Solid-state imaging apparatus having output circuit unit for outputting pixel signal
The present disclosure relates to a solid-state imaging apparatus that is configured by laminating a first structure body, at which a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned is formed, and a second structure body, at which an output circuit unit for outputting a pixel signal outputted from the pixels to the outside of the apparatus is formed. The output circuit unit, a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the pixel array unit of the first structure body, the output circuit unit is connected to the signal output external terminal via the through via, and the outermost surface of the apparatus is a resin layer formed on an upper layer of an on-chip lens of the pixel array unit.
1. A solid-state imaging apparatus, wherein
a first structure body, at which a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned is formed, and a second structure body, at which an output circuit unit for outputting a pixel signal outputted from the pixels to an outside of the apparatus is formed, are laminated,
the output circuit unit, a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the pixel array unit of the first structure body,
the output circuit unit is connected to the signal output external terminal via the through via, and
an outermost surface of the apparatus is a laminated lens structure body positioned above the first structure body.
2. The solid-state imaging apparatus according to claim 1 , comprising a rib structure body on an outer peripheral portion further outside than the pixel array unit.
3. A solid-state imaging apparatus, wherein
a first structure body, at which a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned is formed, and a second structure body, at which an output circuit unit for outputting a pixel signal outputted from the pixels to an outside of the apparatus is formed, are laminated,
the output circuit unit, a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the pixel array unit of the first structure body,
the output circuit unit is connected to the signal output external terminal via the through via, and
an outermost surface of the apparatus is an antireflection film formed on a surface of an on-chip lens of the pixel array unit, wherein a rib structure body is embedded in the antireflection film on an outer peripheral portion of the pixel array unit.
4. A solid-state imaging apparatus, wherein
a first structure body, at which a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned is formed, a microlens array substrate positioned above the first structure body, and a second structure body, at which an output circuit unit for outputting a pixel signal outputted from the pixels to an outside of the apparatus is formed, are laminated,
the output circuit unit, a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the pixel array unit of the first structure body, and
the output circuit unit is connected to the signal output external terminal via the through via.
5. A solid-state imaging apparatus, wherein
a first structure body, at which a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned is formed, and a second structure body, at which an output circuit unit for outputting a pixel signal outputted from the pixels to an outside of the apparatus is formed, are laminated,
the output circuit unit, a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the pixel array unit of the first structure body,
the output circuit unit is connected to the signal output external terminal via the through via, and
an outermost surface of the apparatus is a fluorescent material formed on an upper layer of an on-chip lens of the pixel array unit wherein a rib structure body is embedded in the fluorescent material on an outer peripheral portion of the pixel array unit.
6. A solid-state imaging apparatus, wherein
a first structure body, at which a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned is formed, and a second structure body at which an output circuit unit for outputting a pixel signal outputted from the pixels to an outside of the apparatus is formed, are laminated,
the output circuit unit, a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the pixel array unit of the first structure body,
the output circuit unit is connected to the signal output external terminal via the through via, and
an outermost surface of the apparatus is an antibody which is formed on an upper layer of the pixel array unit and reacts to a fluorescent protein.
7. A solid-state imaging apparatus, wherein
a first structure body, at which a pixel array unit in which pixels for performing photoelectric conversion are two-dimensionally aligned is formed, and a second structure body, at which an output circuit unit for outputting a pixel signal outputted from the pixels to an outside of the apparatus is formed, are laminated,
the output circuit unit, a through via which penetrates a semiconductor substrate constituting a part of the second structure body, and a signal output external terminal connected to the outside of the apparatus are arranged under the pixel array unit of the first structure body,
the output circuit unit is connected to the signal output external terminal via the through via, and
an outermost surface of the apparatus is a chemically modified film which is formed on an upper layer of the pixel array unit and attaches a charge.