IP Library Granted Patent US 10,978,988
Granted Patent B2
US 10,978,988 · App. 16/089,249 · Granted Apr 13, 2021

Selective emitter for thermophotovoltaic power generator

Inventors: Shinji Tokumaru (Tokyo, JP); Tomohiro Uno (Tokyo, JP)
Assignee: NIPPON STEEL CORPORATION
H02S10/30C01B33/12C01G23/047C01G35/00C01G37/033H01L31/055
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,978,988
App. No.
16/089,249
Granted
Apr 13, 2021
Kind
B2
Abstract

A selective emitter exhibiting heat resistance up to 1000° C., comprising a metal body, a first dielectric layer provided on one surface of the metal body, a composite layer provided on another surface of the first dielectric layer at an opposite side to the metal body side, and a second dielectric layer provided on another surface of the composite layer at an opposite side to the first dielectric layer, the composite layer being a layer provided with a metal or semiconductor dispersed in an oxide of the metal or the semiconductor.

Claims (23)

1. A selective emitter comprising

a metal body,

a lower layer made of a dielectric provided on one surface of the metal body,

a composite layer provided on another surface of the lower layer at an opposite side to the metal body side, and

an upper layer made of a dielectric provided on another surface of the composite layer at an opposite side to the lower layer, and

the composite layer being a layer provided with a metal or semiconductor dispersed in an oxide of the metal or the semiconductor,

wherein the metal body is formed by titanium-tungsten-silicide (Ti—W—Si) and tungsten silicide (W—Si) stacked together.

2. The selective emitter according to claim 1 wherein

the metal or semiconductor dispersed in the composite layer is one selected from Cr, Si, Ta, and Ti, and

the lower layer and the upper layer are an oxide of the metal or the semiconductor.

3. The selective emitter according to claim 1 wherein

the metal or semiconductor dispersed in the composite layer is one selected from Cr, Si, Ta, and Ti,

the lower layer is an oxide of the metal or the semiconductor, or SiO 2 , and

the upper layer is SiO 2 .

4. The selective emitter according to claim 1 wherein a physical thickness of the composite layer is 5 nm to 200 nm and physical thicknesses of the lower layer and the upper layer are 10 nm to 300 nm.

5. The selective emitter according to claim 1 comprising

a substrate provided on another surface of the metal body at an opposite side to the one surface and

a gray body provided on a surface of the substrate at an opposite side to the metal body side.

6. The selective emitter according to claim 5 wherein the substrate is Si or quartz.

7. The selective emitter according to claim 5 wherein the substrate is comprised of Si and an SiO 2 film is provided between the substrate and the metal body.

8. The selective emitter according to claim 5 wherein the substrate is a metal substrate.

9. The selective emitter according to claim 8 wherein the metal substrate is formed by an Fe alloy or Ni alloy.

10. The selective emitter according to claim 5 wherein the gray body comprises at least one of SiC, Fe oxide, Cr oxide, Ni oxide, or a mixture of an Fe oxide, Cr oxide, and Ni oxide.

Assignments (2)
CHANGE OF NAME Recorded May 14, 2019
From: NIPPON STEEL & SUMITOMO METAL CORPORATION
To: NIPPON STEEL CORPORATION
Reel/Frame 049257/0828 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2018
From: TOKUMARU, SHINJI; UNO, TOMOHIRO
To: NIPPON STEEL & SUMITOMO METAL CORPORATION
Reel/Frame 047001/0340 →