Tunable integrated millimeter wave antenna using laser ablation and/or fuses
A method for tuning an antenna may include depositing multiple portions of an antenna structure onto a substrate. The method may further include electrically coupling each of the portions of the antenna structure. The method may also include severing an electrical connection between two of the portions of the antenna structure to tune the antenna structure for use with a transmission device.
1. A method comprising:
forming a device layer on a first side of a semiconductor substrate;
forming a through-silicon-via (TSV) passing through the semiconductor substrate;
depositing a first portion and a second portion of an antenna structure onto a second side of the substrate opposite the first side of the substrate, wherein the TSV joins to the first portion of the antenna structure, wherein the first portion of the antenna structure, while uncoupled from the second portion of the antenna structure, defines an antenna that is compatible with a first transmission device having a first design; and
electrically coupling the first portion of the antenna structure to the second portion of the antenna structure, wherein the first portion of the antenna structure and the second portion of the antenna structure, while coupled together, define an antenna that is compatible with a second transmission device having a second design different than the first design.
2. The method of claim 1 , further comprising:
electrically coupling the first portion of the antenna structure to the first transmission device; and
electrically decoupling the first portion of the antenna structure from the second portion of the antenna structure.
3. The method of claim 2 , wherein electrically decoupling the first portion of the antenna structure from the second portion of the antenna structure includes removing at least a portion of an electrical runner between the first portion and the second portion by laser ablation.
4. The method of claim 2 , wherein electrically decoupling the first portion of the antenna structure from the second portion of the antenna structure includes blowing a fuse between the first portion and the second portion.
5. The method of claim 4 , wherein blowing the fuse comprises:
applying an electrical current to a pin electrically coupled to the fuse.
6. The method of claim 2 , wherein the first transmission device is positioned on a second substrate, and wherein the second substrate is configured to couple with the first side of the substrate.
7. The method of claim 1 , further comprising:
electrically coupling the second transmission device to the first portion of the antenna structure.
8. The method of claim 7 , wherein the second transmission device is positioned on a second substrate, and wherein the second substrate is configured to couple with the first side of the substrate.
9. The method of claim 1 , wherein electrically coupling the first portion of the antenna structure to the second portion of the antenna structure includes blowing an anti-fuse between the first portion and the second portion.
10. The method of claim 1 , wherein the substrate is included in a first semiconductor package, and the method further includes coupling a second semiconductor package to the first semiconductor package, the second semiconductor package including the first transmission device.
11. The method of claim 10 , further comprising a processor formed within the second semiconductor package and a memory module formed within the first semiconductor package.
12. The method of claim 1 , further comprising:
depositing a third portion of the antenna structure onto the substrate; and
electrically coupling the third portion of the antenna structure to the second portion of the antenna structure, wherein the first portion of the antenna structure, the second portion of the antenna structure, and the third portion of the antenna structure, while coupled together, define an antenna that is compatible with a third transmission device having a third design different than the first design and the second design.
13. The method of claim 12 , further comprising:
electrically coupling the first portion of the antenna structure to the second transmission device; and
electrically decoupling the third portion of the antenna structure from the first portion and the second portion of the antenna structure.
14. The method of claim 12 , further comprising electrically coupling the third portion of the antenna structure to the third transmission device.
15. The method of claim 1 , wherein the antenna structure is a millimeter wave antenna.
16. The method of claim 1 , wherein the antenna structure enables 5G communication.