IP Library Granted Patent US 11,081,644
Granted Patent B2
US 11,081,644 · App. 16/045,550 · Granted Aug 3, 2021

Apparatuses including electrodes having a conductive barrier material and methods of forming same

Inventors: Swapnil A. Lengade (Boise, ID); John M. Meldrim (Boise, ID); Andrea Gotti (Pozzo D'Adda, IT)
Assignee: Micron Technology, Inc.
H01L45/1608H01L27/2427H01L27/2463H01L45/06H01L45/12H01L45/1233H01L45/1246H01L45/1253H01L45/141H01L45/144
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Quick Facts
Patent No.
US 11,081,644
App. No.
16/045,550
Granted
Aug 3, 2021
Kind
B2
Abstract

Apparatuses and methods of manufacture are disclosed for phase change memory cell electrodes having a conductive barrier material. In one example, apparatus includes a first chalcogenide structure and a second chalcogenide structure stacked together with the first chalcogenide structure. A first electrode portion is coupled to the first chalcogenide structure, and a second electrode portion is coupled to the second chalcogenide structure. An electrically conductive barrier material is disposed between the first and second electrode portions.

Claims (24)

1. A method, comprising:

partitioning an electrode disposed between a switch and a phase change memory storage element into first and second portions; and

forming an electrically conductive barrier material between the first and second portions of the electrode, wherein at least one portion of the electrically conductive barrier material has a larger cross section than at least one of the first or second portions of the electrode.

2. The method of claim 1 , wherein the electrically conductive barrier material has a substantially different crystalline structure than the first and second portions of the electrode.

3. The method of claim 1 , wherein the first and second portions of the electrode are at least partially columnar and the electrically conductive barrier material is amorphous.

4. The method of claim 1 , wherein the electrically conductive barrier material is one of titanium nitride, tungsten silicide, silicon, or combinations thereof.

5. The method of claim 1 , wherein the electrically conductive barrier material comprising portions interspersed between the first portion of the electrode and the second portion of the electrode.

6. A method, comprising:

forming a switch;

forming a phase change material storage element; and

forming an electrically conductive barrier material between the switch and the phase change material storage element, wherein forming the electrically conductive barrier material between the switch and phase change material comprises:

forming in situ the electrically conductive barrier material, a first electrode, and a second electrode.

7. The method of claim 6 , wherein forming the switch further comprises:

forming a first chalcogenide structure; and

forming a first electrode over at least a portion of the first chalcogenide structure, wherein the first electrode is disposed between the first chalcogenide structure and the electrically conductive barrier material.

8. The method of claim 6 , wherein the electrically, conductive barrier material is one of titanium nitride, tungsten silicide, silicon, or combinations thereof.

9. A method, comprising:

forming a switch;

forming a phase change material storage element; and

forming an electrically conductive barrier material between the switch and the phase change material storage element, wherein forming the electrically conductive barrier material between the switch and phase change material comprises:

forming in situ the electrically conductive barrier material, a first electrode, and a second electrode, wherein the first electrode is disposed between at least a portion of the switch and the electrically conductive barrier material, and wherein the second electrode is disposed between at least a portion of the phase change material storage element and the electrically conductive barrier material.

10. The method of claim 6 , further comprising:

forming first and second access lines, wherein the switch, electrically conducive barrier material, and the phase change material storage element are disposed between the first and second access lines.

11. The method of claim 6 , wherein the switch and the phase change material storage element are integrally formed together.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
SUPPLEMENT NO. 10 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2018
From: LENGADE, SWAPNIL A.; MELDRIM, JOHN M.; GOTTI, ANDREA
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046462/0378 →