IP Library Granted Patent US 10,731,008
Granted Patent B2
US 10,731,008 · App. 16/082,669 · Granted Aug 4, 2020

Photocurable silicone composition and cured product thereof

Inventors: Ju Young Yook (Chungcheongbuk-do, KR); Makoto Yoshitake (Chiba, JP)
Assignees: Dow Toray Co., Ltd.; Dow Silicones Corporation
C08G77/20C08K5/101C08K5/13C08K5/37C08K5/5313C08L83/04C09D183/04
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Quick Facts
Patent No.
US 10,731,008
App. No.
16/082,669
Granted
Aug 4, 2020
Kind
B2
Abstract

A photocurable silicone composition comprises: (A) an organopolysiloxane represented by the average composition formula: R 1 a R 2 b SiO (4-a-b)/2 where R 1 is an alkenyl group having from 2 to 12 carbons, R 2 is an alkyl group having from 1 to 12 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 12 carbons; provided that, at least 30 mol % of R 2 are the aryl groups or the aralkyl groups; and “a” and “b” are positive numbers satisfying: 1≤(a+b)≤2.5 and 0.001≤a/(a+b)≤0.2; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a compound having at least two thiol groups in a molecule; (D) a photoradical initiator having a phosphorus atom; and (E) a hindered phenol compound.

Claims (13)

1. A photocurable silicone composition comprising:

(A) 100 parts by mass of an organopolysiloxane represented by the average composition formula:

R 1 a R 2 b SiO (4-a-b)/2

where R 1 is an alkenyl group having from 2 to 12 carbons, R 2 is an alkyl group having from 1 to 12 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 12 carbons; provided that, at least 30 mol % of R 2 are the aryl groups or the aralkyl groups; and “a” and “b” are positive numbers satisfying: 1≤(a+b)≤2.5 and 0.001≤a/(a+b)≤0.2;

(B) from 3 to 30 parts by mass of an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule;

(C) a compound having at least two thiol groups in a molecule, in an amount that the amount of the thiol groups in component (C) is from 0.2 to 2.0 mol per 1 mol of the total aliphatic carbon-carbon double bonds in the photocurable silicone composition;

(D) from 0.05 to 1.0 part by mass of a photoradical initiator having a phosphorus atom;

(E) from 0.001 to 1.0 part by mass of a hindered phenol compound; and

(F) from 0.0001 to 1 part by mass of a radical scavenger selected from the group consisting of N,N′,N″,N′″-tetrakis(4,6-bis(butyl-(N-methyl-2,2,6,6-tetramethylpiperidin-4-yl)amino)-triazin-2-yl)-4,7-diazadecane-1,10-diamine, bis(1,2,2,6,6-pentamethyl-4-piperidyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, methyl-1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, 8-acetyl-3-dodecyl-7,7,9,9-tetramethyl-1,3,8-triazaspiro]4.5]decane-2,4-dione, methylhydroquinone, 1,4-naphthoquinone, 4-methoxynaphthol, tert-butylhydroquinone, aluminum-N-nitroso-N-phenylhydroxylamine, and pyrogallol.

2. The photocurable silicone composition according to claim 1 , wherein component (B) is an organic compound having at least two ether bonds and at least one acryloyl group or methacryloyl group in a molecule.

3. The photocurable silicone composition according to claim 2 , further comprising (G) an organic compound having an aliphatic carbon-carbon double bond other than components (A) and (B), in an amount of 10 parts by mass or less per 100 parts by mass of component (A).

4. The photocurable silicone composition according to claim 1 , further comprising (G) an organic compound having an aliphatic carbon-carbon double bond other than components (A) and (B), in an amount of 10 parts by mass or less per 100 parts by mass of component (A).

5. A cured product obtained by irradiating the photocurable silicone composition according to claim 1 with light.

Assignments (5)
CHANGE OF NAME Recorded Jun 25, 2020
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 053034/0302 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2020
From: YOSHITAKE, MAKOTO
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 053032/0361 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2020
From: YOOK, JU YOUNG
To: DOW CORNING KOREA LTD.
Reel/Frame 053032/0364 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2020
From: DOW CORNING KOREA LTD.
To: DOW CORNING CORPORATION
Reel/Frame 053032/0374 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →