IP Library Granted Patent US 10,884,335
Granted Patent B2
US 10,884,335 · App. 16/066,475 · Granted Jan 5, 2021

Black photosensitive resin composition and black column spacer prepared therefrom

Inventors: Hyung Gu Jeong (Busan, KR); Seok-Bong Park (Yongin, KR); Ji Ung Kim (Hwaseong, KR)
Assignee: Rohm and Haas Electronic Materials Korea Ltd.
G03F7/033C08F2/48C08G59/00C08G65/00C08L33/08C08L33/10C08L63/00C08L71/00G03F7/027G03F7/0217G03F7/031G03F7/038G03F7/0388G03F7/105C08K3/013C08K3/04C08K5/0041C08K5/235C08L2203/16G03F7/0007
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Quick Facts
Patent No.
US 10,884,335
App. No.
16/066,475
Granted
Jan 5, 2021
Kind
B2
Abstract

Disclosed herein are a black photosensitive resin composition and a black column spacer prepared therefrom. The black photosensitive resin composition may form a cured film exhibiting good adhesion to a substrate, good height difference property, good surface roughness and high light shielding property (optical density), and may be effectively used for the formation of a cured film, particularly a black column spacer, of a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

Claims (15)

1. A black photosensitive resin composition, comprising:

(A) an acrylic copolymer;

(B) an epoxy resin or a compound derived therefrom;

(C) an epoxy compound different from (A) and (B);

(D) a photopolymerizable compound;

(E) a photoinitiator; and

(F) a black colorant;

wherein, the acrylic copolymer (A) is comprised in an amount of 10 to 40 wt % on the basis of the total weight (based on solid content) of the black photosensitive resin composition, and the epoxy resin or the compound derived therefrom (B) is comprised in an amount of 10 to 40 wt % on the basis of the total weight (based on solid content) of the black photosensitive resin composition,

wherein the weight ratio of acrylic copolymer (A):epoxy resin or compound derived therefrom (B) is 40 to 80:60 to 20,

wherein the black colorant (F) comprises 90 wt % or more of a black inorganic colorant on the basis of the total weight (based on solid content) of the colorant, and

wherein the black photosensitive resin composition has an optical density of 0.5 to 2.5 when the black photosensitive resin composition is cured to a film having a thickness of 1 μm.

2. The black photosensitive resin composition of claim 1 , wherein the black colorant (F) is comprised in an amount of 10 to 60 wt % based on the total weight (based on solid content) of the black photosensitive resin composition.

3. The black photosensitive resin composition of claim 2 , wherein the black colorant (F) comprises 0 to 10 wt % of a black organic colorant on the basis of the total weight (based on solid content) of the colorant.

4. The black photosensitive resin composition of claim 1 , wherein the epoxy resin or the compound derived therefrom (B) has a cado backbone structure.

5. The black photosensitive resin composition of claim 1 , wherein the epoxy compound (C) is a homopolymer or copolymer having a structural unit derived from a monomer having an epoxy group and an unsaturated double bond.

Assignments (2)
CHANGE OF NAME Recorded Oct 17, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD
To: DUPONT SPECIALTY MATERIALS KOREA LTD
Reel/Frame 069185/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2020
From: PARK, SEOK-BONG; JEONG, HYUNG GU; KIM, JI UNG
To: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Reel/Frame 054429/0588 →