Access line grain modulation in a memory device

1. A method, comprising:

forming a set of materials for memory cell stacks in a cross-point memory array

forming, above the set of materials, a barrier material;

planarizing a top surface of the barrier material; and

forming, after planarizing the top surface and above the planarized top surface of the barrier material, a metal layer for an access line of the cross-point memory array.

2. The method of claim 1 , wherein planarizing the top surface of the barrier material comprises:

applying a chemical-mechanical planarization (CMP) process to the top surface of the barrier material.

3. The method of claim 1 , wherein forming the barrier material comprises:

depositing the barrier material via a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, an atomic layer deposition (ALD) process, or any combination thereof.

4. The method of claim 1 , wherein forming the set of materials comprises:

forming an electrode layer, wherein the electrode layer comprises carbon.

5. The method of claim 4 , wherein forming the electrode layer comprises:

depositing the electrode layer via a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, an atomic layer deposition (ALD) process, or any combination thereof.

6. The method of claim 4 , further comprising:

removing at least a portion of the electrode layer.

7. The method of claim 1 , wherein:

the barrier material comprises tungsten nitride, tungsten silicide, or tungsten silicon nitride; and

the metal layer for the access line comprises tungsten, tantalum, or molybdenum.

8. A method, comprising:

forming a set of materials for memory cell stacks in a cross-point memory array, wherein forming the set of materials comprises depositing a dielectric material that is interposed between materials for a first subset of the memory cell stacks and materials for a second subset of the memory cell stacks;

removing a portion of the dielectric material and a portion of an electrode layer of the set of materials, wherein removal of the electrode layer occurs at a first rate and removal of the dielectric material occurs at a second rate that is different than the first rate, and wherein removing the portion of the dielectric material and the portion of the electrode layer forms an undulating surface below a barrier material;

forming, above the set of materials, the barrier material;

planarizing a top surface of the barrier material; and

forming, on the top surface of the barrier material, a metal layer for an access line of the cross-point memory array.

9. An apparatus, comprising:

a memory cell stack in a cross-point memory array, the memory cell stack comprising a storage element;

a barrier material disposed above the memory cell stack, the barrier material comprising a planarized top surface, wherein the barrier material comprises an undulating bottom surface; and

a metal layer for an access line above the planarized top surface of the barrier material.

10. The apparatus of claim 9 , wherein:

the barrier material comprises tungsten nitride, tungsten silicide, or tungsten silicon nitride; and

the metal layer comprises tungsten, tantalum, or molybdenum.

11. The apparatus of claim 9 , further comprising:

an electrode layer within the memory cell stack, wherein the electrode layer has a top surface in contact with a bottom surface of the barrier material, wherein an interface between the top surface of the electrode layer and the bottom surface of the barrier material is separated from the metal layer by a varying distance.

12. The apparatus of claim 11 , wherein the electrode layer comprises carbon.

13. The apparatus of claim 9 , wherein:

a center of the memory cell stack is separated from a center of an immediately neighboring memory cell stack by a cell pitch distance; and

the metal layer has an average grain size greater than twice the cell pitch distance.

14. An apparatus, comprising:

a memory cell stack in a cross-point memory array, the memory cell stack comprising a storage element;

a barrier material disposed above the memory cell stack, the barrier material comprising a planarized top surface, wherein the barrier material has a first thickness in a first region above the memory cell stack, and wherein the barrier material has a second thickness in a second region, and wherein the second region is interposed between the first region and a third region that is above a second memory cell stack; and

a metal layer for an access line above the planarized top surface of the barrier material.

15. The apparatus of claim 14 , further comprising:

a dielectric material surrounding the memory cell stack, wherein the dielectric material has a top surface in contact with the barrier material, wherein the second region is above the dielectric material.

16. The apparatus of claim 14 , wherein the second thickness is less than the first thickness.

17. A method, comprising:

forming a set of materials for a memory cell stack;

forming a barrier material having a top surface and a bottom surface above the set of materials;

reducing the top surface of the barrier material by polishing the top surface of the barrier material; and

forming, after polishing the top surface of the barrier material and above the polished top surface of the barrier material, a metal layer for an access line above the top surface of the barrier material.

18. The method of claim 17 , further comprising:

etching a top surface of an electrode layer of the set of materials;

etching a top surface of a dielectric material interposed between the electrode layer and a second set of materials for a second memory cell stack; and

forming an undulating surface based at least in part on etching the top surface of the electrode layer and etching the top surface of the dielectric material.

19. The method of claim 18 , further comprising:

forming the barrier material on top of the undulating surface.

20. The method of claim 17 , wherein forming the barrier material comprises:

forming an interface between an electrode layer of the set of materials and the bottom surface of the barrier material, wherein the interface has an undulation pattern.

21. The method of claim 17 , wherein reducing the top surface of the barrier material comprises:

changing the barrier material from having a uniform thickness to having a varied thickness by applying a chemical-mechanical planarization (CMP) process to the top surface of the barrier material.