Hinged laminated body, layout sheet for hinged laminated body, and manufacturing method for hinged laminated body
A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body, equipped with: an IC module having an IC chip capable of performing contactless communication; a hinge layer having a hinge section which can be bound into a booklet; a non-hinge layer which is laminated onto the hinge layer and does not have a hinge part, wherein the hinge layer is disposed over the entire surface of the laminated body having the hinge, the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and the IC module is housed and held inside the housing hole.
1. A hinged laminated body comprising:
an IC module having an IC chip capable of performing contactless communication;
a hinge layer having a hinge section bindable into a booklet; and
a non-hinge layer which is laminated on the hinge layer and does not have a hinge section,
wherein the hinge layer is provided on an entire surface of the hinged laminated body,
the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and
the IC module is housed and held in the housing hole
wherein the IC module further has a mounted substrate on one surface of which the IC chip is mounted,
a width of the mounted substrate is larger than a width of the IC chip in a cross-sectional view, and
the housing hole is divided into a first housing hole on a side of the hinge layer and a second housing hole on a side of the non-hinge layer in the cross-sectional view, the first housing hole houses one of the mounted substrate and the IC chip, and the second housing hole houses the other one of the mounted substrate and the IC chip.
2. The hinged laminated body according to claim 1 ,
wherein the first housing hole or the second housing hole housing the IC chip has a width not allowing the mounted substrate to be housed.
3. The hinged laminated body according to claim 1 ,
wherein a melting temperature of the hinge layer is different from a melting temperature of the non-hinge layer.
4. The hinged laminated body according to claim 1 , further comprising
an antenna connected to the IC chip,
wherein one of or both the hinge layer and the non-hinge layer have an antenna buried groove in which the antenna is buried.
5. The hinged laminated body according to claim 1 , further comprising:
an upper layer laminated on an upper side of the hinge layer and the non-hinge layer; and
a lower layer laminated on a lower side of the hinge layer and the non-hinge layer.
6. A layout sheet for a hinged laminated body in which a plurality of hinged laminated bodies according to claim 1 is arranged.
7. A booklet in which the hinged laminated body according to claim 1 is bound at the hinge section included in the hinged laminated body.
8. A hinged laminated body comprising:
an IC module having an IC chip capable of performing contactless communication;
an antenna connected to the IC chip; and
a hinge layer having a hinge section bindable into a booklet,
an upper layer laminated on an upper side of the hinge layer and the thickness adjustment layer; and
a lower layer laminated on a lower side of the hinge layer and the thickness adjustment layer,
wherein the hinge layer is laminated on a part of the hinged laminated body when an upper surface of the hinged laminated body is viewed from the upper side in the thickness direction, and
the hinged laminated body further comprises a thickness adjustment layer which is laminated at a same position as a position of the hinge layer in a thickness direction, has a thickness corresponding to the hinge layer, and holds at least one of the IC module and the antenna,
wherein the hinge layer and/or the thickness adjustment layer has translucency,
the upper layer includes an upper layer window portion through which a part of the hinge layer and the thickness adjustment layer is visually recognizable, and
the lower layer includes a lower layer window portion through which a part of the hinge layer and the thickness adjustment layer is visually recognizable and which is provided in a region overlapping the upper layer window portion.
9. The hinged laminated body according to claim 8 ,
wherein the thickness adjustment layer forms at least a part of a housing hole that holds the IC module by housing the IC module therein.
10. The hinged laminated body according to claim 8 , further comprising
a housing hole that houses the IC module,
wherein the thickness adjustment layer covers an opening of the housing hole.
11. The hinged laminated body according to claim 8 , further comprising
an antenna buried layer having an antenna buried groove in which the antenna is buried,
wherein the thickness adjustment layer holds the antenna by covering an opening of the antenna buried groove of the antenna buried layer.
12. The hinged laminated body according to claim 8 ,
wherein the thickness adjustment layer includes an antenna buried groove in which the antenna is buried.
13. A layout sheet for a hinged laminated body in which a plurality of hinged laminated bodies according to claim 8 is arranged.
14. A booklet in which the hinged laminated body according to claim 8 is bound at the hinge section included in the hinged laminated body.
