B6/43G02B6/12016G02B6/1223G02B6/4206G02B6/4224G02B6/4251G02B2006/12061
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Quick Facts
Patent No.
US 10,551,561
App. No.
16/036,151
Granted
Feb 4, 2020
Kind
B2
Abstract

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Claims (69)

1. A waveguide comprising

a substrate wherein a functionality of the substrate is susceptible to be degraded at temperatures greater than 400 C;

a buffer layer comprising SiON on the substrate,

wherein the buffer layer is thicker than or equal to 4 microns,

wherein the buffer layer comprises an index of refraction between 1.445 and 1.55;

a repeated stack of two or more SiON layers on the buffer layer, wherein the two or more layers comprise at least two layers having different indexes of refraction,

wherein the buffer layer and the layers of the repeated stack are formed by a deposition process at a temperature less than or equal to 400 C.

2. A waveguide as in claim 1

wherein the substrate comprises a material or an element that has a property changed at temperatures greater than 400 C, or

wherein the substrate comprises an interconnect layer that is susceptible to be damaged at temperatures greater than 400 C.

3. A waveguide as in claim 1

wherein the substrate comprises a device fabricated thereon,

wherein the device or a connection element connected to the device is susceptible to be damaged at temperatures greater than 400 C.

4. A waveguide as in claim 1

wherein each layer of the buffer layer and the layers of the repeated stack comprises a stoichiometry of Si, O, and N to provide a stress having a magnitude less than or equal to 20 MPa.

5. A waveguide as in claim 1

wherein each layer of the buffer layer and the layers of the repeated stack comprises a level of impurity or a level of homogeneity to provide an optical loss less than or equal to 1 dB/cm.

6. A waveguide as in claim 1

wherein a patterning of the buffer layer and the repeated stack comprises a level of uniformity to provide an optical loss less than or equal to 1 dB/cm.

7. A waveguide comprising

a substrate wherein a functionality of the substrate is susceptible to be degraded at temperatures greater than 400 C;

a buffer layer comprising SiON on the substrate;

a repeated stack of two or more SiON layers on the buffer layer, wherein the two or more layers comprise at least two layers having different indexes of refraction,

wherein the repeated stack comprises 9 repeated pairs of SiON layers,

wherein each pair of SiON comprises a SiON layer having a thickness of 50 nm and a refractive index of 1.7 on a SiON layer having a thickness of 900 nm a refractive index of 1.6,

wherein the buffer layer and the layers of the repeated stack are formed by a deposition process at a temperature less than or equal to 400 C.

8. A waveguide as in claim 7

wherein each layer of the buffer layer and the layers of the repeated stack comprises a stoichiometry of Si, O, and N to provide a stress having a magnitude less than or equal to 20 MPa.

9. A waveguide comprising

a substrate wherein a functionality of the substrate is susceptible to be degraded at temperatures greater than 400 C;

a buffer layer comprising SiON on the substrate;

a repeated stack of two or more SiON layers on the buffer layer, wherein the two or more layers comprise at least two layers having different indexes of refraction,

wherein the repeated stack comprises 10 repeated pairs of SiON layers,

wherein each pair of SiON comprises a SiON layer having a thickness of 500 nm and a refractive index of 1.65 on a SiON layer having a thickness of 40 nm and a refractive index of 1.7,

wherein the buffer layer and the layers of the repeated stack are formed by a deposition process at a temperature less than or equal to 400 C.

10. A waveguide as in claim 9

wherein each layer of the buffer layer and the layers of the repeated stack comprises a stoichiometry of Si, O, and N to provide a stress having a magnitude less than or equal to 20 MPa.

