IP Library Granted Patent US 10,994,880
Granted Patent B2
US 10,994,880 · App. 16/043,589 · Granted May 4, 2021

Heat shrinkable film and preparation method thereof

Inventors: Chul Kyu Kim (Suwon-si, KR); Yongdeuk Kim (Yeosu-si, KR)
Assignee: SKC CO., LTD.
B65B53/02B29C48/0018B29C48/08B29C55/005B29C55/02C08G63/183C08J5/18B29C2948/92209B29C2948/92476B29K2067/00B29K2105/02C08J2367/02Y10T428/1328
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Quick Facts
Patent No.
US 10,994,880
App. No.
16/043,589
Granted
May 4, 2021
Kind
B2
Abstract

Embodiments relate to a heat shrinkable film, which has a heat shrinkage rate in the direction perpendicular to the main shrinkage direction that is not high even at a high temperature and which is printable thereon. The heat shrinkable film comprises a polyester resin, wherein the heat shrinkage characteristics in the direction perpendicular to the main shrinkage direction satisfy the following Relationships 1 and 2: −15≤Δ T 70−65 ≤0  [Relationship 1] 0≤Δ T 100−95 ≤5  [Relationship 2] wherein ΔT X−Y is a value obtained by subtracting a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at Y° C. from a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at X° C.

Claims (28)

1. A heat shrinkable film, which comprises a polyester resin,

wherein a maximum expansion rate in direction perpendicular to main shrinking direction of the heat shrinkable film is 5 to 12%;

wherein the polyester resin comprises a dicarboxylic acid component and a diol component, and the diol component comprises diethylene glycol and neopentyl glycol;

wherein content of diethylene glycol is 5 to 15% by mole based on the total number of moles of the diol component, and content of neopentyl glycol is 22 to 30% by mole based on the total number of moles of the diol component; and

wherein heat shrinkage characteristics of the heat shrinkable film in the direction perpendicular to the main shrinkage direction satisfy the following Relationships 1b and 2b:

Relationship 1b −8%≤ΔT X−Y ≤−1%, wherein X is 70 and Y is 65,

Relationship 2b 0.2%≤ΔT X−Y ≤1%, wherein X is 100 and Y is 95,

wherein ΔT X−Y is a value obtained by subtracting a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at Y° C. from a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at X° C.

2. The heat shrinkable film of claim 1 , wherein the maximum expansion rate of the heat shrinkable film is present between 70° C. and 90° C. when the heat shrinkage of the heat shrinkable film in the direction perpendicular to the main shrinkage direction is measured at an interval of 5° C. between 50° C. and 100° C.

3. The heat shrinkable film of claim 1 , whose heat of crystallization (ΔHc) as measured by differential scanning calorimetry (DSC) is 0 to 30 J/g.

4. The heat shrinkable film of claim 1 , which satisfies that T 75 is −12 to 0%, that T 80 is −15 to 0%, that T 85 is −10 to 0%, wherein T 75 , T 80 , and T 85 each refer to a heat shrinkage rate in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at 75° C., 80° C., and 85° C., respectively.

5. A process for preparing a heat shrinkable film according to claim 1 , which comprises:

(a) preparing a polyester resin composition, wherein the polyester resin comprises a dicarboxylic acid component and a diol component, and the diol component comprises diethylene glycol and neopentyl glycol, and wherein the content of diethylene glycol is 5 to 15% by mole based on the total number of moles of the diol component, and the content of neopentyl glycol is 22 to 30% by mole based on the total number of moles of the diol component;

(b) extruding the composition to obtain an unstretched sheet;

(c) preheating the unstretched sheet at a preheating temperature (T1) of 100 to 110° C.;

(d) stretching the preheated unstretched sheet in one direction to obtain a stretched sheet;

(e) thermally treating the stretched sheet at a thermal treatment temperature (T2) of 70 to 98° C.; and

(f) cooling the thermally treated and stretched sheet to prepare the heat shrinkable film,

wherein a maximum expansion rate in direction perpendicular to main shrinking direction of the heat shrinkable film is 5 to 12%;

wherein heat shrinkage characteristics of the heat shrinkable film in the direction perpendicular to the main shrinkage direction satisfy the following Relationships 1b and 2b:

Relationship 1b −8≤ΔT X−Y ≤−1%, wherein X is 70 and Y is 65,

Relationship 2b 0.2≤ΔT X−Y ≤1%, wherein X is 100 and Y is 95

wherein ΔT X−Y is a value obtained by subtracting a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at Y° C. from a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at X° C.

6. The process for preparing a heat shrinkable film of claim 5 , wherein the extrusion (b) is carried out at 260 to 300° C.

7. The process for preparing a heat shrinkable film of claim 5 , wherein T1-T2 is 10 to 40° C.

8. The process for preparing a heat shrinkable film of claim 5 , wherein the preheating (c) is carried out for 0.01 to 1 minute.

9. The process for preparing a heat shrinkable film of claim 5 , wherein the stretching (d) is carried out at a stretching ratio of 3 to 5 times in one direction.

10. The process for preparing a heat shrinkable film of claim 5 , which further comprises printing on the heat shrinkable film.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2026
From: SK MICROWORKS CO. LTD.
To: MICROWORKS CO. LTD.
Reel/Frame 074306/0727 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 063240 FRAME: 0192. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 8, 2023
From: SKC CO., LTD.
To: SK MICROWORKS CO., LTD.
Reel/Frame 065841/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2023
From: SKC CO., LTD.
To: SK MICROWORKS CO., LTD.
Reel/Frame 063240/0192 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 24, 2018
From: KIM, CHUL KYU; KIM, YONGDEUK
To: SKC CO., LTD.
Reel/Frame 046445/0107 →