15. A layout sheet for a hinged laminated body in which a plurality of hinged laminated bodies is arranged,
wherein the hinged laminated body includes:
an IC chip capable of performing contactless communication;
an antenna connected to the IC chip; and
a hinge layer having a hinge section bindable into a booklet,
wherein hinge sections of adjacent hinged laminated bodies are disposed on opposite sides of the layout sheet for a hinged laminated body.
16. The layout sheet for a hinged laminated body according to claim 15 ,
wherein the hinge section protrudes at a side surface on a bound side.
17. The layout sheet for a hinged laminated body according to claim 15 ,
wherein hinge sections of adjacent hinged laminated bodies are disposed along at least one side of the layout sheet for a hinged laminated body.
18. The layout sheet for a hinged laminated body according to claim 15 ,
wherein a hinge layer sheet material in which hinge layers of the plurality of hinged laminated bodies are arranged is laminated exclusively at an edge of a side along a side surface from which the hinge section protrudes.
19. The layout sheet for a hinged laminated body according to claim 15 ,
wherein a hinge layer sheet material in which hinge layers of the plurality of hinged laminated bodies are arranged is larger than an external shape of another sheet material of the layout sheet for a hinged laminated body and is laminated on an entire surface of the layout sheet for a hinged laminated body.
20. The layout sheet for a hinged laminated body according to claim 15 ,
wherein hinge sections of adjacent hinged laminated bodies are disposed along at least one side of the layout sheet for a hinged laminated body, and
a hinge layer sheet material in which hinge layers of the adjacent hinged laminated bodies are arranged is laminated exclusively at an edge along at least the one side.
21. A method of manufacturing a hinged laminated body using the layout sheet for the hinged laminated body according to claim 15 , the method comprising:
an individual piece separation process of separating the hinged laminated bodies into individual pieces such that the hinge sections remain by cutting the layout sheet for the hinged laminated body.
22. A method of manufacturing a hinged laminated body using the layout sheet for the hinged laminated body according to claim 15 , the method comprising:
an upper layer lamination process of laminating an upper layer layout sheet in which a plurality of upper layers is arranged on the layout sheet for the hinged laminated body;
a lower layer lamination process of laminating a lower layer layout sheet in which a plurality of lower layers is arranged on the layout sheet for the hinged laminated body;
a hot pressing process of thermally welding layers of the layout sheet for the hinged laminated body at interfaces thereof, and the upper layer layout sheet and the lower layer layout sheet; and
an individual piece separation process of separating the hinged laminated bodies into individual pieces such that the hinge sections remain by cutting the thermally welded layers.
23. A layout sheet for a hinged laminated body in which a plurality of hinged laminated bodies is arranged,
wherein the hinged laminated body includes:
an IC chip capable of performing contactless communication;
an antenna connected to the IC chip;
a hinge layer having a hinge section bindable into a booklet; and
hinge sections of adjacent hinged laminated bodies are disposed on an inside of the layout sheet for a hinged laminated body, and the adjacent hinged laminated bodies are connected through the hinge sections thereof,
wherein the hinge layer of the hinged laminated body is laminated exclusively at an edge of a side along a side surface from which the hinge section protrudes.
24. The layout sheet for a hinged laminated body according to claim 23 ,
wherein the hinge section protrudes at a side surface on a bound side.
25. The layout sheet for a hinged laminated body according to claim 23 ,
wherein a hinge layer sheet material in which hinge layers of the plurality of hinged laminated bodies are arranged is larger than an external shape of another sheet material of the layout sheet for a hinged laminated body and is laminated on an entire surface of the layout sheet for a hinged laminated body.
26. A hinged laminated body comprising:
an IC module having an IC chip capable of performing contactless communication;
a hinge layer having a hinge section bindable into a booklet; and
a non-hinge layer which is laminated on the hinge layer and does not have a hinge section,
an upper layer laminated on an upper side of the hinge layer and the non-hinge layer; and
a lower layer laminated on a lower side of the hinge layer and the non-hinge layer,
wherein the hinge layer is provided on an entire surface of the hinged laminated body,
the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and
the IC module is housed and held in the housing hole
wherein the hinge layer and the non-hinge layer have translucency,
the upper layer includes an upper layer window portion through which a part of one of the hinge layer and the non-hinge layer close to the upper layer is visually recognizable, and
the lower layer includes a lower layer window portion through which a part of one of the hinge layer and the non-hinge layer close to the lower layer is visually recognizable and which is provided in a region overlapping the upper layer window portion.