Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device that includes a resin package sealing a semiconductor element and a pair of metal plates interposing the semiconductor element therebetween, in which each of the pair of metal plates is exposed at corresponding one of both surfaces of the resin package is disclosed. The method may include preparing an assembly in which the semiconductor element is connected to the pair of metal plates; setting the assembly in a cavity of a mold, wherein one metal plate is in contact with a bottom surface of the cavity and a space is provided above the other metal plate; forming the resin package by injecting a molten resin into the cavity so as to cover an upper side of the other metal plate, stopping the injecting of the molten resin with a part of the space on an upper side of the cavity unfilled.
1. A method of manufacturing a semiconductor device that comprises a resin package sealing a semiconductor element and a pair of metal plates interposing the semiconductor element therebetween, each of the pair of metal plates being exposed at corresponding one of both surfaces of the resin package, the method comprising:
preparing an assembly in which the semiconductor element is connected to the pair of metal plates;
setting the assembly in a cavity of a mold configured to form the resin package, wherein one metal plate of the pair of metal plates is in contact with a bottom surface of the cavity and a space is provided above the other metal plate of the pair of metal plates;
forming the resin package by injecting a molten resin into the cavity so as to cover an upper side of the other metal plate, stopping the injecting of the molten resin with a part of the space on an upper side of the cavity unfilled, and hardening the molten resin injected into the cavity; and
removing a resin covering the other metal plate.
2. The method as in claim 1 , wherein
a recess is provided in an area of an upper surface of the cavity, the area facing the other metal plate, and
the forming of the resin package comprises stopping the injecting of the molten resin with a part of an inner space of the recess unfilled.
3. The method as in claim 1 , wherein
the assembly comprises two pairs of metal plates, each of the two pairs of metal plates interposing a semiconductor element therebetween,
a first joint extends from an edge of a lower metal plate of one pair of the two pairs of metal plates,
a second joint extends from an edge of an upper metal plate of the other pair of the two pairs of metal plates,
the first joint and the second joint overlap each other in a normal direction of the metal plates, and the first joint and the second joint are connected to each other via a solder, and
in the cavity, the second joint is in contact with an upper surface of the cavity.