Curable composition and cured product obtained by curing the same
The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR 17 R 18 ; B represents CR 19 R 20 ; R 1 to R 20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.)
1. A curable composition comprising:
an epoxy compound represented by the following Formula (1):
wherein
B represents CR 19 R 20 ;
R 1 to R 20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and
(ii) one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator.
2. The curable composition according to claim 1 , further comprising one kind, or two or more kinds selected from the group consisting of (i) an epoxy compound other than the epoxy compound represented by the Formula (1), an oxetane compound and a vinyl ether.
3. The curable composition according to claim 1 , wherein the thermal cationic polymerization initiator is selected from the group consisting of aromatic sulfonium salt-based thermal cationic polymerization initiators, and aluminum complex-based thermal cationic polymerization initiators.
4. The curable composition according to claim 3 , wherein the thermal cationic polymerization initiator is an aromatic sulfonium salt-based thermal cationic polymerization initiator.
5. The curable composition according to claim 2 , wherein, in cases where the curable composition does not contain any of the epoxy compound other than the epoxy compound represented by the Formula (1), the oxetane compound or the vinyl ether, the content of the thermal cationic polymerization initiator is from 0.1 to 15 parts by mass with respect to 100 parts by mass of the epoxy compound represented by the Formula (1) contained in the curable composition; and in cases where the curable composition contains one kind, or two or more kinds selected from the group consisting of the epoxy compound other than the epoxy compound represented by the Formula (1), the oxetane compound and the vinyl ether, the content of the thermal cationic polymerization initiator is from 0.1 to 15 parts by mass with respect to 100 parts by mass of the total amount of the epoxy compound represented by the Formula (1), the epoxy compound other than the epoxy compound represented by the Formula (1), the oxetane compound and the vinyl ether.
6. The curable composition according to claim 2 , wherein, in cases where the curable composition does not contain the epoxy compound other than the epoxy compound represented by the Formula (1), the content of the acid anhydride-based curing agent is from 0.6 to 1.2 equivalent with respect to one equivalent of the epoxy compound represented by the Formula (1) contained in the curable composition; and in cases where the curable composition contains the epoxy compound other than the epoxy compound represented by the Formula (1), the content of the acid anhydride-based curing agent is from 0.6 to 1.2 equivalent with respect to one equivalent of a mixture of epoxy compounds composed of the epoxy compound represented by the Formula (1) and the epoxy compound other than the epoxy compound represented by the Formula (1).
7. The curable composition according to claim 2 , wherein, in cases where the curable composition does not contain the epoxy compound other than the epoxy compound represented by the Formula (1), the content of the curing accelerator is from 0.1 to 10 parts by mass with respect to 100 parts by mass of the epoxy compound represented by the Formula (1) contained in the curable composition; and in cases where the curable composition contains the epoxy compound other than the epoxy compound represented by the Formula (1), the content of the curing accelerator is from 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the epoxy compound represented by the Formula (1) and the epoxy compound other than the epoxy compound represented by the Formula (1).
8. The curable composition according to claim 1 , wherein the curing accelerator is an imidazole-based curing accelerator.
9. The curable composition according to claim 3 , wherein the content of the epoxy compound represented by the Formula (1) is from 10 to 99% by mass.
10. The curable composition according to claim 1 , wherein the photo-cationic polymerization initiator is an aromatic sulfonium salt-based photo-cationic polymerization initiator.
11. The curable composition according to claim 2 , wherein, in cases where the curable composition does not contain any of the epoxy compound other than the epoxy compound represented by the Formula (1), the oxetane compound or the vinyl ether, the content of the photo-cationic polymerization initiator is from 0.1 to 20 parts by mass with respect to 100 parts by mass of the epoxy compound represented by the Formula (1) contained in the curable composition; and in cases where the curable composition contains one kind, or two or more kinds selected from the group consisting of the epoxy compound other than the epoxy compound represented by the Formula (1), the oxetane compound and the vinyl ether, the content of the photo-cationic polymerization initiator is from 0.1 to 20 parts by mass with respect to 100 parts by mass of the total amount of the epoxy compound represented by the Formula (1), the epoxy compound other than the epoxy compound represented by the Formula (1), the oxetane compound and the vinyl ether.
12. The curable composition according to claim 10 , wherein the content of the epoxy compound represented by the Formula (1) is from 1 to 50% by mass.
13. The curable composition according to claim 2 , wherein the epoxy compound other than the epoxy compound represented by the Formula (1) is selected from the group consisting of glycidyl ether-type epoxides, glycidyl ester-type epoxides and alicyclic epoxides.
14. A method of producing a cured product, the method comprising the step of curing the curable composition according to claim 1 .
15. A cured product from the curable composition according to claim 1 .
16. The curable composition according to claim 1 , wherein the epoxy compound is represented by the following Formula (4)