NTC ceramic part, electronic component for inrush current limiting, and method for manufacturing an electronic component

1. A Negative Temperature Coefficient (NTC) ceramic part for use in an electronic component for inrush current limiting, the NTC ceramic part comprising:

La (1-x) EA (x) Mn (1-a-b-c) Fe (a) Co (b) Ni (c) O (3±δ) ,

wherein 0≤x≤0.5 and 0≤(a+b+c)≤0.5,

wherein La denotes lanthanum, Mn denotes manganese, Fe denotes iron, Co denotes cobalt, Ni denotes nickel, and O denotes oxygen,

wherein EA denotes an alkaline earth metal element, which is selected from the group consisting of magnesium, strontium and barium,

wherein δ denotes a deviation from a stoichiometric oxygen ratio, and

wherein the NTC ceramic part has an electrical resistance of 30 mΩ or smaller at a temperature of 25° C.

2. The NTC ceramic part according to claim 1 , wherein |δ|≤0.5.

3. An electronic component comprising:

at least one functional layer,

wherein the functional layer comprises a Negative Temperature Coefficient (NTC) ceramic part configured to limit inrush current,

wherein the NTC ceramic part comprises La (1-x) EA (x) Mn (1-a-b-c) Fe (a) Co (b) Ni (c) O (3±δ) ,

wherein 0≤x≤0.5 and 0≤(a+b+c)≤0.5,

wherein La denotes lanthanum, Mn denotes manganese, Fe denotes iron, Co denotes cobalt, Ni denotes nickel, and O denotes oxygen,

wherein EA denotes an alkaline earth metal element, which is selected from the group consisting of magnesium, strontium, and barium,

wherein δ denotes a deviation from a stoichiometric oxygen ratio, and

wherein the NTC ceramic part has an electrical resistance of 30 mΩ or smaller at a temperature of 25° C.

4. The electronic component according to claim 3 , wherein an electrical resistivity at a temperature of 25° C. of the at least one functional layer is between 0.1 Ω·cm and 2.0 Ω·cm.

5. The electronic component according to claim 3 , wherein the electronic component has a thickness of less than or equal to 1.0 mm.

6. The electronic component according to claim 3 , wherein the electronic component is a monolithic component.

7. The electronic component according to claim 6 , wherein the electronic component comprises exactly one functional layer, wherein the functional layer has a thickness of less than or equal to 1.0 mm, and wherein a metallization is arranged on the functional layer.

8. The electronic component according to claim 7 , wherein the metallization comprises silver, copper or gold.

9. The electronic component according to claim 3 , wherein the electronic component is a multilayer component.

10. The electronic component according to claim 9 , wherein the electronic component comprises a plurality of functional layers, first internal electrodes and second internal electrodes arranged one above another to form a stack, wherein each of the first and second internal electrodes is arranged between two adjacent functional layers, wherein the first internal electrodes are electrically conductively connected to a first external contact and the second internal electrodes are electrically conductively connected to a second external contact, and wherein the functional layers are arranged and configured such that both, the first and second external contacts, in a basic state and in a hot state of the electronic component, are electrically conductively connected to one another via the functional layers.

11. The electronic component according to claim 3 , wherein the electronic component is thermally linked at least to a heat sink in order to limit heating of the electronic component during operation of the electronic component, and wherein the heat sink comprises copper.

12. The electronic component according to claim 3 , wherein |δ|≤0.5.

13. A method for manufacturing the electronic component according to claim 3 , the method comprising:

providing a ceramic powder;

calcining the ceramic powder;

admixing the ceramic powder with water and a binder in order to produce a granulated material;

pressing the granulated material;

sintering the granulated material; and

contacting the sintered material with a silver paste.

14. A method for manufacturing the electronic component according to claim 3 , the method comprising:

providing green sheets;

printing the green sheets with internal electrodes;

stacking the green sheets comprising the internal electrodes to form a stack;

sintering the stack; and

forming external contacts at the stack.

15. A system comprising:

at least one electronic component according to claim 3 ; and

a consumer device electrically connected in series with the electronic component,

wherein both, the electronic component and the consumer device, are exposed to an ambient temperature, and

wherein the system is configured such that a heating time is coordinated with an electrical start-up time of the consumer device, which determines when an inrush current has fallen to a rated current of the consumer device.

16. The system according to claim 15 , wherein the system comprises three electronic components, and wherein the electronic components are connected in parallel with one another.

17. An electronic component comprising:

a plurality of functional layers; and

first internal electrodes and second internal electrodes arranged one above another to form a stack,

wherein each of the first and second internal electrodes is arranged between two adjacent functional layers,

wherein the first internal electrodes are electrically conductively connected to a first external contact and the second internal electrodes are electrically conductively connected to a second external contact,

wherein the functional layers are arranged such that both, the first and second external contacts, in a basic state and in a hot state of the electronic component, are electrically conductively connected to one another via the functional layers,

wherein the functional layer comprises a Negative Temperature Coefficient (NTC) ceramic part configured to inrush current limiting, and

wherein the NTC ceramic part has an electrical resistance of 30 mΩ or smaller at a temperature of 25° C.

18. The electronic component according to claim 17 , wherein an electrical resistivity at a temperature of 25° C. of the functional layers is between 0.1 Ω·cm and 2.0 Ω·cm.

19. The electronic component according to claim 17 , wherein the electronic component has a thickness of less than or equal to 1.0 mm.

20. The electronic component according to claim 17 , wherein the electronic component is thermally linked at least to a heat sink in order to limit heating of the electronic component during operation of the electronic component, and wherein the heat sink comprises copper.