IP Library Granted Patent US 10,800,079
Granted Patent B2
US 10,800,079 · App. 16/063,559 · Granted Oct 13, 2020

One-piece sensor for a bioelectrode and processes for production

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Quick Facts
Patent No.
US 10,800,079
App. No.
16/063,559
Granted
Oct 13, 2020
Kind
B2
Abstract

A process for producing a sensor for a biomedical electrode (e.g. an ECG electrode) involves injection molding an electrically conductive resin through a film of a backing material to form the sensor directly in the backing material and coating the contact face of the sensor with a non-polarizable conductive material (e.g. silver-containing material). Additional steps of applying an electrolyte over the non-polarizable conductive material coated on the contact face and applying a liner over the electrolyte results in the biomedical electrode. Biomedical electrode produced thereby have the sensor secured in a film of the backing material with a contact face of the sensor disposed on a first side of the film and a post of the sensor protruding from a second side of the film opposite the first side. The process permits production of one-piece sensors for bioelectrodes in a continuous fashion without the need for studs to retain sensors in a film of the backing material.

Claims (22)

1. A process for producing a sensor for a biomedical electrode, comprising: injection molding an electrically conductive resin through a film of a backing material at a resin temperature range of 230-275 degrees Celsius to form the sensor directly in and thermally bonded to the backing material, the sensor comprising a contact face disposed on a first side of the film and a post protruding from a second side of the film opposite the first side; and, coating the contact face with a non-polarizable conductive material, wherein the backing material comprises polyethylene terephthalate or polypropylene.

2. A process for producing a biomedical electrode, comprising:

forming a sensor directly in a backing material by injection molding an electrically conductive resin through a film of the backing material at a resin temperature range of 230-275 degrees Celsius to form a thermal bond between the sensor and the backing, the sensor comprising a contact face disposed on a first side of the film and a post protruding from a second side of the film opposite the first side, wherein the backing material comprises polyethylene terephthalate or polypropylene;

coating the contact face with a non-polarizable conductive material;

applying an electrolyte over the non-polarizable conductive material coated on the contact face; and,

applying a liner over the electrolyte.

3. The process according to claim 2 , wherein the backing material secures the sensor in the film when the conductive resin is injection molded through the film.

4. The process according to claim 3 , wherein securing the sensor in the film comprises adhering the conductive resin of the sensor to an adhesive coated on the film.

5. The process according to claim 2 , wherein forming the sensor directly in the backing material comprises injection molding a plurality of sensors in a single film to form a web of the sensors in the single film.

6. The process according to claim 2 , wherein the sensor comprises a flange disposed on the first side of the film, the contact face is a surface of the flange facing outwardly from the film, and the sensor is coated with the non-polarizable conductive material only on the contact face.

7. The process according to claim 2 , wherein the backing material is a solid foam.

8. The process according to claim 2 , wherein the conductive resin comprises a thermoplastic polymer matrix having conductive particles dispersed therein.

9. The process according to claim 2 , wherein sensor comprises an integrally formed film-retaining feature.

10. The process according to claim 9 , wherein the backing material comprises polyethylene terephthalate.

11. The process according to claim 10 , further comprising: processing the backing material to reduce water vapor transmission between the film and the sensor.

12. The process according to claim 11 , wherein the backing material comprises polyethylene terephthalate film with a polypropylene layer disposed on the first side.

13. The process according to claim 1 , wherein the resin comprises polypropylene.

14. The process according to claim 13 , wherein the backing material comprises polypropylene, wherein the sensor does not have a film-retaining feature.

15. The process according to claim 14 , wherein the conductive resin is injected at a resin temperature of 500 degrees Fahrenheit.

16. The process according to claim 13 , the backing material comprises polyethylene terephthalate film with a polypropylene layer disposed on the first side.

17. The process according to claim 2 , wherein the resin comprises polypropylene, wherein the conductive resin is injected at a resin temperature of 500 degrees Fahrenheit.

18. The process according to claim 17 , wherein the backing material is a polypropylene film, wherein the sensor does not have a film-retaining feature.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2024
From: 3M INNOVATIVE PROPERTIES COMPANY
To: SOLVENTUM INTELLECTUAL PROPERTIES COMPANY
Reel/Frame 066430/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2018
From: DERRY, CAMERON E.; TRYPHONOPOULOS, JOHN P.
To: 3M INNOVATIVE PROPERTIES COMPANY
Reel/Frame 046120/0880 →