Semiconductor substrate support with multiple electrodes and method for making same
A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.
1. An electrostatic chuck, comprising a plate assembly formed from a first ceramic layer joined to a second ceramic layer with a metal joining layer, the plate assembly being provided with a plurality of grooves extending through the first ceramic layer and through the metal joining layer to provide one or more electrode portions formed from the metal joining layer and a dielectric material disposed in the plurality of grooves in at least the metal joining layer so as to electrically isolate the plurality of electrode portions from each other.
2. The electrostatic chuck of claim 1 , wherein at least one of the first ceramic layer and the second ceramic layer is formed from a ceramic selected from the group consisting of alumina, aluminum oxide, beryllia and zirconia.
3. The electrostatic chuck of claim 1 , wherein both the first ceramic layer and the second ceramic layer are formed from a ceramic selected from the group consisting of alumina, aluminum oxide, beryllia and zirconia.
4. The electrostatic chuck of claim 1 , wherein the metal joining layer is aluminum selected from the group consisting of aluminum greater than 89% aluminum by weight, aluminum greater than 92% aluminum by weight, aluminum greater than 99% aluminum by weight and aluminum greater than 99.99% aluminum by weight.
5. The electrostatic chuck of claim 1 , wherein the second ceramic layer has a chucking surface, the second ceramic layer overlying the metal joining layer having a thickness of less than 0.012 inch.
6. The electrostatic chuck of claim 1 , wherein the plurality of grooves extends through a portion of the second ceramic layer, wherein the dielectric material is further disposed within the portion of the second ceramic layer.