Compositions and methods using same for deposition of silicon-containing film
Described herein are compositions and methods using same for forming a silicon-containing film such as without limitation a silicon carbide, silicon nitride, silicon oxide, silicon oxynitride, a carbon-doped silicon nitride, a carbon-doped silicon oxide, or a carbon doped silicon oxynitride film on at least a surface of a substrate having a surface feature. In one aspect, the silicon-containing films are deposited using the co-deposition of a first compound comprising a carbon-carbon double or carbon-carbon triple bond and a second compound comprising at least one Si—H bond.
1. A method of depositing a silicon-containing film by a flowable chemical vapor deposition process, comprising:
placing a substrate comprising a surface feature into a deposition chamber, the deposition chamber at a first temperature ranging from −20° C. to about 100° C.;
introducing a mixture into the deposition chamber, the mixture consisting of a first silicon-containing compound and a second silicon-containing compound;
the first silicon-containing compound having at least one carbon-carbon double bond and selected from the group consisting of tetravinylsilane and trivinylmethylsilane, and;
the second silicon-containing compound having at least one Si—H bond and being a compound having a formula of SiH 3 —R 2 —SiH 3 wherein R 2 is a linear or branched C 1 to C 6 alkylene group;
exposing the mixture to an in-situ plasma in the deposition chamber, thereby inducing a reaction between the first silicon-containing compound, and the second silicon-containing compound, and thus creating a flowable liquid, or oligomer, made from the first silicon-containing compound, and the second silicon-containing compound; and
permitting the flowable liquid, or oligomer, to at least partially fill the surface feature and thus form the silicon-containing film.
2. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 1 , wherein the mixture further comprises an inert gas selected from the group consisting of helium, argon, xenon, and mixtures thereof, and wherein atoms of the inert gas are not incorporated into the flowable liquid, or oligomer, made from the first silicon-containing compound, and the second silicon-containing compound, after exposure to the in-situ plasma in the deposition chamber, thereby creating a silicon-containing film comprising silicon and carbon.
3. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 2 , further comprising changing the temperature of the deposition chamber to a second temperature ranging from 100° C. to about 1000° C. to densify the silicon-containing film.
4. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 3 , further comprising exposing the silicon-containing film to a further treatment selected from the group consisting of a plasma, infrared light, chemical treatment, an electron beam, UV light, or combinations thereof to form a dense film.
5. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 4 , wherein the film has at least one of the following characteristics i) a film tensile stress ranging from about 150 to about 190 MPa after a UV cure, and ii) a density ranging from about 1.35 to about 2.10 g/cm 3 .
6. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 2 , wherein a pressure of the deposition chamber is less than, or equal to, 100 torr.
7. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 1 , wherein the mixture further comprises a nitrogen source selected from the group consisting of N 2 , ammonia, NF 3 , an organoamine, and mixtures thereof, and wherein nitrogen atoms of the nitrogen source are incorporated into the flowable liquid, or oligomer, made from the first silicon-containing compound, and the second silicon-containing compound, after exposure to the in-situ plasma in the deposition chamber, thereby creating a silicon-containing film comprising silicon, carbon, and nitrogen.
8. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 1 , wherein the mixture further comprises an oxygen source selected from the group consisting of water, oxygen, ozone, nitric oxide, nitrous oxide, carbon monoxide, carbon dioxide, and combinations thereof, and wherein oxygen atoms of the oxygen source are incorporated into the flowable liquid, or oligomer, made from the first silicon-containing compound, and the second silicon-containing compound, after exposure to the in-situ plasma in the deposition chamber, thereby creating a silicon-containing film comprising silicon, carbon, and oxygen.
9. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 1 , wherein the mixture further comprises an a remote plasma comprising an inert gas selected from the group consisting of helium, argon, xenon, and mixtures thereof, and wherein atoms of the inert gas are not incorporated into the flowable liquid, or oligomer, made from the first silicon-containing compound, and the second silicon-containing compound, after exposure to the in-situ plasma and the remote plasma in the deposition chamber, thereby creating a silicon-containing film comprising silicon and carbon.
10. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 1 , wherein the mixture further comprises a remote plasma comprising a nitrogen source selected from the group consisting of N 2 , ammonia, NF 3 , an organoamine, and mixtures thereof, and wherein nitrogen atoms of the nitrogen source are incorporated into the flowable liquid, or oligomer, made from the first silicon-containing compound, and the second silicon-containing compound, after exposure to the in-situ plasma and the remote plasma in the deposition chamber, thereby creating a silicon-containing film comprising silicon, carbon, and nitrogen.
11. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 1 , wherein the mixture further comprises a remote plasma comprising an oxygen source selected from the group consisting of water, oxygen, ozone, nitric oxide, nitrous oxide, carbon monoxide, carbon dioxide, and combinations thereof, and wherein oxygen atoms of the oxygen source is incorporated into the flowable liquid, or oligomer, made from the first silicon-containing compound, and the second silicon-containing compound, after exposure to the in-situ plasma and the remote plasma in the deposition chamber, thereby creating a silicon-containing film comprising silicon, carbon, and oxygen.
12. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 1 , wherein the second silicon-containing compound is selected from the group consisting of:
13. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 12 , wherein the second silicon-containing compound is 1,4-disilabutane.
14. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 13 , wherein the first silicon-containing compound consists of tetravinylsilane.
15. The method of depositing a silicon-containing film by a flowable chemical vapor deposition process according to claim 13 , wherein the first silicon-containing compound consists of trivinylmethylsilane.