IP Library Granted Patent US 10,644,170
Granted Patent B2
US 10,644,170 · App. 16/107,892 · Granted May 5, 2020

Metallization of conductive wires for solar cells

Inventors: Richard Hamilton Sewell (Los Altos, CA); David Aaron Randolph Barkhouse (Menlo Park, CA); Nils-Peter Harder (San Jose, CA); Douglas Rose (San Jose, CA)
Assignees: SunPower Corporation; Total Marketing Services and Total Energies Nouvelles Activites USA
H01L31/02008H01L24/78H01L31/0504H01L31/0516H01L31/18H01L31/188Y02E10/50
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Quick Facts
Patent No.
US 10,644,170
App. No.
16/107,892
Granted
May 5, 2020
Kind
B2
Abstract

Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.

Claims (30)

1. A system for electrically coupling solar cells, the system comprising:

a wire guide to align conductive wires substantially parallel with at least one doped region of a semiconductor substrate, wherein the wire guide comprises a plurality of grooves to align conductive wires substantially parallel with the at least one doped region of the semiconductor substrate;

a cover plate disposed over the wire guide, wherein the cover plate inhibits movement of the conductive wires in the plurality of grooves; and

a bonding head to bond the conductive wires to the at least one doped region of the semiconductor substrate, wherein the wire guide inhibits lateral movement of the conductive wires in contact with the bonding head.

2. The system of claim 1 , wherein the wire guide is aligned to the at least one doped region of a semiconductor substrate at an angle of at most 90 degrees.

3. The system of claim 1 , wherein the bonding head is configured to apply a mechanical force to bond the conductive wires to the at least one doped region of the semiconductor substrate.

4. The system of claim 1 , further comprising another wire guide to align the conductive wires to the wire guide.

5. The system of claim 1 , wherein the wire guide comprises a plurality of slots.

6. The system of claim 1 , wherein the wire guide comprises stainless steel or graphite.

7. A system for electrically coupling solar cells, the system comprising:

a wire guide to align conductive wires substantially parallel with at least one doped region of a semiconductor substrate, wherein the wire guide comprises a plurality of tubes; and

a bonding head to bond the conductive wires to the at least one doped region of the semiconductor substrate, wherein the wire guide inhibits lateral movement of the conductive wires in contact with the bonding head.

8. The system of claim 7 , wherein the plurality of tubes comprises a plurality of tubes having a half-tube extension.

9. A system for electrically coupling solar cells, the system comprising:

a wire guide to align conductive wires substantially parallel with at least one doped region of a semiconductor substrate, wherein the wire guide comprises a plurality of grooves to align conductive wires substantially parallel with the at least one doped region of the semiconductor substrate;

a cover plate disposed over the wire guide, wherein the cover plate inhibits movement of the conductive wires in the plurality of grooves; and

a roller coupled to a bonding head of the wire guide, wherein the roller is configured to bond the conductive wires to the at least one doped region of the semiconductor substrate, and wherein the wire guide inhibits lateral movement of the conductive wires in contact with the roller coupled to the bonding head.

10. The system of claim 9 , wherein the wire guide is aligned to the at least one doped region of a semiconductor substrate at an angle of at most 90 degrees.

11. The system of claim 9 , wherein the roller is a heated roller.

12. The system of claim 9 , further comprising another wire guide to align the conductive wires to the wire guide.

13. The system of claim 9 , wherein the wire guide comprises a plurality of slots.

14. The system of claim 9 , wherein the wire guide comprises stainless steel or graphite.

15. A system for electrically coupling solar cells, the system comprising:

a wire guide to align conductive wires substantially parallel with at least one doped region of a semiconductor substrate, wherein the wire guide comprises a plurality of tubes; and

a roller coupled to a bonding head of the wire guide, wherein the roller is configured to bond the conductive wires to the at least one doped region of the semiconductor substrate, and wherein the wire guide inhibits lateral movement of the conductive wires in contact with the roller coupled to the bonding head.

16. The system of claim 15 , wherein the plurality of tubes comprises a plurality of tubes having a half-tube extension.

17. The system of claim 15 , wherein the roller is a heated roller.

18. The system of claim 15 , further comprising another wire guide to align the conductive wires to the wire guide.

19. The system of claim 15 , wherein the wire guide comprises stainless steel or graphite.

20. The system of claim 15 , wherein the plurality of tubes comprises a plurality of tubes having a half-tube extension, wherein the roller is a heated roller, and wherein the wire guide comprises stainless steel or graphite.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2025
From: TOTALENERGIES SE
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 072946/0828 →
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: SUNPOWER CORPORATION
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 062699/0875 →