Vehicle-mounted electronic module, card edge connector, and connector
There is a problem that an oxide film or high resistance abrasion powder is formed at the contact interface due to micro sliding abrasion in a high temperature environment or temperature cycle to increase the contact resistance at the contact portion of a non-noble metal connection terminal. Provided is an in-vehicle electronic module, a connector, and a connection structure thereof, which have the same connection reliability as noble metals even when exposed to a harsh environment and can reduce cost of members. The in-vehicle electronic module includes a circuit board on which an electronic component is mounted, and a protection member accommodating the circuit board and protecting the circuit board from a surrounding environment and has a structure where a surface layer at an end portion of the circuit board is made of an 1 Ag-containing Sn-based solder having average thickness of 4 μm or more, and a surface material of a connection terminal of one card edge connector has a two layer structure of a soft noble metal layer of Ag, Pd, Pt, or the like/a reaction layer of a hard noble metal and Sn or an Ni layer.
1. An in-vehicle electronic module comprising:
a circuit board on which an electronic component is mounted; and
a protection member accommodating the circuit board,
wherein the circuit board has an end portion protruding into an external space from the protection member,
the end portion of the board comprises a connection terminal on a surface thereof for being inserted into an external female connector to obtain electrical conduction, and
the connection terminal comprising a Cu wire line, a solder layer having Sn as a main component and comprising an Ag—Sn intermetallic compound disposed above the Cu wire line, and a Cu—Sn reaction layer disposed between the Cu wire line and the solder layer.
2. The in-vehicle electronic module according to claim 1 , wherein the solder layer has an average thickness of 4 micrometers (μm) or more.
3. The in-vehicle electronic module according to claim 1 , wherein the Ag—Sn intermetallic compound has a grain size of 1 μm or more.