IP Library Granted Patent US 10,559,519
Granted Patent B2
US 10,559,519 · App. 16/075,761 · Granted Feb 11, 2020

Series circuit arrangement of power semiconductors

Inventors: Johann Holweg (Zirndorf, DE); Katrin Benkert (Schwaig, DE); Harald Landes (Rückersdorf, DE); André Leonide (Fürth, DE)
Assignee: SIEMENS AKTIENGESELLSCHAFT
H01L23/473G12B15/02H01L23/367H02M5/45H02M5/4505H02M7/515H02M7/537H05K7/20927F28F27/02F28F2210/02F28F2210/10H02M5/44H02M7/53854
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Quick Facts
Patent No.
US 10,559,519
App. No.
16/075,761
Granted
Feb 11, 2020
Kind
B2
Abstract

The present disclosure relates to semiconductors. Some embodiments may include a series circuit arrangement of power semiconductors comprising: cooling-water boxes arranged on the semiconductors and electrically connected to them; two cooling-water distributor lines; respective branchings on the cooling-water distributor lines for the cooling chambers; and a control electrode arranged on the cooling-water distributor lines. The cooling chambers are connected in parallel between the cooling-water distributor lines with respect to a cooling-water stream. The cooling chambers are connected to the branchings via a respective connecting line. For at least some of the cooling chambers, the branchings on the cooling-water distributor lines are arrayed relative to the position of the respective cooling chamber in offset manner in relation to a geometrically shortest possible link to the cooling-water distributor lines, so that a difference of potential between the cooling chambers and the branchings is minimized.

Claims (18)

1. A series circuit arrangement of power semiconductors, the series circuit comprising:

a cooling water distribution apparatus including cooling-water boxes arranged on the power semiconductors;

wherein the cooling-water boxes are connected to the power semiconductors in electrically conducting manner; and

two cooling-water distributor lines;

wherein a first cooling-water distributor line includes a cooling-water inlet; and

a second cooling-water distributor line includes a cooling-water outflow;

wherein cooling chambers are connected in parallel between the cooling-water distributor lines with respect to a cooling-water stream; and

respective branchings on the cooling-water distributor lines for the cooling chambers;

wherein the cooling chambers are connected to the branchings via a respective connecting line; and

a control electrode arranged on the cooling-water distributor lines, terminally in each instance;

wherein, for at least some of the cooling chambers, the branchings on the cooling-water distributor lines are arrayed relative to the position of the respective cooling chamber in offset manner in relation to a geometrically shortest possible link to the cooling-water distributor lines, so that a difference of potential between the cooling chambers and the branchings is minimized.

2. The series circuit arrangement as claimed in claim 1 , wherein the cooling-water inlet and the cooling water outflow are arranged concentric to the cooling-water distributor lines with respect to the control electrodes; and

branchings are arranged in offset manner with respect to the cooling chambers in the direction of the cooling-water inlet or the cooling-water outflow.

3. The series circuit arrangement as claimed in claim 1 , wherein a first branching for a first cooling chamber is positioned in the region of the cooling-water inlet.

4. The series circuit arrangement as claimed in claim 1 , wherein the cooling water distributor lines are free from further control electrodes.

5. A cooling-water distribution apparatus as claimed in claim 1 , including a first spacing (L 0 ) between the cooling water inlet and the first cooling chamber, and a second spacing (L 1 ) represents a constant spacing of all the other cooling chambers from one another;

wherein the numeral n represents a serial number of the cooling chambers beginning with 0, and n max represents the total number of power semiconductors between the cooling-water inflow and a control electrode; and

the spacing of the branching of the nth cooling chamber from cooling-water inflow results by virtue of the relationship n(L 0 /n max +L 1 ).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2021
From: SIEMENS AKTIENGESELLSCHAFT
To: SIEMENS ENERGY GLOBAL GMBH & CO. KG
Reel/Frame 056501/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2018
From: HOLWEG, JOHANN; BENKERT, KATRIN; LANDES, HARALD; LEONIDE, ANDRE
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 046561/0271 →