Package structure, electroluminescent display substrate, and fabrication method thereof

1. A package structure, comprising:

a first package layer and a second package layer stacked on a basal substrate;

wherein a planarization layer and a wall are sandwiched between the first package layer and the second package layer; the first package layer and the second package layer seal the wall and the planarization layer; an orthographic projection of the wall on the basal substrate surrounds an orthographic projection of the planarization layer on the basal substrate, the planarization layer is restricted within an area enclosed by the wall.

2. The package structure according to claim 1 , wherein a material of the wall comprises a desiccant.

3. The package structure according to claim 2 , wherein the material of the wall further comprises a curable glue having a water content less than 200 ppm; the desiccant is mixed into the curable glue, and a weight percentage of the desiccant in the wall is 0.1%˜1%.

4. The package structure according to claim 1 , wherein materials of the first package layer and the second package layer are selected from at least one of SiN X , SiON, and Al 2 O 3 ; and the planarization layer comprises a resin material.

5. An electroluminescent display substrate, comprising:

a basal substrate comprising a display area and a non-display area surrounding the display area;

an electroluminescent device disposed on the basal substrate and located in the display area; and

a package structure;

wherein the package structure comprises a first package layer and a second package layer stacked on the basal substrate;

a planarization layer and a wall are sandwiched between the first package layer and the second package layer;

the first package layer and the second package layer seal the wall and the planarization layer; and

an orthographic projection of the wall on the basal substrate surrounds an orthographic projection of the planarization layer on the basal substrate, and the planarization layer is restricted within an area enclosed by the wall;

and wherein the orthographic projection of the wall on the basal substrate and the orthographic projection of the planarization layer on the basal substrate at least completely cover the display area.

6. The electroluminescent display substrate according to claim 5 , wherein the orthographic projection of the planarization layer on the basal substrate at least completely covers the display area.

7. The electroluminescent display substrate according to claim 6 , wherein a distance between the orthographic projection of the wall on the basal substrate and the display area is 500˜2500 μm.

8. The electroluminescent display substrate according to claim 5 , wherein the orthographic projection of the wall on the basal substrate covers a boundary between the display area and the non-display area.

9. The electroluminescent display substrate according to claim 5 , wherein a material of the wall comprises a desiccant.

10. The electroluminescent display substrate according to claim 9 , wherein the material of the wall further comprises a curable glue having a water content less than 200 ppm; the desiccant is mixed into the curable glue, and a weight percentage of the desiccant in the wall is 0.1%˜1%.

11. The electroluminescent display substrate according to claim 5 , wherein the wall has a width of 300˜500 μm.

12. The electroluminescent display substrate according to claim 5 , wherein materials of the first package layer and the second package layer are selected from at least one of SiN X , SiON, and Al 2 O 3 ; and the planarization layer comprises a resin material.

13. The electroluminescent display substrate according to claim 5 , wherein the basal substrate is a flexible basal substrate.

14. A display apparatus, comprising the electroluminescent display substrate according to claim 5 .