IP Library Granted Patent US 11,063,524
Granted Patent B2
US 11,063,524 · App. 16/091,566 · Granted Jul 13, 2021

Electrical device having a semiconductor circuit

Inventors: Martin Kapelke (Nuremberg, DE); Manfred Suda (Hemhofen, DE)
Assignee: Siemens Energy Global GmbH & Co. KG
H02M7/003H01L25/112H01L25/165H02M7/155H02J3/36Y02E60/60
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Quick Facts
Patent No.
US 11,063,524
App. No.
16/091,566
Granted
Jul 13, 2021
Kind
B2
Abstract

An electrical device with a semiconductor circuit that is configured for a high voltage and is arranged in a housing. The housing is formed of a plurality of housing parts which are electrically insulated from one another. Different electrical potentials can be assigned to the housing parts. There is also described an converter with the electrical device.

Claims (32)

1. An electrical device, comprising:

a housing composed of a module frame;

a semiconductor circuit configured for high voltage arranged in said housing;

said semiconductor circuit having at least two thyristor modules, an upper valve choke, and a lower valve choke;

said at least two thyristor modules each having a series circuit of thyristors and an associated thyristor circuit;

said module frame having a plurality of frame segments being electrically insulated from each other by insulating components in the form of insulating spacers, wherein different electrical potentials can be assigned to each of said frame segments to allow each frame segment to have a different pre-defined potential during operation of the thyristor module.

2. The electrical device according to claim 1 , wherein said frame segments are arranged around the semiconductor circuit in such a way that they form a C-shape.

3. The electrical device according to claim 1 , wherein said electrical device is a thyristor module.

4. An electrical device, comprising:

a housing; and

a semiconductor circuit configured for high voltage arranged in said housing;

said housing being formed of a plurality of housing parts that are electrically insulated from one another, wherein different electrical potentials are assignable to said housing parts;

wherein said housing is a module frame and said semiconductor circuit is mounted on said module frame; and

wherein said semiconductor circuit comprises a plurality of power semiconductors connected in series.

5. The electrical device according to claim 4 , wherein at least one of said power semiconductors is a thyristor.

6. The electrical device according to claim 5 , further comprising a valve choke assigned to said thyristor.

7. The electrical device according to claim 4 , wherein each of said power semiconductors has an electrical blocking capacity of at least 1 kV.

8. The electrical device according to claim 7 , wherein said power semiconductors include thyristors and each thyristor is assigned a valve choke.

9. An electrical device, comprising:

a housing; and

a semiconductor circuit configured for high voltage arranged in said housing;

said housing being formed of a plurality of housing parts that are electrically insulated from one another, wherein different electrical potentials are assignable to said housing parts;

wherein said housing is a module frame and said semiconductor circuit is mounted on said module frame; and

wherein said module frame comprises a plurality of frame segments that are isolated from one another by way of insulator components.

10. The electrical device according to claim 9 , wherein at least one of said housing parts is at a high-voltage potential in operation.

11. The electrical device according to claim 9 , wherein mutually adjacent housing parts have a potential difference between 1 kV and 200 kV in operation.

12. An electrical device, comprising:

a housing; and

a semiconductor circuit configured for high voltage arranged in said housing;

said housing being formed of a plurality of housing parts that are electrically insulated from one another, wherein different electrical potentials are assignable to said housing parts;

wherein said housing is a module frame and said semiconductor circuit is mounted on said module frame; and

wherein said module frame is a C-shaped module frame.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2021
From: SIEMENS AKTIENGESELLSCHAFT
To: SIEMENS ENERGY GLOBAL GMBH & CO. KG
Reel/Frame 055615/0389 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2018
From: KAPELKE, MARTIN; SUDA, MANFRED
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 047288/0385 →