IP Library Granted Patent US 10,485,110
Granted Patent B2
US 10,485,110 · App. 16/040,596 · Granted Nov 19, 2019

Electrical connection method of printed circuit and electrical connection structure of printed circuit

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Quick Facts
Patent No.
US 10,485,110
App. No.
16/040,596
Granted
Nov 19, 2019
Kind
B2
Abstract

An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.

Claims (11)

1. An electrical connection method of a printed circuit, comprising:

overlapping a base material and a thin member in which a thin conductor is mounted;

forming a through hole which passes through the base material overlapped with the thin member, and reaches the thin conductor of the thin member; and

forming the printed circuit on the base material by a screen printing method using conductive paste,

wherein the through hole is filled with the conductive paste in the forming of the printed circuit,

wherein the thin member is a flat shield cable covered with a shield member except one portion of the thin member,

wherein in the forming of the through hole, a first through hole is formed to pass through the base material overlapped in the overlapping and to open the one portion of the thin member so as to reach the thin conductor, and a second through hole is formed to pass through the base material overlapped in the overlapping to reach the shield member, and

wherein in the forming of the printed circuit, the first through hole is filled with the conductive paste when a signal line is formed as a first printed circuit on the base material, and the second through hole is filled with the conductive paste when a ground line is formed as a second printed circuit on the base material at the same time as the signal line is formed.

2. The electrical connection method of the printed circuit according to claim 1 ,

wherein in the forming of the through hole, a plurality of through holes are formed, and

wherein in the forming of the printed circuit, the plurality of through holes are filled with the conductive paste so as to electrically connect one circuit in the printed circuit to the thin conductor through the plurality of through holes when the printed circuit is formed on the base material.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2018
From: SHIRAI, MIZUKI; KONDO, HIROKI
To: YAZAKI CORPORATION
Reel/Frame 046410/0207 →