Apparatuses and methods for forming die stacks
View Patent ↗Apparatuses and methods for forming die stacks are disclosed herein. An example method includes dispensing a temporary adhesive onto a substrate, placing a base die onto the temporary adhesive, curing the temporary adhesive, forming a die stack that includes the base die, activating a release layer disposed on the substrate, wherein the release layer is between the substrate and the temporary adhesive, removing the die stack from the substrate, and removing the temporary adhesive from the die stack.
1. An apparatus comprising:
a substrate including a release layer configured to activate a release of a die stack from the substrate; and
the die stack including a plurality of die, the die stack placed on the substrate.
2. The apparatus of claim 1 , wherein the plurality of die comprises a base die placed directly on the substrate.
3. The apparatus of claim 1 , wherein the substrate further comprises a temporary adhesive disposed between die stack and the substrate.
4. The apparatus of claim 3 , wherein the temporary adhesive is disposed on the release layer of the substrate.
5. The apparatus of claim 3 , wherein the temporary adhesive is configured to adhere the die stack to the substrate.
6. The apparatus of claim 3 , wherein the substrate comprises a material transparent to at least one wavelength of electro-magnetic radiation.
7. The apparatus of claim 6 , wherein the temporary adhesive is configured to be cured to the die stack by the at least one wavelength of radiation.
8. The apparatus of claim 7 , wherein the at least one wavelength of radiation corresponds to at least one wavelength in the ultraviolet range of the electromagnetic spectrum (EM).
9. The apparatus of claim 7 , wherein the release layer is activated by additional radiation different than the at least one wavelength of radiation.
10. The apparatus of claim 1 , wherein the substrate comprises glass.
11. The apparatus of claim 1 , further comprising:
a process carrier on which the substrate is placed, wherein the process carrier comprises openings.
12. The apparatus of claim 1 , wherein the die stack comprises a first die including first metallic bonding pads and a second die with second metallic bonding pads, the first metallic bonding pads bonded to the second metaling bonding pads.
13. The apparatus of claim 1 , wherein the die stack comprises a logic die and a plurality of memory die stacked on the logic die.
14. The apparatus of claim 1 , wherein the temporary adhesive is removed with a roller pulling tape that was placed on the temporary adhesive.
15. The apparatus of claim 1 , wherein the base die corresponds to a logic die and the remaining of plurality of die comprise a plurality of memory die.
16. An apparatus comprising:
a die stack including a plurality of die, wherein the plurality of die comprises a base die; and
a temporary adhesive adhered to the base die, the temporary adhesive configured to be removed.
17. The apparatus of claim 16 , wherein the base die comprises a plurality of electrical through-vias to electrically connect a top side of the base die to a bottom side of the base die.
18. The apparatus of claim 17 , wherein the bottom side of the base die comprises bonding pads configured to bond another die of the plurality of die to the base die.
19. The apparatus of claim 17 , wherein the top side of the base die comprises electrical pads configured to electrically test the base die.
20. The apparatus of claim 19 , wherein, upon removal of the temporary adhesive, the electrical pads are exposed for electrical testing.