IP Library Granted Patent US 11,257,612
Granted Patent B2
US 11,257,612 · App. 16/046,577 · Granted Feb 22, 2022

Assembly and method for sealing a bundle of wires

Inventors: Sunny Sethi (Castro Valley, CA); Vijay Daga (Sunnyvale, CA); Kavitha Bharadwaj (Fremont, CA); Ting Gao (Palo Alto, CA)
Assignee: TE Connectivity Services GMBH
H01B13/0016H01B3/305H01B3/441H01B3/446H01B13/0036H01B7/285H01B13/0013H02G15/013
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Quick Facts
Patent No.
US 11,257,612
App. No.
16/046,577
Granted
Feb 22, 2022
Kind
B2
Abstract

A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.

Claims (8)

1. A structure for creating a sealed wire bundle comprising:

a generally planar strip having a first and a second end section formed of a first adhesive material having a first viscosity and a center section therebetween formed of a second adhesive material having a second viscosity that is less than the first viscosity at a melt temperature;

a heat-shrinkable tubing disposed around the strip such that the first and second end sections of the strip are arranged towards first and second ends of the heat-shrinkable material, respectively;

wherein the first viscosity is greater than 1000 Pa·s at an installation temperature and the second viscosity is less than 300 Pa·s at the installation temperature.

2. The structure according claim 1 , wherein the adhesive material is 40%-95% ethylene-vinyl acetate (EVA) or polyolefin (PO) by weight.

3. The structure according claim 1 , wherein the adhesive material is 40%-95% polyamide by weight.

4. The structure according claim 1 , wherein the strip is disposed on one side of an interior surface of the heat-shrinkable tubing.

5. The structure according claim 1 , further comprising a second strip with a same configuration at the first strip disposed on a side of the interior surface of the heat-shrinkable tubing opposite the side on which the first strip is disposed.

Assignments (4)
MERGER Recorded Apr 28, 2022
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SOLUTIONS GMBH
Reel/Frame 060885/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2021
From: TE CONNECTIVITY CORPORATION
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 056524/0226 →
CHANGE OF ADDRESS Recorded Jun 8, 2021
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 056524/0531 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2018
From: SETHI, SUNNY; DAGA, VIJAY; BHARADWAJ, KAVITHA; GAO, TING
To: TE CONNECTIVITY CORPORATION
Reel/Frame 046501/0678 →
Continuity (1)
Related Publication 20200035383A1 · Jan 30, 2020