IP Library Granted Patent US 10,580,859
Granted Patent B2
US 10,580,859 · App. 16/077,316 · Granted Mar 3, 2020

Nanorod production method and nanorod produced thereby

Inventors: Young Rag Do (Seoul, KR); Yeon Goog Sung (Goyang-si, KR)
Assignee: Samsung Display Co., Ltd.
H01L29/0669B82Y40/00H01L21/02H01L21/205H01L21/2007H01L21/304H01L21/306H01L21/3063H01L21/76251H01L29/06H01L29/41
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Quick Facts
Patent No.
US 10,580,859
App. No.
16/077,316
Granted
Mar 3, 2020
Kind
B2
Abstract

Provided is a method of manufacturing a nanorod. The method comprising comprises the steps of: providing a growth substrate and a support substrate; epitaxially growing a nanomaterial layer onto one surface of the growth substrate; forming a sacrificial layer on one surface of the support substrate; bonding the nanomaterial layer with the sacrificial layer; separating the growth substrate from the nanomaterial layer; flattening the nanomaterial layer; forming a nanorod by etching the nanomaterial layer; and separating the nanorod by removing the sacrificial layer.

Claims (21)

1. A method of manufacturing a nanorod, the method comprising:

providing a growth substrate and a support substrate;

epitaxial growing a nanomaterial layer on one surface of the growth substrate;

forming a sacrificial layer on one surface of the support substrate;

bonding the nanomaterial layer to the sacrificial layer;

separating the growth substrate from the nanomaterial layer;

flattening the nanomaterial layer;

etching the nanomaterial layer to form a nanorod; and

separating the nanorod by removing the sacrificial layer.

2. The method of manufacturing a nanorod of claim 1 , wherein the growth substrate includes at least one among a glass substrate, a quartz substrate, a sapphire substrate, a plastic substrate, and a bendable flexible polymer film.

3. The method of manufacturing a nanorod of claim 1 , wherein the growth substrate includes at least one among gallium nitride (GaN), silicon carbide (SiC), zinc oxide (ZnO), silicon (Si), gallium phosphide (GaP), spinel (MgAl 2 O 4 ), magnesium oxide (MgO), lithium aluminate (LiAlO 2 ), lithium gallate (LiGaO 2 ), gallium arsenide (GaAs), aluminum nitride (AlN), indium phosphide (InP), and copper (Cu).

4. The method of manufacturing a nanorod of claim 1 , wherein the support substrate includes at least one among a sapphire substrate, a glass substrate, a silicon carbide substrate, a silicon substrate, and a conductive substrate made of a metal material.

5. The method of manufacturing a nanorod of claim 1 , wherein the nanomaterial layer includes at least one among zinc oxide (ZnO), gallium nitride (GaN), gallium arsenide (GaAs), silicon carbide (SiC), tin oxide (SnO 2 ), gallium phosphide (GaP), indium phosphide (InP), zinc selenide (ZnSe), molybdenum disulfide (MoS 2 ), and silicon (Si).

6. The method of manufacturing a nanorod of claim 1 , wherein the nanomaterial layer is epitaxially grown by metal organic chemical vapor deposition (MOCVD).

7. The method of manufacturing a nanorod of claim 6 , wherein the epitaxial growing of the nanomaterial layer on one surface of the growth substrate includes controlling a length of the nanorod by adjusting a deposition thickness of the nanomaterial layer.

8. The method of manufacturing a nanorod of claim 1 , wherein the sacrificial layer includes an insulating layer for bonding to the nanomaterial layer and a metal layer deposited on an upper surface of the insulating layer to bond the insulating layer.

9. The method of manufacturing a nanorod of claim 8 , wherein the sacrificial layer is made of gold (Au), titanium (Ti), iron (Fe), silicon oxide (SiO 2 ), or silicon nitride (SiN).

10. The method of manufacturing a nanorod of claim 1 , wherein the separating of the growth substrate from the nanomaterial layer includes separating the growth substrate from the nanomaterial layer using one among a laser lift-off (LLO) method, a chemical lift-off (CLO) method, and an electrochemical lift-off (ELO) method.

11. The method of manufacturing a nanorod of claim 10 , wherein the flattening of the nanomaterial layer includes flattening the nanomaterial layer separated from the growth substrate using chemical mechanical polishing (CMP).

12. The method of manufacturing a nanorod of claim 9 , wherein, when the sacrificial layer is made of SiO 2 , the separating of the nanorod by removing the sacrificial layer includes removing the sacrificial layer using a buffered oxide etchant (BOE).

13. The method of manufacturing a nanorod of claim 9 , wherein, when the sacrificial layer is made of a metal layer, the separating of the nanorod by removing the sacrificial layer includes removing the sacrificial layer using a metal etchant.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2018
From: PSI CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 046820/0595 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2018
From: DO, YOUNG RAG; SUNG, YEON GOOG
To: PSI CO., LTD.
Reel/Frame 046616/0843 →
Priority Claims (1)
KR 10-2016-0024610 · Feb 29, 2016 · national
Continuity (1)
Related Publication 20190051724A1 · Feb 14, 2019
Cited By (1)
US 12,237,314