Image pickup module and image pickup device
An imaging module includes: a substrate on which an imaging element is mounted and in which a through-hole is formed; a holding section that has a support pin inserted into the through-hole in such a manner that the support pin penetrates the through-hole and that holds an optical system forming a subject image on the imaging element; and an adhesive that is provided in the through-hole and that fixes the substrate to the support pin, and at least a tip end portion of the support pin has a tapered shape from a root side of the support pin toward a tip end of the support pin.
1. An imaging module comprising:
a substrate on which an imaging element is mounted and in which a through-hole is formed;
a holding section that has a support pin inserted into the through-hole in such a manner as to penetrate the through-hole, and that holds an optical system forming a subject image on the imaging element; and
an adhesive that is provided in the through-hole and that fixes the substrate to the support pin, wherein
at least a tip end portion of the support pin is of a tapered shape from a root side of the support pin toward a tip end of the support pin,
the support pin is inserted into the through-hole in such a manner as to penetrate the through-hole from a first opening surface that is one of opening surfaces to a second opening surface that is an other opening surface,
a first portion of the adhesive protrudes outside of the through-hole beyond the second opening surface,
on the second opening surface, the support pin penetrates through the first portion of the adhesive and protrudes past the first portion of the adhesive, and
a second portion of the adhesive provided in the through-hole is recessed into the first opening surface, such that a portion of the second portion that is in contact with the substrate extends past an other portion of the second portion that is in contact with the support pin, and a gap is provided between the first opening surface and the second portion.
2. The imaging module according to claim 1 , further comprising
an adhesive that is disposed around the imaging element and that fixes the holding section to the substrate.
3. The imaging module according to claim 1 , wherein
a film that prevents adhesion of the adhesive is formed in at least a portion including a tip end of the tip end portion.
4. The imaging module according to claim 1 , wherein
the holding section and the support pin are formed integrally by a resin.
5. The imaging module according to claim 1 , wherein
a plurality of support pins are in the substrate,
a first fillet is formed between the first portion of the adhesive and the second portion of the adhesive and protrudes outside of the through-hole beyond the second opening surface and outside of the through-hole beyond the first opening surface, and
a second fillet is formed between the first opening surface and the second opening surface.
6. The imaging module according to claim 5 , wherein
a contact area of the first fillet is greater than a contact area of the second fillet.
7. An imaging apparatus including the imaging module according to claim 1 .