Multi-layered fabrication processing
A multi-layered electronic device including two or more stacked metal conducting layers, a dielectric layer disposed between metal conducting layers, and at least one electrical connection extending between contact pads of metal conducting layers and through a through hole of the dielectric layer is provided. A system including at least one multi-layered electronic device, a satellite coupled to at least one multi-layered electronic device, and a controller hub electrically connected to the multi-layered electronic device via the satellite is also provided. A method of manufacturing the multi-layered electronic device including forming first and second first metal conducting layers, depositing a dielectric layer adjacent to the metal conducting layers, and connecting the metal conducting layers is also provided.
1. An in-vivo electronic system comprising:
at least one multi-layered electronic device comprising two or more stacked metal conducting layers, each having a trace and one or more contact pads, a dielectric layer having at least one through hole and disposed between metal conducting layers, and at least one electrical connection extending between the contact pads of metal conducting layers and through the at least one through hole of the dielectric layer;
a satellite coupled to at least one of the at least one multi-layered electronic device; and
a controller hub electrically connected to the at least one multi-layered electronic device via the satellite.
2. The in-vivo electronic system of claim 1 , wherein the controller hub is wirelessly connectable to the satellite.
3. The in-vivo electronic system of claim 1 , wherein the satellite is wirelessly connectable to the at least one multi-layered electronic device.
4. The in-vivo electronic system of claim 1 , further comprising a transmission line electrically connected to the at least one multi-layered electronic device.
5. The in-vivo electronic system of any of claims 1 through 4 , wherein the at least one multi-layered electronic device is configured to be one of an electrode, an antenna, and a connector.
6. The in-vivo electronic system of claim 5 , wherein the at least one multi-layered electronic device is configured to be an electrode.
7. The in-vivo electronic system of claim 6 , wherein the at least one multi-layered electronic device is configured to be directly secured to a subject.
8. The in-vivo electronic system of claim 5 , wherein the at least one multi-layered electronic device is configured to be an antenna.
9. The in-vivo electronic system of claim 8 , wherein the at least one multi-layered electronic device is arranged into a tubular structure and comprises a tubular exterior insulating layer.
10. The in-vivo electronic system of claim 1 , wherein each metal conducting layer has a uniform cross-sectional geometry.
11. The in-vivo electronic system of claim 1 , further comprising at least one insulating layer positioned adjacent to the at least one metal conducting layer on an exterior surface of the multi-layered electronic device, at least one support layer adjacent to the least one insulating layer, and at least one ground layer adjacent to the at least one metal conducting layer.
12. The in-vivo electronic system of claim 1 , wherein at least one of the metal conducting layer and the electrical connection comprises a flexible metal foil or a thin film conductive ink.
13. The in-vivo electronic system of claim 12 , wherein at least one of the metal conducting layer and the electrical connection comprises gold, platinum, or carbon nanotube ink.
14. The in-vivo electronic system of claim 1 , wherein the metal conducting layer and dielectric layer together have a thickness of about 100 μm or less.