Systems and methods for pump slip sensing

1. A system, comprising:

one or more fluid pumps;

a first pressure sensor disposed on or near an inlet of a fluid pump of the one or more fluid pumps;

a second pressure sensor disposed on or near an outlet of the fluid pump;

a second fluid pump, wherein the fluid pump is configured to deliver an A compound to a foam dispensing gun and the second fluid pump is configured to deliver a B compound to the foam dispensing gun; and

a control system comprising a processor configured to:

receive a first signal from the first pressure sensor;

receive a second signal from the second pressure sensor;

derive a pump slip measure based on the first signal and the second signal; and

derive the pump slip measure via an orifice flow analysis.

2. The system of claim 1 , wherein the processor is configured to perform the orifice flow analysis by calculating a slip Q where Q(t)=Pf×Ff×∫ΔP 1/2 dt such that t comprises a sample time period, Pf=Pump Factor, Ff=Fluid Factor, ΔP=Po−Pi, wherein Po=Outlet pressure of the fluid pump, and Pi=Inlet pressure of the fluid pump.

3. The system of claim 1 , wherein the processor is configured to derive the pump slip measure via a zero-flow pressurized state.

4. The system of claim 3 , wherein the processor is configured to control the fluid pump to a set outlet pressure in a known no-flow state to arrive at the zero-flow pressurized state.

5. The system of claim 4 , wherein the processor is configured to derive the pump slip measure by measuring an advancing of the fluid pump to maintain the set outlet pressure.

6. The system of claim 1 , wherein the fluid pump and the second fluid pump are configured to deliver the A and the B compounds at the same pressure to the foam dispending gun.

7. The system of claim 1 , comprising a first heated conduit fluidly coupling the fluid pump to the foam dispensing gun, and a second heated conduit fluidly coupling the second fluid pump to the foam dispensing gun.

8. The system of claim 7 , wherein the processor is configured to control heat in the first heated conduit, in the second heated conduit, or in a combination thereof, to deliver the A and the B compounds at the same pressure to the foam dispending gun.

9. A method, comprising:

receiving a first signal from a first pressure sensor, wherein the first pressure sensor is disposed on or near an inlet of one or more fluid pumps;

receiving a second signal from a second pressure sensor, wherein the second pressure sensor is disposed on or near an outlet of the one or more fluid pumps;

using a second fluid pump, wherein the fluid pump is configured to deliver an A compound to a foam dispensing gun and the second fluid pump is configured to deliver a B compound to the foam dispensing gun; and

deriving a pump slip measure based on the first signal and the second signal, wherein deriving the pump slip measure comprises performing an orifice flow analysis and wherein performing the orifice flow analysis comprises calculating a slip Q where Q(t)=Pf×Ff×∫ΔP 1/2 dt such that t comprises a sample time period, Pf=Pump Factor, Ff=Fluid Factor, ΔP=Po−Pi, wherein Po=Outlet pressure of the fluid pump, and Pi=Inlet pressure of the fluid pump.

10. The method of claim 9 , wherein deriving the pump slip measure comprises applying a zero-flow pressurized state.

11. The method of claim 10 , wherein applying the zero-flow pressurized state comprises controlling the fluid pump to a set outlet pressure in a known no-flow state to arrive at the zero-flow pressurized state.

12. A tangible, non-transitory, computer-readable medium comprising instructions that when executed by a processor cause the processor to:

receive a first signal from a first pressure sensor, wherein the first pressure sensor is disposed on or near an inlet of one or more fluid pumps;

receive a second signal from a second pressure sensor, wherein the second pressure sensor is disposed on or near an outlet of the one or more fluid pumps;

control a second fluid pump, wherein the fluid pump is configured to deliver an A compound to a foam dispensing gun and the second fluid pump is configured to deliver a B compound to the foam dispensing gun; and

derive a pump slip measure based on the first signal and the second signal wherein the instructions that cause the processor to derive the pump slip measure comprise instructions that cause the processor to perform an orifice flow analysis, and wherein the instructions that cause the processor to perform the orifice flow analysis comprise instructions that cause the processor to calculate a slip Q where Q(t)=Pf×Ff×∫ΔP 1/2 dt such that t comprises a sample time period, Pf=Pump Factor, Ff=Fluid Factor, ΔP=Po−Pi, wherein Po=Outlet pressure of the fluid pump, and Pi=Inlet pressure of the fluid pump.

13. The medium of claim 12 , wherein the instructions that cause the processor to derive the pump slip measure comprise instructions that cause the processor to apply a zero-flow pressurized state.

14. The medium of claim 13 , wherein the instructions that cause the processor to apply the zero-flow pressurized state comprise the instructions that cause the processor to control the fluid pump to a set outlet pressure in a known no-flow state to arrive at the zero-flow pressurized state.

15. A tangible, non-transitory, computer-readable medium comprising instructions that when executed by a processor cause the processor to:

receive a first signal from a first pressure sensor, wherein the first pressure sensor is disposed on or near an inlet of one or more fluid pumps;

receive a second signal from a second pressure sensor, wherein the second pressure sensor is disposed on or near an outlet of the one or more fluid pumps;

control a second fluid pump, wherein the fluid pump is configured to deliver an A compound to a foam dispensing gun and the second fluid pump is configured to deliver a B compound to the foam dispensing gun; and

derive a pump slip measure based on the first signal and the second signal, wherein the instructions that cause the processor to derive the pump slip measure comprise instructions that cause the processor to apply a zero-flow pressurized state.