Display device, display module, method of manufacturing display device, and method of manufacturing display module

1. A display module comprising:

a display device configured such that a pixel region in which a plurality of pixels for displaying an image are arranged is formed on an upper surface of a substrate, and a device-side signal electrode for exchanging a signal related to the pixels with an outside is disposed on a side surface of the substrate; and

a module casing configured to store the display device and have a casing-side signal electrode electrically connected to the device-side signal electrode in a spot facing the device-side signal electrode.

2. The display module according to claim 1 , wherein an electrode disposition region in which the device-side signal electrode is disposed in a side surface of the substrate has a tapered shape in which an area of a cross section parallel to an in-plane direction of the substrate is gradually changed from the upper surface to a lower surface.

3. The display module according to claim 2 , wherein the electrode disposition region of the substrate has a forward tapered shape in which the area of the cross section parallel to the in-plane direction of the substrate gradually increases from the upper surface to the lower surface.

4. The display module according to claim 2 , wherein the electrode disposition region of the substrate has a reverse tapered shape in which the area of the cross section parallel to the in-plane direction of the substrate gradually decreases from the upper surface to the lower surface.

5. The display module according to claim 2 , wherein a spot in which the casing-side signal electrode is disposed in the module casing has a surface substantially parallel to the electrode disposition region in which the device-side signal electrode is disposed in the side surface of the substrate.

6. The display module according to claim 5 , wherein the casing-side signal electrode has a plate spring shape.

7. A method of manufacturing a display module, the method comprising:

fabricating a display device configured such that a pixel region in which a plurality of pixels for displaying an image are arranged is formed on an upper surface of a substrate, and a device-side signal electrode for exchanging a signal related to the pixels with an outside is disposed on a side surface of the substrate; and

storing the display device in a module casing that has a casing-side signal electrode electrically connected to the device-side signal electrode.

8. The method of manufacturing the display module according to claim 7 , wherein fabricating the device-side signal electrode includes:

processing a region into a tapered shape, the region corresponding to an outer circumference of a region corresponding to the one display device in the substrate in a wafer state; and

forming a wiring pattern corresponding to the device-side signal electrode in the region that has the tapered shape in the substrate.

9. The method of manufacturing the display module according to claim 7 , wherein the display device is stored in the module casing such that the device-side signal electrode is pressed to the casing-side signal electrode.

10. A display device comprising:

a first substrate configured such that a pixel region in which a plurality of pixels for displaying an image are arranged is formed on an upper surface;

a second substrate provided in an upper layer of the first substrate via a bonding material for bonding the first substrate and configured to be transparent to light exiting from the pixels;

a signal electrode located on an upper surface of the second substrate and configured to exchange a signal related to the pixels with an outside; and

a connection structure for electrically connecting the signal electrode and the first substrate includes a first via-hole provided to penetrate the second substrate in a thickness direction, the connection structure including an extraction wiring that is electrically connected to a wiring for a predetermined signal related to the pixels and extends to a portion immediately below the first via-hole above the first substrate, and a connection electrode that electrically connects a lower surface of the first via-hole to the extraction wiring;

wherein the bonding material is a sealing material that is located to surround the pixel region in an in-plane direction and seals the pixel region, and

the connection electrode is located outside the sealing material in the in-plane direction.

11. The display device according to claim 10 ,

wherein the connection structure includes

a second extraction electrode that is located immediately below the sealing material above the first substrate and is electrically connected to the wiring for the predetermined signal related to the pixels, and

a second via-hole that is provided to penetrate at least the sealing material in a thickness direction and to reach the second extraction electrode, and is located immediately below the first via-hole.

12. The display device according to claim 10 ,

wherein a space located above the pixel region and corresponding to an inside of the sealing material is filled with a sealing resin.

13. A display module comprising:

a display device including

a first substrate configured such that a pixel region in which a plurality of pixels for displaying an image are arranged is formed on an upper surface,

a second substrate provided in an upper layer of the first substrate via a bonding material for bonding the first substrate and configured to be transparent to light exiting from the pixels, and

a device-side signal electrode located on an upper surface of the second substrate and configured to exchange a signal related to the pixels with an outside; and

a module casing configured to store the display device,

wherein a casing-side signal electrode electrically connected to the device-side signal electrode via a bump is in a spot corresponding to the device-side signal electrode of the module casing.

14. A method of manufacturing a display device, the method comprising:

forming a pixel region in which a plurality of pixels for displaying an image are arranged on an upper surface of a first substrate; and

bonding a second substrate transparent to light exiting from the pixels, to the upper surface of the first substrate via a bonding material,

wherein a signal electrode for exchanging a signal related to the pixels with an outside is formed on an upper surface of the second substrate,

wherein a connection structure for electrically connecting the signal electrode and the first substrate includes a first via-hole provided to penetrate the second substrate in a thickness direction,

forming the first via-hole and the signal electrode is performed before the second substrate is bonded to the first substrate, and

forming the first via-hole and the signal electrode includes

forming a through-hole in the second substrate,

forming a conductive material as a film on at least a side wall in the through-hole provided in the second substrate such that the conductive material extends between the upper surface and a lower surface of the second substrate, and

forming the signal electrode electrically connected to the conductive material formed as the film in the through-hole by patterning the film formed of the conductive material into a predetermined shape.

15. The method of manufacturing the display device according to claim 14 ,

wherein the bonding material is a sealing material that is located to surround the pixel region in an in-plane direction and seals the pixel region, and

the connection structure includes

a second extraction electrode that is located immediately below the sealing material above the first substrate and is electrically connected to a wiring for a predetermined signal related to the pixels, and

a second via-hole that is provided to penetrate at least the sealing material immediately below the first via-hole in a thickness direction and to reach the second extraction electrode.

16. The method of manufacturing the display device according to claim 15 ,

wherein forming the first via-hole and the second via-hole is performed after the second substrate is bonded to the first substrate, and

forming the first via-hole and the second via-hole includes

forming a through-hole reaching the second extraction electrode in a stacked structure including the second substrate and the sealing material above the first substrate, and

forming a conductive material as a film on at least a side wall in the through-hole provided in the stacked structure including the second substrate and the sealing material above the first substrate such that the conductive material extends between the upper surface of the second substrate and the second extraction electrode.