RF transition assembly comprising an open coaxial structure with a cavity for receiving a conductor that is coupled orthogonal to an RF transmission layer
An RF transition assembly ( 300 ) for enabling a radiofrequency transition between an RF transmission layer ( 301 ) of an electronic device and a conductor ( 309 ) which is electrically connected ( 317 ) to the RF transmission layer ( 301 ). The conductor ( 309 ) extends generally orthogonal to the RF transmission layer ( 301 ). The assembly comprises an open coaxial structure ( 313 ) located adjacent to an edge of the RF transmission layer ( 301 ). The open coaxial structure ( 313 ) comprises a cavity ( 315 ) extending therethrough for receiving the conductor ( 309 ). The cavity ( 315 ) comprises an opening facing the edge of the RF transmission layer ( 301 ) so as to direct electromagnetic radiation towards the RF transmission layer ( 301 ).
1. A Radiofrequency (RF) transition assembly for enabling an RF transition between an RF transmission layer of an electronic device and a conductor extending generally orthogonal to the RF transmission layer and being electrically connected to the RF transmission layer, the RF transition assembly comprising:
an open coaxial structure located adjacent to an edge of the RF transmission layer and comprising a cavity extending therethrough for receiving the conductor,
the cavity of the open coaxial structure comprising an opening facing the edge of the RF transmission layer so as to direct electromagnetic radiation towards the RF transmission layer, and
a height of the open coaxial structure, with respect to the conductor, being equal to or greater than a radius of the cavity of the open coaxial structure.
2. The RF transition assembly of claim 1 , wherein the cavity of the open coaxial structure has a cross section corresponding to a circular segment.
3. The RF transition assembly of claim 1 , wherein a cross section of the cavity of the open coaxial structure encloses an angle greater than 180°.
4. The RF transition assembly of claim 1 , wherein a cross section of the cavity of the open coaxial structure encloses an angle between about 180° and about 340°.
5. The RF transition assembly of claim 1 , further comprising:
one or more ground interconnections between the open coaxial structure and one or more grounding regions of the RF transmission layer.
6. The RF transition assembly of claim 1 , wherein at least a portion of the open coaxial structure extends in a plane of the RF transmission layer.
7. A package for the electronic device, the package comprising the RF transition assembly of claim 1 .
8. The RF transition assembly of claim 1 , wherein a cross section of the cavity of the open coaxial structure encloses an angle of about 240°.
9. The RF transition assembly of claim 1 , wherein an end of the conductor is enclosed within the cavity of the open coaxial structure by a portion of the open coaxial structure extending in a direction generally orthogonal to the conductor.
10. The RF transition assembly of claim 1 , wherein the open coaxial structure further comprises one or more stepped grounding regions adjacent to the RF transmission layer which are coplanar with one or more grounding regions of the RF transmission layer; and
wherein the RF transition assembly further comprises one or more grounded interconnections between the one or more stepped grounding regions and the one or more grounding regions of the RF transmission layer.
11. An electronic device comprising:
a package body;
a radiofrequency (RF) substrate mounted on a face of the package body;
an RF transmission layer mounted on the RF substrate such that the RF substrate forms a layer between the RF transmission layer and the package body;
a conductor electrically connected to the RF transmission layer and which extends through the package body in a direction generally orthogonal to the RF transmission layer; and
an open coaxial structure located on the face of the package body adjacent to an edge of the RF transmission layer,
the open coaxial structure comprising a cavity extending therethrough for receiving the conductor,
the cavity comprising an opening facing the edge of the RF transmission layer so as to direct electromagnetic radiation towards the RF transmission layer, and
a height of the open coaxial structure, with respect to the conductor, being equal to or greater than a radius of the cavity.
12. The electronic device of claim 11 , wherein a cross section of the cavity encloses an angle of about 240°.
13. The electronic device of claim 11 , wherein the open coaxial structure is separated from the RF substrate by a gap.
14. The electronic device of claim 11 , wherein the open coaxial structure further comprises:
one or more stepped grounding regions adjacent to the RF transmission layer which are coplanar with one or more grounding regions of the RF transmission layer; and
wherein the electronic device further comprises:
one or more grounded interconnections between the one or more stepped grounding regions and the one or more grounding regions of the RF transmission layer.
15. The electronic device of claim 11 , wherein the cavity has a cross section corresponding to a circular segment.
16. The electronic device of claim 11 , wherein a cross section of the cavity encloses an angle greater than 180°.
17. The electronic device of claim 11 , wherein a cross section of the cavity encloses an angle between about 180° and about 340°.
18. The electronic device of claim 11 , further comprising:
one or more ground interconnections between the open coaxial structure and one or more grounding regions of the RF transmission layer.
19. The electronic device of claim 11 , wherein at least a portion of the open coaxial structure extends in a plane of the RF transmission layer.
20. The electronic device of claim 11 , wherein an end of the conductor is enclosed within the cavity by a portion of the open coaxial structure extending in a direction generally orthogonal to the conductor.