Inherently healing polycarbonate resins
View Patent ↗The disclosure concerns healable polycarbonate resins comprising at least about 5 mol % of disulfide units, articles comprising the healable polycarbonate resin, and methods of activating the healable polycarbonate resin by exposing the healable polycarbonate resin to heat or radiation.
1. A healable polycarbonate resin comprising at least about 10 mol % to about 50 mol % of disulfide units.
2. The healable polycarbonate resin of claim 1 , wherein said disulfide units comprise aromatic or aliphatic disulfide units.
3. The healable polycarbonate resin of claim 1 , wherein said disulfide units comprise at least one hydroxy group.
4. The healable polycarbonate resin of claim 1 , wherein said disulfide units comprise disulfide co-monomers.
5. The healable polycarbonate resin of claim 1 , wherein said polycarbonate resin comprises disulfide end caps.
6. The healable polycarbonate resin of claim 1 , wherein said polycarbonate resin comprises disulfide cross-linkers.
7. The healable polycarbonate resin of claim 1 , further comprising a dihydroxy co-monomer such as a bisphenol A monomer, N-phenyl phenolphthalein monomer, an acid having at least about 20 carbon atoms, or
wherein n is about 20 to about 200, or combinations thereof.
8. The healable polycarbonate resin of claim 1 , wherein said polycarbonate resin is synthesized in presence of a carbonate source such as bis(methyl salicylate)carbonate diphenyl, or phosgene.
9. The healable polycarbonate resin of claim 1 , wherein said polycarbonate resin comprises units selected from the group consisting of:
and combinations thereof.
10. The healable polycarbonate resin of claim 1 , wherein said polycarbonate resin comprises
wherein n is about 30 to about 325;
wherein x and y are, independently, about 5 to about 95 mole % and M w is about 10,000 to about 100,000 g/mol;
wherein n is an integer provided that M w is about 10,000 to about 100,000 g/mol;
wherein n is about 20 to about 60 mol %, x is about 1 to about 60 mol %, y is about 1 to about 10 mol %, z is about 1 to about 50 mol % and M w is about 10,000 to about 100,000 g/mol;
wherein x is about 1 to about 50 mol %, y is about 1 to about 30 mol %, z is about 1 to about 30 mol % and M w is about 10,000 to about 100,000 g/mol; or
wherein x is about 1 to about 60 mol %, y is about 1 to about 10 mol %, z is about 1 to about 30 mol %, and M w is about 10,000 to about 100,000 g/mol.
11. The healable polycarbonate resin of claim 1 , which heals in the absence of pressure, electricity, a healing agent, a catalyst, or combinations thereof.
12. The healable polycarbonate resin of claim 1 , which heals in the presence of heat or radiation or a combination of thereof.
13. The healable polycarbonate resin of claim 1 , which is capable of healing multiple events of damage.
14. The healable polycarbonate resin of claim 1 which lacks carbon nanotubes, self-healing agents, or a combination thereof.
15. A method of preparing a healable polycarbonate resin of claim 1 , said method comprising melt or interfacial polymerizing an aromatic disulfide comprising at least one hydroxyl group and a carbonate source such as bis(methyl salicylate)carbonate or diphenyl carbonate or phosgene, and optionally a co-monomer.
16. The method of claim 14 , wherein said co-monomer is bisphenol A, N-phenyl phenolphthalein, an acid having at least about 20 carbon atoms, or
wherein n is about 20 to about 200, or combinations thereof.
17. The method of claim 14 , wherein said aromatic disulfide is bis(4-hydroxyphenyl)disulfide, 4-(phenyldisulfanyl)phenol, 4,4′,4″-((ethane-1,1,1-triyl-tris(benzene-4,1-diyl))tris(disulfanediyl))triphenol, or combinations thereof.
18. An article comprising the healable polycarbonate resin of claim 1 .
19. A method of activating a healable polycarbonate resin of claim 1 , comprising exposing said healable polycarbonate resin to heat or radiation.