Three-dimensional object fabrication method, fabrication apparatus, and fabrication system
A fabrication method includes laminating a fabrication material to form an object, and applying a release material on a surface of the object to form a release layer on the surface of the object. A surface free energy of the release material is equal to or smaller than 25 mN/m.
1. A fabrication method comprising:
laminating a fabrication material to form an object; and
applying a release material to a surface of the object to form a release layer on the surface of the object, a surface free energy of the release material being equal to or smaller than 25 mN/m, wherein a solubility parameter (SP) value of the release material is relatively smaller than an SP value of the fabrication material.
2. The fabrication method according to claim 1 , further comprising:
heating the object on which the release layer is applied to a temperature at which the fabrication material melts;
cooling the object on which the release layer is attached to solidify the fabrication material after the heating; and
peeling the release layer off the object.
3. The fabrication method according to claim 2 , wherein the heating:
places the object on which the release layer is applied in a tank;
fills a filler around the object; and
heats the object around which the filler fills in the tank.
4. The fabrication method according to claim 3 , wherein the filler includes a copper-iron alloy.
5. The fabrication method according to claim 2 , wherein the heating:
covers the object on which the release layer is applied with a film; and
heats the object covered with the film while depressurizing a space inside the film.
6. The fabrication method according to claim 2 , wherein the heating heats the object on which the release layer is applied while depressurizing a space between the object and the release layer.
7. The fabrication method according to claim 1 , wherein a line expansion rate of the release material is relatively larger than a line expansion rate of the fabrication material.
8. The fabrication method according to claim 1 , wherein:
a specific gravity of the fabrication material is larger than one; and
a specific gravity of the release material is smaller than one.
9. The fabrication method according to claim 1 , wherein:
a specific gravity of the fabrication material is smaller than one; and
a specific gravity of the release material is larger than one.
10. The fabrication method according to claim 1 , wherein a difference of a specific gravity of the fabrication material and a specific gravity of the release material is equal to or larger than 0.3.
11. The fabrication method according to claim 1 , wherein the release material includes polymethylpentene (PMP) as a main component.
12. The fabrication method according to claim 1 , wherein the release material contains at least one of substance selected from a group consisting of tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-perfluoroalkylvinylether copolymer (PFA), modified polytetrafluoroethylene (PTFE), and polyvinylidene fluoride (PVDF).
13. The fabrication method according to claim 1 , wherein a melting point of the release material is relatively higher than a melting point of the fabrication material.
14. The fabrication method according to claim 1 , wherein the object includes a supporting structure to form a void in the object, and the supporting structure includes a support material and the release material.
15. A fabrication apparatus for manufacturing an object, the fabrication apparatus comprising:
a first image forming unit device to laminate a layer of a fabrication material, the first image forming device including a first carrier, a surface of the first carrier being composed of an electron-beam irradiated crosslinked fluororesin; and
a second image forming device to form a layer of a release material including a surface free energy equal to or smaller than 25 mN/m, on a surface of the layer of the fabrication material.
16. The fabrication apparatus according to claim 15 , wherein:
the first image forming device includes:
a first photoconductor;
a first charging device to charge the first photoconductor;
a first exposure device to irradiate the first photoconductor with light to form a first latent image on the first photoconductor;
a first developing device to apply the fabrication material to the first latent image to form a first, image; and
a first transfer device to transfer the first image onto a first carrier; and
the second image forming device includes:
a second photoconductor;
a second charging device to charge the second photoconductor;
a second exposure device to irradiate the second photoconductor with light to form a second latent image on the second photoconductor;
a second developing device to apply the release material to the second latent image to form a second image; and
a second transfer device to transfer the second image onto a second carrier.
17. The fabrication apparatus according to claim 16 , wherein a base of the first carrier is composed of an alloy.
18. A fabrication system for manufacturing an object, the fabrication system comprising:
a fabrication apparatus including
a first image forming device to laminate a layer of a fabrication material, and
a second image forming device to form a layer of a release material, including a surface free energy equal to or smaller than 25 mN/m, on a surface of the layer of the fabrication material;
a heating and cooling device to heat the fabrication material on which the release layer is formed at a temperature at which the fabrication material melts and cool the object on which the release layer is attached to solidify the fabrication material; and
a peeling device to peel the release layer of the object.
19. The fabrication system according to claim 18 , wherein:
the first image forming device of the fabrication apparatus includes:
a first photoconductor;
a first charging device to charge the first photoconductor;
a first exposure device to irradiate the first photoconductor with light to form a first latent image on the first photoconductor;
a first developing device to apply the fabrication material to the first latent image to form a first image; and
a first transfer device to transfer the first image onto a first carrier; and
the second image forming device of the fabrication apparatus includes:
a second photoconductor;
a second charging device to charge the second photoconductor;
a second exposure device to irradiate the second photoconductor with light to form a second latent image on the second photoconductor;
a second developing device to apply the release material to the second latent image to form a second image; and
a second transfer device to transfer the second image onto a second carrier.
20. The fabrication system according to claim 19 , wherein:
a first carrier, a surface of the first carrier being composed of an electron-beam irradiated crosslinked fluororesin.