IP Library Granted Patent US 11,009,924
Granted Patent B2
US 11,009,924 · App. 16/054,098 · Granted May 18, 2021

Systems and methods for combined active and passive cooling of an information handling resource

Inventors: Hasnain Shabbir (Round Rock, TX); Carlos Guillermo Henry (Round Rock, TX)
Assignee: Dell Products L.P.
G06F1/20H05K7/20809G06F1/203G06F1/206G06F2200/201
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Quick Facts
Patent No.
US 11,009,924
App. No.
16/054,098
Granted
May 18, 2021
Kind
B2
Abstract

Heat-rejecting media may thermally couple to a device, and the heat-rejecting media may include active heat-rejecting media configured to thermally couple to the device and thermally couple between the device and an active cooling system such that the active cooling system causes heat transferred to the active heat-rejecting media from the device to be transferred from the active heat-rejecting media and passive heat-rejecting media extending from the active heat-rejecting media and configured to thermally couple to the device and thermally couple between the device and a system-level air mover other than the active cooling system and configured to drive airflow to components of a system comprising the device such that the heat transferred to the passive heat-rejecting media from the device is transferred to the airflow driven by the system-level air mover.

Claims (20)

1. An information handling system comprising:

a system-level air mover configured to drive airflow to a plurality of components of the information handling system;

an information handling resource; and

heat-rejecting media thermally coupled to the information handling resource, the heat-rejecting media comprising:

active heat-rejecting media comprising a heatsink thermally coupled to the information handling resource and a local air mover mechanically coupled directly to the heatsink; and

passive heat-rejecting media extending from the active heat-rejecting media and thermally coupled to the active heat-rejecting media via one or more heat pipes, wherein the passive heat-rejecting media does not have an air mover mechanically coupled directly thereto, and wherein the passive heat-rejecting media is downstream of the system-level air mover and configured to be cooled by the airflow driven by the system-level air movers;

wherein the system-level air mover is configured to drive airflow to both the active heat-rejecting media and the passive heat-rejecting media, and wherein the active heat-rejecting media is downstream of the passive heat-rejecting media in the airflow driven by the system-level air mover.

2. The information handling system of claim 1 , wherein the active heat-rejecting media has a two-dimensional footprint equivalent to that of the information handling resource, and wherein the passive heat-rejecting media extends outside the two-dimensional footprint.

3. The information handling system of claim 1 , wherein the passive heat-rejecting media is arranged with respect to the system-level air mover in order to maximize surface area of the passive heat-rejecting media upon which airflow generated by the system-level air mover impinges.

4. Heat-rejecting media configured to be thermally coupled to an information handling resource, the heat-rejecting media comprising:

active heat-rejecting media comprising a heatsink configured to thermally couple to the information handling resource and further comprising a local air mover mechanically coupled directly to the heatsink; and

passive heat-rejecting media extending from the active heat-rejecting media and thermally coupled to the active heat-rejecting media via one or more heat pipes, wherein the passive heat-rejecting media does not have an air mover mechanically coupled directly thereto, and wherein the passive heat-rejecting media is downstream of a system-level air mover that is configured to drive airflow to a plurality of components of an information handling system comprising the information handling resource, the passive heat-rejecting media configured to be cooled by the airflow driven by the system-level air mover, wherein the system-level air mover is configured to drive airflow to both the active heat-rejecting media and the passive heat-rejecting media, and wherein the active heat-rejecting media is downstream of the passive heat-rejecting media in the airflow driven by the system-level air mover.

5. The heat-rejecting media of claim 4 , wherein the active heat-rejecting media has a two-dimensional footprint equivalent to that of the information handling resource, and wherein the passive heat-rejecting media extends outside the two-dimensional footprint.

6. The heat-rejecting media of claim 4 , wherein the passive heat-rejecting media is arranged with respect to the system-level air mover in order to maximize surface area of the passive heat-rejecting media upon which airflow generated by the system-level air mover impinges.

7. A method for forming heat-rejecting media configured to be thermally coupled to an information handling resource, the method comprising:

thermally coupling active heat-rejecting media comprising a heatsink and a local air mover mechanically coupled directly to the heatsink to passive heat-rejecting media via one or more heat pipes, such that:

the active heat-rejecting media is configured to thermally couple to the information handling resource; and

the passive heat-rejecting media extends from the active heat-rejecting media, wherein the passive heat-rejecting media does not have an air mover mechanically coupled directly thereto, and wherein the passive heat-rejecting media is downstream of a system-level air mover that is configured to drive airflow to a plurality of components of an information handling system comprising the information handling resource, the passive heat-rejecting media configured to be cooled by the airflow driven by the system-level air mover, wherein the system-level air mover is configured to drive airflow to both the active heat-rejecting media and the passive heat-rejecting media, and wherein the active heat-rejecting media is downstream of the passive heat-rejecting media in the airflow driven by the system-level air mover.

8. The method of claim 7 , further comprising forming the active heat-rejecting media to have a two-dimensional footprint equivalent to that of the information handling resource, wherein the passive heat-rejecting media extends outside the two-dimensional footprint.

9. The method of claim 7 , further comprising arranging the passive heat-rejecting media with respect to the system-level air mover in order to maximize surface area of the passive heat-rejecting media upon which airflow generated by the system-level air mover impinges.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (047648/0422) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060160/0862 →
RELEASE OF SECURITY INTEREST AT REEL 047648 FRAME 0346 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0510 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Oct 12, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 047648/0346 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 12, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 047648/0422 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2018
From: SHABBIR, HASNAIN; HENRY, CARLOS GUILLERMO
To: DELL PRODUCTS L.P.
Reel/Frame 046549/0080 →