Methods for on-die memory termination and memory devices and systems employing the same

1. A method of operating a memory system, comprising:

receiving a first command instructing a first memory device of the memory system to perform a first communication with a memory host and instructing a second memory device of the memory system to enter an on-die termination mode;

performing, with the first memory device, the first communication while the second memory device is in the on-die termination mode based at least in part on the first command;

receiving a second command instructing the first memory device to perform a second communication with the memory host; and

performing, with the first memory device, the second communication while the second memory device is in the on-die termination mode based at least in part on the first command.

2. The method of claim 1 , further comprising:

receiving a third command instructing the second memory device of the memory system to exit the on-die termination mode; and

the second memory device of the memory system exiting the on-die termination mode based at least in part on the third command.

3. The method of claim 1 , further comprising:

the second memory device of the memory system remaining, based at least in part on the first command, in the on-die termination mode for a duration greater than that of the first communication.

4. The method of claim 3 , wherein the first command includes a number of bursts or clock cycles for which the second memory device is to remain in the on-die termination mode.

5. The method of claim 1 , further comprising:

receiving a third command subsequent to the first command and prior to the second command, the third command instructing the second memory device to perform a third communication and the first memory device to enter the on-die termination mode; and

performing, with the second memory device, the third communication while the first memory device is in the on-die termination mode based at least in part on the second command,

reverting, based at least in part on the first command, the second memory device to the on-die termination mode after performing the third communication.

6. The method of claim 1 , wherein the second command is subsequent to the first command.

7. The method of claim 1 , wherein the first communication is one of a read or a write operation.

8. The method of claim 1 , wherein a single semiconductor die comprises the first memory device and the second memory device.

9. A method of operating a memory device including a first portion and a second portion, the method comprising:

receiving a first command at the memory device instructing the first portion to perform a first communication and instructing the second portion to enter an on-die termination mode;

receiving a second command instructing the second portion to exit the on-die termination mode; and

maintaining, at the second portion, the on-die termination mode based at least in part on the first command until receiving the second command.

10. The method of claim 9 , wherein the first portion corresponds to a first channel of the memory device, and wherein the second portion corresponds to a second channel of the memory device.

11. The method of claim 9 , further comprising:

performing the first communication, wherein the second portion remains in the on-die termination mode after performing the first communication.

12. A memory device, comprising:

a first memory portion;

a second memory portion; and

circuitry configured to implement an on-die termination mode at the second memory portion;

wherein the circuitry is configured, in response to a single command to the second memory portion, to implement the on-die termination mode at the second memory portion during more than one communication at the first memory portion.

13. The memory device of claim 12 , wherein the circuitry is configured to implement the on-die termination mode at the second memory portion in response to a first command to implement the on-die termination mode, and to remain in the on-die termination mode until receiving a second command to exit the on-die termination mode.

14. The memory device of claim 12 , wherein the circuitry is configured to implement the on-die termination mode at the second memory portion until a threshold number of communications are performed at the first memory portion, wherein the threshold number is indicated in the single command to the second memory portion.

15. The memory device of claim 12 , wherein the circuitry is configured to implement the on-die termination mode at the second memory portion in response to a first command instructing the first memory portion to perform a communication and instructing the second memory portion to enter the on-die termination mode, and to revert to the on-die termination mode following a communication at the second memory portion.

16. A memory device, comprising:

a first memory portion;

a second memory portion; and

circuitry configured to:

implement an on-die termination mode at the second memory portion in response to receiving a first command; and

to exit the on-die termination mode in response to receiving a second command subsequent to the first command.

17. The memory device of claim 16 , wherein the first memory portion corresponds to a first channel of the memory device, and wherein the second memory portion corresponds to a second channel of the memory device.

18. A method of operating a memory system, comprising:

transmitting a first command instructing a first memory device of the memory system to perform a first communication with a memory host and instructing a second memory device of the memory system to enter an on-die termination mode;

performing, with the first memory device, the first communication while the second memory device is in the on-die termination mode based at least in part on the first command;

transmitting a second command instructing the first memory device to perform a second communication with the memory host; and

performing, with the first memory device, the second communication while the second memory device is in the on-die termination mode based at least in part on the first command.

19. The method of claim 18 , further comprising:

transmitting a third command instructing the second memory device of the memory system to exit the on-die termination mode; and

the second memory device of the memory system exiting the on-die termination mode based at least in part on the third command.

20. The method of claim 18 , further comprising:

the second memory device of the memory system remaining, based at least in part on the first command, in the on-die termination mode for a duration greater than that of the first communication.

21. The method of claim 20 , wherein the first command includes a number of bursts or clock cycles for which the second memory device is to remain in the on-die termination mode.

22. The method of claim 18 , further comprising:

transmitting a third command subsequent to the first command and prior to the second command, the third command instructing the second memory device to perform a third communication and the first memory device to enter the on-die termination mode; and

performing, with the second memory device, the third communication while the first memory device is in the on-die termination mode based at least in part on the second command,

reverting, based at least in part on the first command, the second memory device to the on-die termination mode after performing the third communication.

23. The method of claim 18 , wherein the second command is subsequent to the first command.

24. The method of claim 18 , wherein the first communication is one of a read or a write operation.

25. The method of claim 18 , wherein a single semiconductor die comprises the first memory device and the second memory device.