Optical module and optical transmission equipment
An optical module includes a conductor plate including a first through hole, a signal lead terminal fixed to the first through hole, and a wiring circuit board. The wiring circuit board includes a signal strip conductor member and a land on a first surface and a ground conductor layer and a second through hole on a second surface, the land surrounds the second through hole and is in contact with the signal strip conductor member, the signal lead terminal and the land are physically connected to each other through a solder and thus the signal lead terminal and the signal strip conductor member are electrically connected to each other, and at least a part of the land spreads outwardly, in a plan view, from not only a portion in contact with the signal strip conductor member but also an outer edge of the first through hole.
1. An optical module comprising:
a conductor plate including a first through hole that penetrates from an inner surface to an outer surface;
a signal lead terminal that penetrates the first through hole from the inner surface to the outer surface and protrudes from the outer surface,
the signal lead terminal being fixed to the first through hole by a first dielectric; and
a wiring circuit board comprising:
a first surface,
a second surface that faces the outer surface,
a signal strip conductor member disposed on the first surface,
a signal land disposed on the first surface,
the signal land being in contact with the signal strip conductor member, and
the signal lead terminal being electrically connected to the signal strip conductor member through the signal land,
a ground conductor layer disposed on the second surface, and
a second through hole,
the signal lead terminal penetrating the second through hole from the second surface to the first surface and protruding from the first surface,
the second through hole being surround by the signal land, and
a second dielectric being at least partially disposed between the signal lead terminal and a wall of the second through hole,
the second dielectric being different from the first dielectric.
2. The optical module of claim 1 , wherein the wiring circuit board further comprises:
an air layer at least partially between the signal lead terminal and the wall of the second through hole.
3. The optical module of claim 1 , wherein the wiring circuit board further comprises:
a protective layer that is disposed on the signal strip conductor member and at least on an outer edge of the signal land.
4. The optical module of claim 1 , wherein the wiring circuit board further comprises:
a protective layer that is disposed on the ground conductor layer and not between the wiring circuit board and the conductor plate.
5. The optical module of claim 4 , wherein the second dielectric is a material having higher flexibility than the protective layer.
6. The optical module of claim 1 , wherein the wall of the second through hole is separated from the signal lead terminal.
7. The optical module of claim 1 , wherein the conductor plate has a maximum width of 6 mm or less,
wherein the signal lead terminal has a maximum width of 0.22 mm or more and 0.35 mm or less,
wherein the first through hole has a maximum width of 0.4 mm or more and 0.85 mm or less, and
wherein the signal land has a maximum width of 0.9 mm or more in a portion other than a connection portion with the signal strip conductor member.
8. An optical transmission equipment on which the optical module of claim 1 is mounted.
9. The optical module of claim 1 , wherein the second dielectric comprises an air layer.
10. A circuit board, comprising:
a substrate having a first surface and a second surface;
a signal strip conductor member disposed on the first surface;
a signal land disposed on the first surface;
the signal land being in contact with the signal strip conductor member, and
a signal lead terminal being electrically connected to the signal strip conductor member through the signal land,
a ground conductor layer disposed on the second surface; and
a through hole,
the signal lead terminal penetrating the through hole from the second surface to the first surface and protruding from the first surface,
the through hole being surround by the signal land, and
a dielectric being at least partially disposed between the signal lead terminal and a wall of the through hole.
11. The circuit board of claim 10 , further comprising:
an air layer at least partially between the signal lead terminal and the wall of the through hole.
12. The circuit board of claim 10 , further comprising:
a protective layer that is disposed on the signal strip conductor member and at least partially on the signal land.
13. The circuit board of claim 12 , wherein the protective layer is a first layer; and
wherein the circuit board further comprises:
a second protective layer that is disposed on at least a portion of the ground conductor layer.
14. The circuit board of claim 13 , wherein the second protective layer is at least partially disposed between the ground conductor layer and a conductor plate.
15. The circuit board of claim 13 , wherein the second protective layer is at least partially disposed on the second surface of the substrate.
16. The circuit board of claim 10 , wherein a portion of the ground conductor layer is physically connected to a portion of a conductor plate.
17. The circuit board of claim 16 , wherein a portion of the dielectric is physically connected to another portion of the conductor plate.
18. The circuit board of claim 10 , wherein the dielectric is at least partially disposed between the circuit board and a conductor plate.
19. The circuit board of claim 10 , wherein the dielectric comprises an air layer.
20. The circuit board of claim 10 , wherein the dielectric is at least partially disposed between the ground conductor layer and a conductor plate.