Light-emitting diode
A semiconductor device, comprises a semiconductor stack comprising a first area and a second area, wherein the second area comprises a first side wall, a first isolation path formed between the first area and the second area, a second isolation path formed in the semiconductor stack, an isolation layer formed in the first isolation path and covering the first side wall, an electrical contact layer formed under the semiconductor stack, and an electrode contact layer directly contacting the electrical contact layer.
1. A semiconductor device, comprising:
a semiconductor stack comprising a first area having an upper surface and a second area having a first side wall;
a first isolation path formed between the first area and the second area;
a second isolation path formed in the semiconductor stack;
an isolation layer formed in the first isolation path and covering the first side wall;
an electrical contact layer having a portion formed under the semiconductor stack; and an electrode contact layer directly contacting the electrical contact layer and covering the upper surface; wherein the first area further has a second side wall covered by the electrode contact layer.
2. The semiconductor device according to claim 1 , wherein the electrical contact layer overlap the first area without overlapping the second area in a direction.
3. The semiconductor device according to claim 1 , wherein both of the first area and the second area sequentially comprise a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer.
4. The semiconductor device according to claim 3 , wherein a width of the first conductive type semiconductor layer is larger than a width of the second conductive type semiconductor layer.
5. The semiconductor device according to claim 1 , wherein the second area further comprises a third side wall covered by the isolation layer.
6. The semiconductor device according to claim 1 , wherein the semiconductor stack further comprises a third area and the second isolation path is formed between the second area and the third area.
7. The semiconductor device according to claim 1 , further comprises a substrate under the semiconductor stack.
8. The semiconductor device according to claim 7 , further comprises a bonding layer connecting the substrate and the semiconductor stack.
9. The semiconductor device according to claim 7 , wherein the substrate comprises sapphire.
10. The semiconductor device according to claim 1 , wherein the semiconductor stack comprises a first light-emitting structure and a second light-emitting structure and the second isolation path between the first light-emitting structure and the second light-emitting structure.
11. The semiconductor device according to claim 3 , wherein the first isolation path separates the second conductive type semiconductor layer of the first area from the second conductive type semiconductor layer of the second area, separates the active layer of the first area from the active layer of the second area, and does not separate the first conductive type semiconductor layer of the first area from the first conductive type semiconductor layer of the second area.
12. The semiconductor according to claim 1 , wherein a distance between the first area and the second area is not less than 25 μm.
13. The semiconductor according to claim 1 , wherein the electrical contact layer is formed under the first area.