Thermal interface material including crosslinker and multiple fillers
A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
1. A thermal interface material comprising:
1 wt. % to 16 wt. % of at least one polymer matrix material;
0.5 wt. % to 8 wt. % of at least one phase change material;
0.1 wt. % to 1 wt. % of at least one amine or amine-based crosslinker; and
a thermally conductive filler including a first plurality of zinc oxide particles having an average particle diameter of about 0.1 microns to about 1 micron; and a second plurality of particles of aluminum having an average particle diameter of about 2 microns to about 12 microns, and wherein a weight ratio of the aluminum particles to the zinc oxide particles is from 1.25:1 to 5:1; and
wherein the at least one thermally conductive filler comprises at 80 wt. % of the total weight of the thermal interface material.
2. The thermal interface material of claim 1 , wherein the amine or amine-based crosslinker is an alkylated melamine resin.
3. The thermal interface material of claim 1 , wherein the thermal interface material comprises:
1 wt. % to 8 wt. % of the at least one polymer matrix material;
0.5 wt. % to 5 wt. % of the at least one phase change material;
0.1 wt. % to 1 wt. % of the at least one amine or amine-based crosslinker; and
91 wt. % to 95 wt. % of the at least one thermally conductive filler, based on the total weight of the thermal interface material.
4. The thermal interface material of claim 1 , wherein the polymer matrix material comprises a hydrogenated polyalkyldiene mono-ol.
5. The thermal interface material of claim 1 , wherein the phase change material comprises a paraffin wax.
6. The thermal interface material of claim 1 , further comprising at least one coupling agent, antioxidant, ion scavenger, or thixotropic agent.
7. A dispensable formulation for forming a thermal interface material, the dispensable formation comprising:
0.1 wt. % to 20 wt. % of at least one solvent, based on the total weight of the dispensable formulation;
1 wt. % to 16 wt. % of at least one polymer matrix material based on the dry-weight of the formed thermal interface material;
0.5 wt. % to 8 wt. % of at least one phase change material based on the dry-weight of the formed;
0.1 wt. % to 1 wt. % of at least one amine or amine-based crosslinker based on the dry-weight of the formed thermal interface material; and
a thermally conductive filler including a first plurality of zinc oxide particles having an average particle diameter of about 0.1 microns to about 1 micron; and a second plurality of particles of aluminum having an average particle diameter of about 2 microns to about 12 microns, and wherein a weight ratio of the aluminum particles to the zinc oxide particles is from 1.25:1 to 5:1; and
wherein the at least one thermally conductive filler comprises at least 80 wt. % based on the dry-weight of the formed thermal interface material.
8. The dispensable formulation of claim 7 , wherein the amine or amine-based crosslinker is an alkylated melamine resin.
9. The dispensable formulation of claim 7 , wherein the at least one thermally conductive filler comprises:
1 wt. % to 8 wt. % of the at least one polymer matrix material;
0.5 wt. % to 5 wt. % of the at least one phase change material;
0.1 wt. % to 1 wt. % of the at least one amine or amine-based crosslinker; and
91 wt. % to 95 wt. % of the at least one thermally conductive filler based on the dry-weight of the formed thermal interface material.
10. An electronic component comprising:
a heat sink;
an electronic chip;
a thermal interface material positioned between the heat sink and electronic chip in a vertical orientation, the thermal interface material including:
1 wt. % to 16 wt. % of at least one polymer matrix material;
0.5 wt. % to 8 wt. % of at least one phase change material;
0.1 wt. % to 1 wt. % of at least one amine or amine-based crosslinker; and
a thermally conductive filler including a first plurality of zinc oxide particles having an average diameter of about 0.1 microns to about 1 micron particles and a second plurality of aluminum particles having an average particle diameter of about 2 microns to about 12 microns, and wherein a weight ratio of the aluminum particles to the zinc oxide particles is from 1.25:1 to 5:1;
wherein the at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material.
11. The electronic component of claim 10 , wherein the amine or amine-based crosslinker is an alkylated melamine resin.
12. The electronic component of claim 10 , wherein the at least one thermally conductive filler comprises:
1 wt. % to 8 wt. % of the at least one polymer matrix material;
0.5 wt. % to 5 wt. % of the at least one phase change material;
0.1 wt. % to 1 wt. % of the at least one amine or amine-based crosslinker; and
91 wt. % to 95 wt. % of the at least one thermally conductive filler, based on the total weight of the thermal interface material.
13. The thermal interface material of claim 1 , wherein the weight ratio of the aluminum particles to the zinc oxide particles is from 2.5:1 to 3:1.
14. The formulation of claim 1 , wherein the weight ratio of the aluminum particles to the zinc oxide particles is from 2.5:1 to 3:1.
15. The electronic component of claim 1 , wherein the weight ratio of the aluminum particles to the zinc oxide particles is from 2.5:1 to 3:1.