IP Library Granted Patent US 10,982,345
Granted Patent B2
US 10,982,345 · App. 16/099,791 · Granted Apr 20, 2021

Tin-plated product and method for producing same

Inventors: Hirotaka Kotani (Tokyo, JP); Hiroto Narieda (Tokyo, JP); Akira Sugawara (Tokyo, JP); Yuta Sonoda (Tokyo, JP); Yoshitaka Ito (Shizuoka, JP)
Assignees: Dowa Metaltech Co., Ltd.; Yazaki Corporation
C25D5/505B32B15/01C22F1/16C25D3/30C25D5/12C25D5/50C25D7/00H01R13/03H01R43/16
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Quick Facts
Patent No.
US 10,982,345
App. No.
16/099,791
Granted
Apr 20, 2021
Kind
B2
Abstract

After drying the surface of a tin plating layer having a thickness of 0.4 to 3 μm which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm 2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.

Claims (14)

1. A tin-plated product comprising:

a base material of copper or a copper alloy;

a copper-tin alloy layer formed on the base material; and

a tin layer formed on the copper-tin alloy layer,

wherein the tin-plated product has a glossiness of 0.3 to 0.7, and

wherein the outermost surface of the tin-plated product has an average height Rc of 0.1 to 1.0 μm.

2. A tin-plated product as set forth in claim 1 , wherein said tin layer has a structure obtained by solidification after melting.

3. A tin-plated product as set forth in claim 1 , wherein the outermost surface of said tin-plated product has an arithmetic average roughness Ra of 0.05 to 0.20 μm.

4. A tin-plated product as set forth in claim 1 , wherein the outermost surface of said tin-plated product has an oil reservoir depth Rvk of 0.03 to 0.20 μm.

5. A tin-plated product as set forth in claim 1 , wherein the outermost surface of said tin-plated product has a rough curve element average length RSm of 2 to 7 μm.

6. A tin-plated product as set forth in claim 1 , which further comprises a nickel layer or a nickel alloy layer, the nickel layer or the nickel alloy layer being formed between said base material and said copper-tin alloy layer.

7. A tin-plated product as set forth in claim 1 , which further comprises a lubricant layer formed on the tin layer.

8. A tin-plated product as set forth in claim 1 , wherein said tin layer is formed on the whole surface of said copper-tin alloy layer.

9. A terminal which uses a tin-plated product as set forth in claim 1 , as a material thereof.

Assignments (3)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2018
From: KOTANI, HIROTAKA; NARIEDA, HIROTO; SUGAWARA, AKIRA; SONODA, YUTA
To: DOWA METALTECH CO., LTD.
Reel/Frame 047451/0008 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2018
From: ITO, YOSHITAKA
To: YAZAKI CORPORATION
Reel/Frame 047451/0209 →