IP Library Granted Patent US 11,532,477
Granted Patent B2
US 11,532,477 · App. 16/049,329 · Granted Dec 20, 2022

Self-assembled nanostructures including metal oxides and semiconductor structures comprised thereof

Inventors: Nicholas Hendricks (Boise, ID); Adam L. Olson (Boise, ID); William R. Brown (Boise, ID); Ho Seop Eom (Boise, ID); Xue Chen (Boise, ID); Kaveri Jain (Boise, ID); Scott Schuldenfrei (Boise, ID)
Assignee: Micron Technology, Inc.
H01L21/0273B81C1/00031C08G81/00C08L53/005H01L21/02118H01L21/02175H01L21/02318H01L21/0332H01L21/0337H01L21/31058B81C2201/0149
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Quick Facts
Patent No.
US 11,532,477
App. No.
16/049,329
Granted
Dec 20, 2022
Kind
B2
Abstract

A self-assembled nanostructure comprises first domains and second domains. The first domains comprise a first block of a block copolymer material and an activatable catalyst. The second domains comprise a second block and substantially without the activatable catalyst. The activatable catalyst is capable of generating catalyst upon application of activation energy, and the generated catalyst is capable of reacting with a metal oxide precursor to provide a metal oxide. A semiconductor structure comprises such self-assembled nanostructure on a substrate.

Claims (14)

1. A self-assembled nanostructure comprising first domains and second domains extending along a first horizontal direction and a second horizontal direction, the second horizontal direction orthogonal to the first horizontal direction, the first domains comprising a first block of a block copolymer material and a metal oxide, the second domains consisting of a second block of the block copolymer material, and each of the first domains exhibiting different lengths, the different lengths along the first horizontal direction.

2. The self-assembled nanostructure of claim 1 , wherein the block copolymer material comprises an amphiphilic block copolymer, and the self-assembled nanostructure comprises hydrophilic domains and hydrophobic domains, the hydrophilic domains comprising a hydrophilic block of the amphiphilic block copolymer material, the hydrophobic domains comprising a hydrophobic block and without the metal oxide.

3. The self-assembled nanostructure of claim 1 , wherein the block copolymer material comprises a more polar block and a less polar block, and wherein the self-assembled nanostructure comprises more polar domains and less polar domains, the more polar domains comprising the more polar block and the metal oxide, the less polar domains comprising the less polar block and without the metal oxide.

4. A semiconductor structure comprising a self-assembled nanostructure on a patterned material, the self-assembled nanostructure comprising:

first self-assembled domains and second self-assembled domains,

each of the first self-assembled domains comprising at least a first portion and a second portion continuous with the first portion, the first portion comprising a first block of a block copolymer material and a first metal oxide, the second portion comprising the first block of the block copolymer material and a second metal oxide, the second metal oxide comprising a different metal than the first metal oxide, and

the second self-assembled domains comprising a second block of the block copolymer material and without any metal oxide.

5. The semiconductor structure of claim 4 , wherein the self-assembled nanostructure comprises alternating first and second self-assembled lamellar domains perpendicular to the patterned material, the first self-assembled lamellar domains comprising the first block of the block copolymer material and the first metal oxide, and the second self-assembled lamellar domains comprising the second block of the block copolymer material and without any metal oxide.

6. The semiconductor structure of claim 4 , wherein the first self-assembled domains further comprises a third portion, the third portion comprising the first block of a block copolymer material and a third metal oxide.

7. The semiconductor structure of claim 6 , wherein each of the first, second, and third metal oxides is independently selected from the group consisting of titanium oxide, aluminum oxide, zirconium oxide, hafnium oxide, silicon oxide, and combinations thereof.

8. The semiconductor structure of claim 4 , wherein the patterned material is a topographically patterned material, a chemically patterned material, or a combination thereof.

9. A semiconductor structure comprising a self-assembled nanostructure on a material, the self-assembled nanostructure comprising self-assembled domains in a matrix, the self-assembled domains comprising at least a first portion and a second portion, the first portion comprising a first block of a block copolymer material and a first metal oxide, the second portion comprising the first block of the block copolymer material and a second metal oxide, each self-assembled domain of the self-assembled domains comprising the first portion and the second portion in contact with one another, metals of the first metal oxide and the second metal oxide being different, and the matrix comprising a second block of the block copolymer material and without any metal oxide.

10. The semiconductor structure of claim 9 , wherein the block copolymer material is selected from the group consisting of poly(styrene)-b-poly(methylmethacrylate) (PS-b-PMMA), poly(styrene)-b-polyacrylate (PS-b-PA), poly(styrene)-b-poly(methacrylate) (PS-b-PMA), poly(styrene)-b-poly(vinylpyridine) (PS-b-PVP), poly(styrene)-b-poly(lactide) (PS-b-PLA), poly(styrene)-b-poly(tert-butyl acrylate) (PS-b-PtBA), poly(styrene)-b-poly(ethylene-co-butylene (PS-b-(PS-co-PB)), poly(styrene)-b-poly(ethylene oxide) (PS-b-PEO), poly(isoprene)-b-poly(ethyleneoxide) (PI-b-PEO), poly(isoprene)-b-poly(methylmethacrylate) (PI-b-PMMA), poly(butadiene)-b-poly(ethyleneoxide) (PBD-b-PEO), polystyrene-block-polydimethylsiloxane (PS-b-PDMS), polyethyleneoxide-b-polymethylmethacrylate (PEO-b-PMMA), polystyrene-b-poly(9,9-bis(6′,N,N,N-trimethylammonium)hexyl)-fluorene phenylene) (PS-b-PFP), polyethylethylene-b-polyethyleneoxide (PEE-b-PEO), polystyrene-b-polyisoprene (PS-b-PI), polystyrene-b-polybutadiene (PS-b-PBD), polystyrene-b-polyferrocenyldimethylsilane (PS-b-PFS), polybutadiene-b-polyvinylpyridine (PBD-b-PVP), poly(styrene)-b-PEO block copolymer having a cleavable junction between PS and PEO blocks, poly(styrene)-b-poly(methylmethacrylate) doped with PEO-coated gold nanoparticles, poly(styrene)-b-poly(2-vinylpyridine) (PS-b-P2VP) block copolymer having a cleavable junction, polystyrene-h-methyl methacrylate-b-ethylene oxide) (PS-b-PMMA-b-PEO), poly(styrene-b-methyl methacrylate-b-styrene) (PS-PMMA-PS), poly(methyl methacrylate-b-styrene-b-methyl methacrylate) (PMMA-PS-PMMA), poly(styrene-b-poly(isoprene)-b-styrene) (PS-b-PI-b-PS), and combinations thereof.

11. The semiconductor structure of claim 9 , wherein a metal of the first metal oxide comprises one of titanium (Ti), aluminum (Al), zirconium (Zr), hafnium (Hf), silicon (Si), and combinations thereof and a metal of the second metal comprises another of titanium (Ti), aluminum (Al), zirconium (Zr), hafnium (Hf), silicon (Si), and combinations thereof.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
SUPPLEMENT NO. 10 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Continuity (3)
Division 14920018 · Oct 22, 2015
Division 14040245 · Sep 27, 2013
Related Publication 20180337035A1 · Nov 22, 2018