Sealing structure and light emitting device
A sealing structure ( 200 ) seals a light emitting unit ( 140 ) and includes a first inorganic film ( 210 ), a second inorganic film ( 220 ), a first resin-containing film ( 230 ), and a second resin-containing film ( 240 ). The film thickness of the first inorganic film ( 210 ) is equal to or greater than 1 nm and equal to or less than 300 nm. The first resin-containing film ( 230 ) is in contact with the first inorganic film ( 210 ) and includes a first resin. The second inorganic film ( 220 ) is positioned on an opposite side of the first inorganic film ( 210 ) with the first resin-containing film ( 230 ) interposed between the first and second inorganic films. The second resin-containing film ( 240 ) is positioned between the first resin-containing film ( 230 ) and the second inorganic film ( 220 ) and is in contact with the second inorganic film ( 220 ). The second resin-containing film ( 240 ) includes a second resin.
1. A sealing structure that seals an object to be sealed, the structure comprising:
a first inorganic film having a film thickness which is equal to or greater than 1 nm and equal to or less than 300 nm;
a first resin-containing film which is in contact with the first inorganic film and comprises a first resin;
a second inorganic film which is positioned on a side opposite to the first inorganic film with the first resin-containing film interposed between the first and second inorganic films; and
a second resin-containing film which is positioned between the first resin-containing film and the second inorganic film, is in contact with the second inorganic film, and comprises a second resin,
wherein the first inorganic film has a recessed portion or a hole, and
a portion of the first resin-containing film is positioned in the recessed portion or the hole.
2. The sealing structure according to claim 1 ,
wherein the first resin-containing film is thicker than the first inorganic film.
3. The sealing structure according to claim 1 ,
wherein a thickness of the first resin-containing film is equal to or greater than 1 μm and equal to or less than 5 μm, and
a thickness of the second resin-containing film is equal to or greater than 1 μm and equal to or less than 5 μm.
4. The sealing structure according to claim 1 ,
wherein at least a portion of the first inorganic film overlaps neither the first resin-containing film nor the second resin-containing film, and
at least a portion of the second inorganic film overlaps neither the first resin-containing film nor the second resin-containing film and is in contact with the first inorganic film.
5. The sealing structure according to claim 1 ,
wherein a thickness of the second inorganic film is equal to or greater than 1 nm and equal to or less than 300 nm.
6. The sealing structure according to claim 5 ,
wherein the second inorganic film is formed by using a material that is the same as a material of the first inorganic film.
7. The sealing structure according to claim 1 ,
wherein at least a portion of the first resin-containing film does not overlap the second resin-containing film and is in contact with the second inorganic film.
8. The sealing structure according to claim 1 ,
wherein an end of the first resin-containing film overlaps an end of the second resin-containing film.
9. The sealing structure according to claim 1 ,
wherein a Young's modulus of the second resin is lower than a Young's modulus of the first resin.
10. The sealing structure according to claim 1 ,
wherein a glass transition point of the second resin is higher than a glass transition point of the first resin.
11. The sealing structure according to claim 1 ,
wherein the first inorganic film is positioned to be closer to the object to be sealed than the second inorganic film in a thickness direction.
12. A light emitting device comprising:
a light emitting unit comprising an organic layer; and
a sealing structure that seals the light emitting unit,
wherein the sealing structure is the sealing structure according to claim 1 .