IP Library Granted Patent US 10,707,268
Granted Patent B2
US 10,707,268 · App. 16/103,678 · Granted Jul 7, 2020

Magnetoresistive element and magnetic memory

Inventors: Masaki Endo (Kawasaki, JP); Tadaomi Daibou (Yokohama, JP); Shumpei Omine (Meguro, JP); Akiyuki Murayama (Koga, JP); Junichi Ito (Yokohama, JP)
Assignee: TOSHIBA MEMORY CORPORATION
H01L27/222H01L27/228H01L43/02H01L43/08H01L43/10H01L43/12
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,707,268
App. No.
16/103,678
Granted
Jul 7, 2020
Kind
B2
Abstract

A magnetoresistive element according to an embodiment includes: a first layer; a first magnetic layer; a second magnetic layer disposed between the first layer and the first magnetic layer; a nonmagnetic layer disposed between the first magnetic layer and the second magnetic layer; and an insulating layer disposed at least on side surfaces of the nonmagnetic layer, the first layer including: at least one element selected from a first group consisting of Hf, Zr, Al, Cr, and Mg; and at least one element selected from a second group consisting of Ta, W, Mo, Nb, Si, Ge, Be, Li, Sn, Sb, and P, and the insulating layer including at least one element selected from the first group.

Claims (47)

1. A magnetoresistive element comprising:

a first magnetic layer;

a second magnetic layer;

a nonmagnetic layer disposed between the first magnetic layer and the second magnetic layer;

a first layer including: at least one element selected from a first group consisting of Hf, Zr, Al, Cr, and Mg, the second magnetic layer being disposed between the first magnetic layer and the first layer;

a second layer including at least one element selected from a second group consisting of Ge, Be, Li, Sn, Sb, and P, the second layer being disposed between the first layer and the second magnetic layer;

a third layer including at least one element selected from a group consisting of Hf, Zr, Al, Cr, Ti, Sc, and Mg, the third layer being disposed between the second layer and the second magnetic layer; and

an insulating layer disposed at least on a side surface of the nonmagnetic layer, the insulating layer including the at least one element selected from the first group,

wherein:

the second magnetic layer includes a third magnetic layer, a fourth magnetic layer disposed between the third magnetic layer and the nonmagnetic layer, and a fourth layer disposed between the third magnetic layer and the fourth magnetic layer;

the third magnetic layer includes at least one of an alloy having a L1 0 structure containing Fe or MnGa, an artificial superlattice containing Co, CoCrPt, a MnGa alloy having a DO 22 structure, or a rare earth magnetic compound; and

the fourth layer includes at least one of B, Zr, Hf, Ta, Nb, Mo, W, Ti, V, Cr, Mn, Ni, Cu, Ru, Ag, Mg, or a rare earth element.

2. The magnetoresistive element according to claim 1 , wherein the third layer includes a nitride of the at least one element selected from the group consisting of Hf, Zr, Al, Cr, Ti, Sc, and Mg.

3. A magnetic memory comprising:

the magnetoresistive element according to claim 1 ;

a first wiring electrically connected to the first magnetic layer of the magnetoresistive element; and

a second wiring electrically connected to the second magnetic layer of the magnetoresistive element.

4. The magnetic memory according to claim 3 , wherein the first layer includes an alloy of at least one element selected from the first group, and at least one element selected from the second group.

5. The magnetic memory according to claim 3 , wherein the first layer has a first region and a second region disposed between the first region and the second magnetic layer, and the at least one element selected from the second group has a higher concentration in the second region than in the first region.

6. The magnetic memory according to claim 3 , further comprising a fifth layer disposed between the first layer and the third magnetic layer, the fifth layer including at least one of Hf, Zr, Al, Cr, or Mg.

7. The magnetic memory according to claim 3 , further comprising a fifth layer disposed between the first layer and the third magnetic layer, the fifth layer including at least one of Ru, Pt, Pd, Mo, W, or Ti.

8. The magnetic memory according to claim 3 , further comprising a fifth layer disposed between the first layer and the third magnetic layer, the fifth layer including a nitride of at least one of Hf, Zr, Al, Cr, Ti, Sc, or Mg.

9. A magnetoresistive element comprising:

a first magnetic layer;

a second magnetic layer;

a nonmagnetic layer disposed between the first magnetic layer and the second magnetic layer;

a first layer including: at least one element selected from a first group consisting of Hf, Zr, Al, Cr, and Mg; and at least one element selected from a second group consisting of Ta, W, Nb, Ge, Be, Li, Sn, Sb, and P, the second magnetic layer being disposed between the first layer and the first magnetic layer;

a second layer including at least one element selected from a group consisting of Hf, Zr, Al, Cr, Ti, Sc, and Mg, the second layer being disposed between the first layer and the second magnetic layer; and

an insulating layer disposed at least on a side surface of the nonmagnetic layer, the insulating layer including at least one element selected from the first group,

wherein the first layer includes a first region and a second region disposed between the first region and the second magnetic layer, and the at least one element selected from the second group has a higher concentration in the second region than in the first region.

10. The magnetoresistive element according to claim 9 , wherein the second layer includes a nitride of the at least one element selected from the group consisting of Hf, Zr, Al, Cr, Ti, Sc, and Mg.

11. A magnetoresistive element comprising:

a first layer;

a first magnetic layer;

a second magnetic layer disposed between the first layer and the first magnetic layer;

a nonmagnetic layer disposed between the first magnetic layer and the second magnetic layer; and

an insulating layer disposed on at least side surfaces of the nonmagnetic layer, wherein

the first layer includes at least one of Hf, Zr, Al, Cr, or Mg; or at least one of Ru, Pt, Pd, W, or Ti,

the second magnetic layer includes a third magnetic layer, a fourth magnetic layer disposed between the third magnetic layer and the nonmagnetic layer, and a second layer disposed between the third magnetic layer and the fourth magnetic layer,

the third magnetic layer includes at least one of an alloy having a L10 structure containing Fe or MnGa, an artificial superlattice containing Co, CoCrPt, a MnGa alloy having a DO22 structure, or a rare earth magnetic compound,

the second layer includes at least one of B, Zr, Hf, Ta, Nb, Mo, W, Ti, V, Cr, Mn, Ni, Cu, Ru, Ag, Mg, or a rare earth element,

at least one of the third magnetic layer and the fourth magnetic layer includes at least one of Hf, Zr, Al, Cr, or Mg, and

the insulating layer includes at least one of Hf, Zr, Al, Cr, or Mg.

12. A magnetic memory comprising:

the magnetoresistive element according to claim 11 ;

a first wiring electrically connected to the first magnetic layer of the magnetoresistive element; and

a second wiring electrically connected to the second magnetic layer of the magnetoresistive element.

Assignments (3)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →