Nitride semiconductor substrate, semiconductor device, and method for manufacturing nitride semiconductor substrate
View Patent ↗There is provided a nitride semiconductor substrate, including: a substrate configured as an n-type semiconductor substrate; and a drift layer provided on the substrate and configured as a gallium nitride layer containing donors and carbons, wherein a concentration of the donors in the drift layer is 5.0×10 16 /cm 3 or less, and is equal to or more than a concentration of the carbons that function as acceptors in the drift layer, over an entire area of the drift layer, and a difference obtained by subtracting the concentration of the carbons that function as acceptors in the drift layer from the concentration of the donors in the drift layer, is gradually decreased from a substrate side toward a surface side of the drift layer.
1. A nitride semiconductor substrate, comprising:
a substrate configured as an n-type semiconductor substrate; and
a drift layer provided on the substrate and configured as a gallium nitride layer containing donors and carbons,
wherein a concentration of the donors in the drift layer is 5.0×10 16 /cm 3 or less, and is equal to or more than a concentration of the carbons that function as acceptors in the drift layer, over an entire area of the drift layer,
the concentration of the donors in the drift layer is gradually decreased from a substrate side toward a surface side of the drift layer,
a total concentration of the carbons in the drift layer is gradually increased from the substrate side toward the surface side of the drift layer, and
a difference obtained by subtracting the concentration of the carbons that function as the acceptors in the drift layer from the concentration of the donors in the drift layer, is gradually decreased from the substrate side toward the surface side of the drift layer.
2. A nitride semiconductor substrate, comprising:
a substrate configured as an n-type semiconductor substrate; and
a drift layer provided on the substrate and configured as a gallium nitride layer containing donors and carbons,
wherein a concentration of the donors in the drift layer is 5.0×10 16 /cm 3 or less, and is equal to or more than a concentration of the carbons that function as acceptors in the drift layer, over an entire area of the drift layer,
the concentration of the donors in the drift layer is gradually decreased from a substrate side toward a surface side of the drift layer,
a total concentration of the carbons in the drift layer is constant from the substrate side toward the surface side of the drift layer, and
a difference obtained by subtracting the concentration of the carbons that function as the acceptors in the drift layer from the concentration of the donors in the drift layer, is gradually decreased from the substrate side toward the surface side of the drift layer.
3. A nitride semiconductor substrate, comprising:
a substrate configured as an n-type semiconductor substrate; and
a drift layer provided on the substrate and configured as a gallium nitride layer containing donors and carbons,
wherein a concentration of the donors in the drift layer is 5.0×10 16 /cm 3 or less, and is equal to or more than a concentration of the carbons that function as acceptors in the drift layer, over an entire area of the drift layer,
the concentration of the donors in the drift layer is gradually decreased from a substrate side toward a surface side of the drift layer,
a total concentrations of the carbon in the drift layer is gradually decreased from the substrate side toward the surface side of the drift layer, and
a difference obtained by subtracting the concentration of the carbons that function as the acceptors in the drift layer from the concentration of the donors in the drift layer, is gradually decreased from the substrate side toward the surface side of the drift layer.
4. A nitride semiconductor substrate, comprising:
a substrate configured as an n-type semiconductor substrate; and
a drift layer provided on the substrate and configured as a gallium nitride layer containing donors and carbons,
wherein a concentration of the donors in the drift layer is 5.0×10 16 /cm 3 or less, and is equal to or more than a concentration of the carbons that function as acceptors in the drift layer, over an entire area of the drift layer, and
a difference obtained by subtracting the concentration of the carbons that function as the acceptors in the drift layer from the concentration of the donors in the drift layer, is monotonically decreased from a substrate side toward a surface side of the drift layer.
5. The nitride semiconductor substrate according to claim 4 , wherein the difference obtained by subtracting the concentration of the carbons that function as the acceptors in the drift layer from the concentration of the donors in the drift layer, is linearly decreased from the substrate side toward the surface side of the drift layer.
6. A nitride semiconductor substrate, comprising:
a substrate configured as an n-type semiconductor substrate; and
a drift layer provided on the substrate and configured as a gallium nitride layer containing donors and carbons,
wherein a concentration of the donors in the drift layer is 5.0×10 16 /cm 3 or less, and is equal to or more than a concentration of the carbons that function as acceptors in the drift layer, over an entire area of the drift layer, and
a difference obtained by subtracting the concentration of the carbons that function as the acceptors in the drift layer from the concentration of the donors in the drift layer, is decreased gradually and stepwise from the substrate side toward the surface side of the drift layer.
7. A nitride semiconductor substrate, comprising:
a substrate configured as an n-type semiconductor substrate; and
a drift layer provided on the substrate and configured as a gallium nitride layer containing donors and carbons,
wherein a concentration of the donors in the drift layer is 5.0×10 16 /cm 3 or less, and is equal to or more than a concentration of the carbons that function as acceptors in the drift layer, over an entire area of the drift layer, and
a difference obtained by subtracting the concentration of the carbons that functions as the acceptors in the drift layer from the concentration of the donors in the drift layer, is gradually and nonlinearly decreased from the substrate side toward the surface side of the drift layer.
8. The nitride semiconductor substrate according to claim 1 , 2 , or 3 , wherein the concentration of the donors in the drift layer is ⅓ times or more of the a total concentration of the carbons in the drift layer over the entire area of the drift layer.
9. The nitride semiconductor substrate according to claim 4 , 6 , or 7 , wherein the concentration of the donors in the drift layer is ⅓ times or more of a total concentration of the carbons in the drift layer over the entire area of the drift layer.
10. The nitride semiconductor substrate according to claim 1 , 2 , 3 , 4 , 6 , or 7 , wherein the drift layer contains hydrogen, and a concentration of the hydrogen in the drift layer is 5.0×10 16 /cm 3 or less.
11. A semiconductor device, comprising the nitride semiconductor substrate according to claim 1 , 2 , 3 , 4 , 6 , or 7 .
12. A method for manufacturing the nitride semiconductor substrate according to claim 1 , 2 , 3 , 4 , 6 , or 7 comprising:
forming the drift layer as the gallium nitride layer containing the donors and the carbons on the n-type semiconductor substrate.