IP Library Granted Patent US 10,411,707
Granted Patent B1
US 10,411,707 · App. 16/051,117 · Granted Sep 10, 2019

Systems and methods for improving signal margin for input buffer circuits

Inventor: Hyun Yoo Lee (Boise, ID)
Assignee: Micron Technology, Inc.
H03K19/01855H03F3/4508H03F3/45376
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Quick Facts
Patent No.
US 10,411,707
App. No.
16/051,117
Granted
Sep 10, 2019
Kind
B1
Abstract

An input buffer circuit may include a first switch that may couple a first voltage source to an output line based on an enable signal, such that the enable signal is configured to cause the input buffer circuit to operate. The input buffer circuit may also include a first set of switches that may couple the first voltage source to the output line based on the enable signal and an input signal, wherein the first switch and the first set of switches may couple the first voltage source to the output line in response to the input signal being greater than an input reference signal. The input buffer circuit may also include a switch that may couple a second voltage source to the output line in response to the input signal being less than the input reference signal.

Claims (33)

1. An input buffer circuit, comprising:

a first switch configured to couple a first voltage source to an output line based on an enable signal, wherein the enable signal is configured to cause the first switch to couple the first voltage source to the output line to output a voltage via the output line;

a first set of switches configured to couple the first voltage source to the output line based on the enable signal and an input signal, wherein the first set of switches is configured to couple the first voltage source to the output line in response to the input signal being greater than an input reference signal, and wherein the first set of switches is configured to amplify the voltage output via the output line; and

a second switch configured to couple a second voltage source to the output line in response to the input signal being less than the input reference signal.

2. The input buffer circuit of claim 1 , comprising a variable resistor configured to couple to an input line configured to receive the input signal.

3. The input buffer circuit of claim 2 , comprising an additional variable resistor configured to couple to an input reference line configured to receive the input reference signal.

4. The input buffer circuit of claim 1 , comprising a variable resistor configured to couple to an input reference line configured to receive the input reference signal.

5. The input buffer of claim 1 , wherein the first set of switches are coupled in series with each other.

6. The input buffer of claim 1 , wherein a first one of the first set of switches is configured to receive the input signal and a second one of the first set of switches is configured to receive the enable signal.

7. The input buffer of claim 1 , wherein the first switch and the first set of switches comprise a plurality of P-type switches.

8. The input buffer of claim 1 , comprising a second set of switches configured to couple the second voltage source to the output line based on the enable signal and the input signal, wherein the second switch and the second set of switches are configured to couple the second voltage source to the output line in response to the input signal being less than the input reference signal.

9. The input buffer of claim 8 , wherein the second switch and the second set of switches comprise a plurality of N-type switches.

10. A semiconductor device comprising:

a buffer circuit configured to receive:

a data signal representative of a logic high value or a logic low value; and

an enable signal configured to cause the buffer circuit to operate;

a differential op-amp circuit configured to:

receive the data signal at a first switch of a plurality of switches configured to couple a first voltage source to an output line of the differential op-amp circuit;

receive the enable signal at a second switch;

couple the first voltage source to the output line of the differential op-amp circuit via the plurality of switches and the second switch in response to the data signal being less than a reference signal and the enable signal being received at the second switch, wherein the first voltage source is coupled to the output line via two separate current paths, and wherein each of the two separate current paths comprise the first switch and the second switch, respectively; and

couple a second voltage source to the output line in response to the data signal being greater than the reference signal.

11. The semiconductor device of claim 10 , wherein a first current path of the two separate current paths comprises comprises at least two switches.

12. The semiconductor device of claim 10 , wherein the differential op-amp circuit is configured to couple the second voltage source to the output line via two additional separate current paths.

13. The semiconductor device of claim 12 , wherein a first additional current path of the two separate additional current paths comprises a first additional switch, and wherein a second additional current path of the two separate additional current paths comprises at least two switches.

14. The semiconductor device of claim 12 , wherein the enable signal is configured to cause the differential op-amp circuit to operate.

15. The semiconductor device of claim 10 , wherein the buffer circuit comprises an address input circuit or a command input circuit.

16. The semiconductor device of claim 10 , wherein the differential op-amp circuit comprises a variable resistor configured to couple to an input line configured to receive the data signal.

17. A method, comprising:

receiving, via a circuit, an input signal at a first switch of the circuit; and

coupling, via the circuit, an output line to a first voltage source via at least two current paths in response to the input signal being less than an input reference signal and an enable signal being received at the circuit, wherein a first current path of the at least two current paths comprises the first switch, wherein a second current path of the at least two current paths comprises at least two switches, and wherein one of the at least two switches is configured to close in response to the enable signal being received at the one of the at least two switches.

18. The method of claim 17 , wherein the first switch and the at least two switches comprise P-type switches.

19. The method of claim 17 , comprising coupling, via the circuit, the output line to a second voltage source via at least two additional current paths in response to the input signal being greater than the input reference signal, wherein a first additional current path of the at least two additional current paths comprises a second switch, and wherein a second additional current path of the at least two additional current paths comprises at least two additional switches.

20. The method of claim 19 , wherein the second switch and the at least two additional switches comprise N-type switches.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →
RELEASE OF SECURITY INTEREST Recorded Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
SUPPLEMENT NO. 10 TO PATENT SECURITY AGREEMENT Recorded Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2018
From: LEE, HYUN YOO
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046522/0499 →
Cited By (1)
US 12,712,545