Ceramic laminate
The present invention provides a ceramic laminate having excellent mechanical properties, heat dissipation property, insulating property, heat resistance and anti-reactivity, and particularly an insulative heat dissipating body having an excellent thermal cycle reliability and a high withstand voltage. The ceramic laminate 1 according to the present invention is a ceramic laminate in which a ceramic film 3 is formed on a metal layer 2 , wherein the ceramic film 3 has a minimum film thickness of 1 μm or more, contains silicon nitride and inevitable impurities, and has silicon nitride crystal grains having an average grain size of 300 nm or less in the film thickness direction and an average grain size of 500 nm or less in the in-plane direction. As a result, the present invention can provide a ceramic laminate having excellent mechanical properties, heat dissipation property, insulating property, heat resistance and anti-reactivity, and particularly an insulative heat dissipating body having an excellent thermal cycle reliability and a high withstand voltage.
1. A ceramic laminate in which a ceramic film is formed on a metal layer, wherein the ceramic film has a minimum film thickness of 1 μm or more, contains silicon nitride, and has silicon nitride crystal grains having an average grain size of 300 nm or less in the film thickness direction and an average grain size of 500 nm or less in the in-plane direction,
wherein the ceramic film has a porosity of more than 0% and less than 3%,
wherein the ceramic laminate does not include a ceramic film having a porosity of 3% or more,
wherein the porosity means the ratio of the area occupied by the voids in the ceramic film, including the area of the voids, along the cross section of the ceramic film in the direction perpendicular to the film surface, and
wherein the ceramic film has a ratio of the X-ray diffraction intensity I (210) of (210) plane to the X-ray diffraction intensity I (101) of (101) plane of β-silicon nitride crystal exceeding 0.9.
2. The ceramic laminate according to claim 1 , wherein the ceramic film has a minimum film thickness at least 1.5 times larger than a maximum height roughness of the metal layer,
wherein the maximum height roughness of the metal layer means the maximum height difference of the metal layer at the interface between the ceramic film and the metal layer in the cross section perpendicular to the film surface.
3. The ceramic laminate according to claim 1 , wherein the ceramic film has silicon nitride crystal grains having an average grain size of 150 nm or less in the film thickness direction and an average grain size of 250 nm or less in the in-plane direction.
4. The ceramic laminate according to claim 3 , wherein the ceramic film has silicon nitride crystal grains having an average grain size of 100 nm or less in the film thickness direction and an average grain size of 150 nm or less in the in-plane direction.
5. The ceramic laminate according to claim 1 , wherein the ceramic film contains silicon nitride whose proportion of β-silicon nitride in the silicon nitride exceeds 50 wt %.
6. The ceramic laminate according to claim 1 , wherein the ceramic film has a ratio of the X-ray diffraction intensity I (210) of (210) plane to the X-ray diffraction intensity I (101) of (101) plane of the β-silicon nitride crystal exceeding 2.2.
7. The ceramic laminate according to claim 1 , wherein the ceramic film contains silicon nitride whose proportion of α-silicon nitride in the silicon nitride exceeds 50 wt %.
8. The ceramic laminate according to claim 1 , wherein the ceramic film has silicon nitride crystal grains having an average aspect ratio of smaller than 2.0 when viewed in the film thickness direction.
9. An insulative heat dissipating body characterized by being composed of the ceramic laminate according to claim 1 .
10. The insulative heat dissipating body according to claim 9 , wherein the minimum film thickness of the ceramic film is 10 μm or more and 100 μm or less.
11. The insulative heat dissipating body according to claim 9 , wherein the metal layer is made of copper or aluminum.
12. The insulative heat dissipating body according to claim 9 , wherein a metal circuit is formed on the ceramic film.
13. The insulative heat dissipating body according to claim 12 , wherein the metal circuit is made of copper or aluminum.
14. The ceramic laminate according to claim 2 , wherein the ceramic film has silicon nitride crystal grains having an average grain size of 150 nm or less in the film thickness direction and an average grain size of 250 nm or less in the in-plane direction.
15. The ceramic laminate according to claim 2 , wherein the ceramic film contains silicon nitride whose proportion of β-silicon nitride in the silicon nitride exceeds 50 wt %.