IP Library Granted Patent US 10,862,232
Granted Patent B2
US 10,862,232 · App. 16/052,809 · Granted Dec 8, 2020

Circuit board pad connector system

Inventors: Umesh Chandra (Santa Cruz, CA); Bhyrav M. Mutnury (Austin, TX)
Assignee: Dell Products L.P.
H01R12/57H01R43/205H05K1/111H05K1/181H05K2201/1031
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Quick Facts
Patent No.
US 10,862,232
App. No.
16/052,809
Granted
Dec 8, 2020
Kind
B2
Abstract

A circuit board pad connector system includes a connector that is configured to mount to a connector pad that is included on a circuit board. The connector includes a connector lead frame. A lead portion is provided on the connector lead frame such that the lead portion is oriented substantially perpendicularly relative to the connector pad when the connector is mounted to the connector pad. A first mounting portion is provided on the connector lead frame, is configured to mount the connector to the connector pad, and extends in a first direction that is substantially perpendicular relative to the lead portion. A second mounting portion is provided on the connector lead frame, is configured to mount the connector to the connector pad, and extends in a second direction that is different than the first direction and that is substantially perpendicular relative to the lead portion.

Claims (36)

1. A circuit board pad connector system, comprising:

a connector pad that is included on a circuit board, wherein the connector pad includes at least one of a first end or a second end having a first width that is less than a second width of the connector pad, and wherein the second end of the connector pad is opposite the connector pad from the first end;

a transmission line that extends from only the first end of the connector pad, wherein the transmission line is the only transmission line that extends from the connector pad; and

a connector that is mounted to the connector pad, wherein the connector includes:

a connector lead frame;

a lead portion that is provided on the connector lead frame such that the lead portion is oriented substantially perpendicularly relative to the connector pad when the connector is mounted to the connector pad;

a first mounting portion that is provided on the connector lead frame such that the first mounting portion extends in a first direction that is substantially perpendicular relative to the lead portion, wherein the first mounting portion includes a first length, and wherein the first mounting portion mounts the connector to the connector pad adjacent the second end of the connector pad; and

a second mounting portion that is provided on the connector lead frame such that the second mounting portion extends in a second direction that is different than the first direction and that is substantially perpendicular relative to the lead portion, wherein the second mounting portion includes a second length that is greater than the first length, and wherein the second mounting portion mounts the connector to the connector pad such that the second mounting portion is adjacent the first end of the connector pad.

2. The system of claim 1 , further comprising:

a first arcuate portion that is provided on the connector lead frame and that extends between the lead portion and the first mounting portion; and

a second arcuate portion that is provided on the connector lead frame and that extends between the lead portion and the second mounting portion.

3. The system of claim 1 , wherein the second direction in which the second mounting portion extends from the connector lead frame is substantially 180 degrees opposite the first direction in which the first mounting portion extends from the connector lead frame.

4. An Information Handling System (IHS), comprising:

a board;

a device coupled to the board;

a first connector pad that is located on the board and that is coupled to the device via a transmission line that extends from only a first end of the first connector pad, wherein the transmission line is the only transmission line that extends from the first connector pad, and wherein the first connector pad includes at least one of the first end or a second end having a first width that is less than a second width of the first connector pad, and wherein the second end is opposite the first connector pad from the first end; and

a connector that is mounted to the first connector pad, wherein the connector includes:

a connector lead frame;

a lead portion that is provided on the connector lead frame such that the lead portion is oriented substantially perpendicularly relative to the first connector pad;

a first mounting portion that mounts the connector to the first connector pad adjacent the second end of the first connector pad, wherein the first mounting portion includes a first length and is provided on the connector lead frame such that the first mounting portion extends in a first direction that is substantially perpendicular relative to the lead portion; and

a second mounting portion that mounts the connector to the first connector pad adjacent the first end of the first connector pad, wherein the second mounting portion is provided on the connector lead frame such that the second mounting portion extends in a second direction that is different than the first direction and that is substantially perpendicular relative to the lead portion, and wherein the second mounting portion includes a second length that is greater than the first length.

5. This IHS of claim 4 , wherein the connector includes:

a first arcuate portion that is provided on the connector lead frame and that extends between the lead portion and the first mounting portion; and

a second arcuate portion that is provided on the connector lead frame and that extends between the lead portion and the second mounting portion.

6. This IHS of claim 4 , wherein the second direction in which the second mounting portion extends from the connector lead frame is substantially 180 degrees opposite the first direction in which the first mounting portion extends from the connector lead frame.

7. This IHS of claim 4 , wherein the connector is a Surface Mount Technology (SMT) connector.

8. This IHS of claim 4 , further comprising:

a second connector pad that is located on the board and that utilizes a second connector pad area on the board, wherein the first connector pad utilizes a first connector pad area on the board that is smaller than the second connector pad area.

9. A method for providing a connector on a circuit board pad; comprising:

providing a board that is coupled to a device and that includes a first connector pad that is coupled to the device via a transmission line that extends from only a first end of the first connector pad, wherein the transmission line is the only transmission line that extends from the first connector pad, wherein the first connector pad includes at least one of the first end or a second end having a first width that is less than a second width of the first connector pad, wherein the second end of the first connector pad is opposite the first connector pad from the first end;

mounting a first mounting portion that is provided on a connector lead frame to the first connector pad adjacent the second end the first connector pad, wherein the first mounting portion includes a first length and extends from the connector lead frame in a first direction; and

mounting a second mounting portion that is provided on the connector lead frame to the first connector pad adjacent the first end of the first connector pad, wherein the second mounting portion extends from the connector lead frame in a second direction that is different than the first direction and includes a second length that is greater than the first length of the first mounting portion, and wherein the mounting of the first mounting portion and the second mounting portion of the connector lead frame to the first connector pad orients a lead portion that is provided on the connector lead frame substantially perpendicularly relative to the first connector pad.

10. The method of claim 9 , wherein a first arcuate portion is provided on the connector lead frame and extends between the lead portion and the first mounting portion, and wherein a second arcuate portion is provided on the connector lead frame and extends between the lead portion and the second mounting portion.

11. The method of claim 9 , wherein the second direction in which the second mounting portion extends from the connector lead frame is substantially 180 degrees opposite the first direction in which the first mounting portion extends from the connector lead frame.

12. The method of claim 9 , wherein the connector is a Surface Mount Technology (SMT) connector.

13. The method of claim 9 , wherein a second connector pad is located on the board and utilizes a second connector pad area on the board, and wherein the first connector pad utilizes a first connector pad area on the board that is smaller than the second connector pad area.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (047648/0422) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060160/0862 →
RELEASE OF SECURITY INTEREST AT REEL 047648 FRAME 0346 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0510 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 12, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 047648/0422 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Oct 12, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 047648/0346 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2018
From: CHANDRA, UMESH; MUTNURY, BHYRAV M.
To: DELL PRODUCTS L.P.
Reel/Frame 047014/0206 →