METHOD OF MANUFACTURING A SMARTCARD

1 . A smartcard comprising:

a card body enclosing a flexible circuit;

a contact pad having contacts exposed from the card body;

an extension block located within the card body between the contact pad and the flexible circuit, the extension block defining conductive paths therethrough such that the contacts of the contact pad are electrically connected to the flexible circuit via the conductive paths; and

a secure element located within the card body and electrically connected to the flexible circuit, wherein the secure element does not overlap with the contact pad.

2 . A smartcard according to claim 1 , wherein the extension block has a height of at least 200 μm.

3 . A smartcard according to claim 1 , wherein the extension block comprises a block of electrically-insulating material defining a plurality of through holes, wherein the conductive paths extend via the through holes.

4 . A smartcard according to claim 1 , wherein the extension block is electrically connected to the contacts of the flexible circuit and/or the contacts of the contact pad by one of a mechanical connection, a conductive adhesive connection, and a metallic solder connection.

5 . A smartcard according to claim 1 , wherein the smartcard further comprises a biometric authentication module, the biometric authentication module being configured to authenticate the identity of a bearer of the smartcard, and to command the secure element of the smartcard to transmit data responsive to authentication of the bearer of the card.

6 . A smartcard according to claim 1 , wherein the smartcard comprises an antenna configured to communicate with the secure element.

7 . A smartcard according to claim 1 , wherein the card body is formed from a plastics material, and comprises polyvinyl chloride (PVC) and/or polyurethane (PU).

8 . A method of manufacturing a smartcard comprising:

providing a flexible circuit having contacts for connection to a contact pad, and configured for connection to a secure element;

electrically connecting contacts on a contact pad to the contacts on the flexible circuit board via conductive paths through an extension block;

electrically connecting a secure element to the flexible circuit board such that the secure element does not overlap with the contact pad; and

applying a lamination process to the flexible circuit to provide a card body enclosing the flexible circuit.

9 . A method according to claim 8 , further comprising:

electrically connecting the extension block to the contact pad before electrically connecting the extension block to the flexible circuit board.

10 . A method according to claim 8 , further comprising removing lamination material from the card body to expose the surface of the contact pad.

11 . A method according to claim 8 , wherein the method further comprises electrically connecting a biometric authentication module to the flexible circuit, the biometric authentication module being configured to authenticate the identity of a bearer of the smartcard, and to command the secure element of the smartcard to transmit data responsive to authentication of the bearer of the smartcard.

12 . A method according to claim 8 , wherein the lamination process is a thermal lamination process applied at a temperature of at least 150° C.

13 . A method of manufacturing a smartcard comprising:

providing a card body enclosing a flexible smartcard circuit having contacts for connection to a contact pad, wherein a secure element is located within the card body and electrically connected to the flexible circuit, and wherein a cavity is formed in the card body exposing the contacts;

inserting into the cavity an extension block that defines paths therethrough and a contact pad having contacts; and

electrically connecting the contacts on the contact pad to the contacts on the flexible circuit via the paths of the extension block.

14 . A method according to claim 13 , further comprising:

electrically connecting the extension block to the contact pad before inserting the extension block and the contact pad into the cavity.

15 . A method according to claim 13 , wherein electrically connecting the contacts comprises forming a metallic solder connection.

16 . A method according to claim 13 , wherein the electrical connection comprises a mechanical connection or a conductive adhesive connection.

17 . A method according to claim 13 , wherein the step of providing the card body comprises removing material from the card body to create the cavity and expose the contacts.

18 . A method according to claim 13 , further comprising applying a lamination process to the card body after electrically connecting the contacts on the contact pad to the contacts on the flexible circuit via the paths of the extension block.

19 . A method according to claim 13 , wherein the step of providing the card body comprises forming the card body by a lamination process.

20 . A smartcard according to claim 1 , wherein the extension block has a height of at least 300 μm.