11. A waveguide comprising

a substrate wherein a functionality of the substrate is susceptible to be degraded at temperatures greater than 400 C;

a buffer layer comprising SiON on the substrate;

a repeated stack of two or more SiON layers on the buffer layer, wherein the two or more layers comprise at least two layers having different indexes of refraction,

wherein the repeated stack comprises 13 repeated pairs of SiON layers,

wherein each pair of SiON comprises a SiON layer having a thickness of 500 nm and a refractive index of 1.65 on a SiON layer having a thickness of 60 nm and a refractive index of 1.7,

wherein the buffer layer and the layers of the repeated stack are formed by a deposition process at a temperature less than or equal to 400 C.

12. A waveguide as in claim 11

wherein each layer of the buffer layer and the layers of the repeated stack comprises a stoichiometry of Si, O, and N to provide a stress having a magnitude less than or equal to 20 MPa.

13. A waveguide comprising

a substrate wherein a functionality of the substrate is susceptible to be degraded at temperatures greater than 400 C;

a buffer layer comprising SiON on the substrate;

one or more bottom spacer layers disposed on the buffer layer,

wherein the one or more bottom spacer layers comprise one or more SiON layers having a thickness of 500 nm and refractive index between 1.55 and 1.65;

a repeated stack of two or more SiON layers on the buffer layer, wherein the two or more layers comprise at least two layers having different indexes of refraction,

wherein the buffer layer and the layers of the repeated stack are formed by a deposition process at a temperature less than or equal to 400 C.

14. A waveguide as in claim 13

wherein each layer of the buffer layer and the layers of the repeated stack comprises a level of impurity or a level of homogeneity to provide an optical loss less than or equal to 1 dB/cm.

15. A waveguide comprising

a substrate wherein a functionality of the substrate is susceptible to be degraded at temperatures greater than 400 C;

a buffer layer comprising SiON on the substrate;

a repeated stack of two or more SiON layers on the buffer layer, wherein the two or more layers comprise at least two layers having different indexes of refraction;

one or more top spacer layers disposed on the repeated stack,

wherein the one or more top spacer layers comprise one or more SiON layers having a thickness between 500 nm and 850 nm and a refractive index between 1.55 and 1.7,

wherein the buffer layer and the layers of the repeated stack are formed by a deposition process at a temperature less than or equal to 400 C.

16. A waveguide comprising

a substrate wherein a functionality of the substrate is susceptible to be degraded at temperatures greater than 400 C;

a buffer layer comprising SiON on the substrate;

a repeated stack of two or more SiON layers on the buffer layer, wherein the two or more layers comprise at least two layers having different indexes of refraction,

a top layer disposed on the repeated stack,

wherein the top layer comprises a SiON layer having a thickness of 200 nm and refractive index of 1.445,

wherein the buffer layer and the layers of the repeated stack are formed by a deposition process at a temperature less than or equal to 400 C.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2019
From: ESPRESSO CAPITAL LTD.
To: OPEL INC.
Reel/Frame 051069/0619 →
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2019
From: ESPRESSO CAPITAL LTD.
To: BB PHOTONICS INC.
Reel/Frame 051064/0543 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2019
From: RING, WILLIAM; FLORJANCZYK, MIROSLAW
To: POET TECHNOLOGIES, INC.
Reel/Frame 050486/0397 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 048886 FRAME: 0716. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Apr 19, 2019
From: BB PHOTONICS INC.
To: ESPRESSO CAPITAL LTD.
Reel/Frame 048947/0480 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 0448881 FRAME: 0709. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 19, 2019
From: BB PHOTONICS INC.
To: ESPRESSO CAPITAL LTD.
Reel/Frame 048947/0687 →
SECURITY INTEREST Recorded Apr 15, 2019
From: BB PHOTONICS INC.
To: ESPRESSO CAPITAL LTD.
Reel/Frame 048881/0709 →
SECURITY INTEREST Recorded Apr 15, 2019
From: OPEL INC.
To: ESPRESSO CAPITAL LTD.
Reel/Frame 048886/0716 →
Continuity (2)
Provisional Application 62621659 · Jan 25, 2018
Related Publication 20190227231A1 · Jul 25, 2019