Diode, semiconductor device, and MOSFET
Disclosed is a technique capable of reducing loss at the time of switching in a diode. A diode disclosed in the present specification includes a cathode electrode, a cathode region made of a first conductivity type semiconductor, a drift region made of a low concentration first conductivity type semiconductor, an anode region made of a second conductivity type semiconductor, an anode electrode made of metal, a barrier region formed between the drift region and the anode region and made of a first conductivity type semiconductor having a concentration higher than that of the drift region, and a pillar region formed so as to connect the barrier region to the anode electrode and made of a first conductivity type semiconductor having a concentration higher than that of the barrier region. The pillar region and the anode are connected through a Schottky junction.
1. A diode comprising:
a cathode electrode;
a cathode region made of a first conductivity type semiconductor;
a drift region made of the first conductivity type semiconductor and having an impurity concentration lower than that of the cathode region;
an anode region made of a second conductivity type semiconductor;
an anode electrode;
a barrier region formed between the drift region and the anode region, made of the first conductivity type semiconductor, and having an impurity concentration higher than that of the drift region;
a pillar electrode made of metal and formed so as to connect the barrier region to the anode electrode; and
a Schottky junction connecting the barrier region and the pillar electrode.
2. The diode according to claim 1 , further comprising an electric field progress preventing region formed between the barrier region and the drift region and made of the second conductivity type semiconductor.
3. The diode according to claim 1 , further comprising:
a trench extending from the anode region to the drift region; and
a trench electrode which is coated with an insulating and inside the trench.
4. The diode according to claim 1 , further comprising a cathode short-circuit region partially formed in the cathode region and made of the second conductivity type semiconductor.
5. A semiconductor device comprising the diode according to claim 1 and an IGBT that are integrally formed, wherein the IGBT includes:
a collector electrode;
a collector region made of the second conductivity type semiconductor;
a second drift region continuously formed from the drift region and made of the first conductivity type semiconductor;
an emitter region made of the first conductivity type semiconductor;
a body region made of the second conductivity type semiconductor, the body region being between the emitter region and the second drift region;
an emitter electrode;
an insulating film sandwiched between a gate electrode and the body region;
a second barrier region formed between the second drift region and the body region and made of the first conductivity type semiconductor having an impurity concentration higher than that of the second drift region;
a second pillar electrode made of metal and formed so as to connect the second barrier region to the emitter electrode; and
a Schottky junction connecting the second barrier region and the second pillar electrode.
6. The semiconductor device according to claim 5 , further comprising a second electric field progress preventing region formed between the second barrier region and the second drift region and made of the second conductivity type semiconductor.